GB0616024D0 - Apparatus for assembling electronic components - Google Patents

Apparatus for assembling electronic components

Info

Publication number
GB0616024D0
GB0616024D0 GBGB0616024.6A GB0616024A GB0616024D0 GB 0616024 D0 GB0616024 D0 GB 0616024D0 GB 0616024 A GB0616024 A GB 0616024A GB 0616024 D0 GB0616024 D0 GB 0616024D0
Authority
GB
United Kingdom
Prior art keywords
electronic components
assembling electronic
assembling
components
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB0616024.6A
Other versions
GB2440971A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefonaktiebolaget LM Ericsson AB
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Priority to GB0616024A priority Critical patent/GB2440971A/en
Publication of GB0616024D0 publication Critical patent/GB0616024D0/en
Publication of GB2440971A publication Critical patent/GB2440971A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
GB0616024A 2006-08-14 2006-08-14 Soldering oven Withdrawn GB2440971A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0616024A GB2440971A (en) 2006-08-14 2006-08-14 Soldering oven

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0616024A GB2440971A (en) 2006-08-14 2006-08-14 Soldering oven

Publications (2)

Publication Number Publication Date
GB0616024D0 true GB0616024D0 (en) 2006-09-20
GB2440971A GB2440971A (en) 2008-02-20

Family

ID=37056235

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0616024A Withdrawn GB2440971A (en) 2006-08-14 2006-08-14 Soldering oven

Country Status (1)

Country Link
GB (1) GB2440971A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103317203A (en) * 2013-06-20 2013-09-25 成都九洲迪飞科技有限责任公司 Welding technology for microwave substrate

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2618606B1 (en) * 1987-07-24 1990-02-16 Thomson Composants Militaires INTEGRATED CIRCUIT CHIP WELDING OVEN
US5456402A (en) * 1994-04-04 1995-10-10 Transition Automation, Inc. Flexible fixture for SMT board
JPH08162747A (en) * 1994-12-08 1996-06-21 Matsushita Electric Ind Co Ltd Method and apparatus for reflow soldering
JP2000196232A (en) * 1998-12-28 2000-07-14 Optrex Corp Soldering method and soldering device
GB9907773D0 (en) * 1999-04-07 1999-06-02 Pace Micro Tech Plc Product holding device
JP5063845B2 (en) * 2001-09-07 2012-10-31 臼井国際産業株式会社 Work heat treatment jig
JP2006093218A (en) * 2004-09-21 2006-04-06 Sharp Corp Lamp heating device and manufacturing method of semiconductor device

Also Published As

Publication number Publication date
GB2440971A (en) 2008-02-20

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)