GB0609702D0 - Device comprising a plastics component and a light-emitiing diode - Google Patents

Device comprising a plastics component and a light-emitiing diode

Info

Publication number
GB0609702D0
GB0609702D0 GBGB0609702.6A GB0609702A GB0609702D0 GB 0609702 D0 GB0609702 D0 GB 0609702D0 GB 0609702 A GB0609702 A GB 0609702A GB 0609702 D0 GB0609702 D0 GB 0609702D0
Authority
GB
United Kingdom
Prior art keywords
emitiing
diode
light
plastics component
plastics
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GBGB0609702.6A
Other versions
GB2426378B (en
GB2426378A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of GB0609702D0 publication Critical patent/GB0609702D0/en
Publication of GB2426378A publication Critical patent/GB2426378A/en
Application granted granted Critical
Publication of GB2426378B publication Critical patent/GB2426378B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25F—COMBINATION OR MULTI-PURPOSE TOOLS NOT OTHERWISE PROVIDED FOR; DETAILS OR COMPONENTS OF PORTABLE POWER-DRIVEN TOOLS NOT PARTICULARLY RELATED TO THE OPERATIONS PERFORMED AND NOT OTHERWISE PROVIDED FOR
    • B25F5/00—Details or components of portable power-driven tools not particularly related to the operations performed and not otherwise provided for
    • B25F5/02—Construction of casings, bodies or handles
    • B25F5/021—Construction of casings, bodies or handles with guiding devices
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0018—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular optical properties, e.g. fluorescent or phosphorescent
    • B29K2995/0026—Transparent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/28—Tools, e.g. cutlery
    • B29L2031/283—Hand tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/747—Lightning equipment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
GB0609702A 2005-05-17 2006-05-16 Device comprsing a plastics component and a light-emitting diode Expired - Fee Related GB2426378B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005022667 2005-05-17
DE102005041490A DE102005041490A1 (en) 2005-05-17 2005-09-01 Device with a plastic component and with a light emitting diode

Publications (3)

Publication Number Publication Date
GB0609702D0 true GB0609702D0 (en) 2006-06-28
GB2426378A GB2426378A (en) 2006-11-22
GB2426378B GB2426378B (en) 2008-09-17

Family

ID=36660260

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0609702A Expired - Fee Related GB2426378B (en) 2005-05-17 2006-05-16 Device comprsing a plastics component and a light-emitting diode

Country Status (2)

Country Link
DE (1) DE102005041490A1 (en)
GB (1) GB2426378B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007023958A1 (en) * 2007-05-23 2008-11-27 Hella Kgaa Hueck & Co. Signal light i.e. side marker light, for motor vehicle, has border foils extending to flat sides of illumination element layer such that illumination element layer is connected by injection molding with carrier and cover disk
AT506005B1 (en) 2007-10-25 2011-06-15 Schoenberg Elumic Gmbh ILLUMINATED OBJECT
DE102008009808A1 (en) * 2008-02-19 2009-08-27 Lighting Innovation Group Ag LED-light strip, has casting compound presented as contoured casting compound, where process of electromagnetic shaft is determined by contoured casting compound, and LED air-tightly locked by compound compared to substrate or plate
EA016897B1 (en) * 2009-06-04 2012-08-30 Владимир Федорович Солинов Led information module
CN103133986A (en) * 2011-11-28 2013-06-05 于雄青 Integrated forming resin shiner and forming process
AT13894U1 (en) * 2013-04-03 2014-11-15 Tridonic Gmbh & Co Kg LED chain
CN103386855B (en) * 2013-04-23 2016-12-28 上海色源实业有限公司 A kind of star and manufacture method thereof
DE102014201436A1 (en) * 2014-01-27 2015-07-30 Robert Bosch Gmbh Hand tool
CN104842511B (en) * 2015-05-08 2017-04-26 东莞市凯昶德电子科技股份有限公司 LED (Light Emitting Diode) support injection moulding die and method
DE102017203287A1 (en) * 2017-03-01 2018-09-06 Robert Bosch Gmbh Base plate with integrated workpiece lighting

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10293540A (en) * 1997-04-18 1998-11-04 Sony Corp Display device
US6739733B1 (en) * 2000-03-09 2004-05-25 N.I.R., Inc. LED lamp assembly
US6482346B1 (en) * 2000-11-21 2002-11-19 Ross Alcazar Method for manufacturing an in-mold display
DE10163116B4 (en) * 2001-12-24 2008-04-10 G.L.I. Global Light Industries Gmbh Method for producing light-conducting LED bodies in two spatially and temporally separate stages
WO2004059366A1 (en) * 2002-12-26 2004-07-15 Sanyo Electric Co., Ltd. Illuminating device and porjection type image display unit
DE10337260A1 (en) * 2003-08-18 2005-03-10 Bosch Gmbh Robert Operating module for a power tool
DE10346452A1 (en) * 2003-10-03 2005-04-28 Schefenacker Vision Systems Luminous element with insertion light guide body

Also Published As

Publication number Publication date
GB2426378B (en) 2008-09-17
GB2426378A (en) 2006-11-22
DE102005041490A1 (en) 2006-11-23

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20180516