GB0604274D0 - Chuck - Google Patents

Chuck

Info

Publication number
GB0604274D0
GB0604274D0 GBGB0604274.1A GB0604274A GB0604274D0 GB 0604274 D0 GB0604274 D0 GB 0604274D0 GB 0604274 A GB0604274 A GB 0604274A GB 0604274 D0 GB0604274 D0 GB 0604274D0
Authority
GB
United Kingdom
Prior art keywords
chuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB0604274.1A
Other versions
GB2435719A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BAROTEC CO. LTD.,
SM-TECH
Original Assignee
MANN DARRELL L
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MANN DARRELL L filed Critical MANN DARRELL L
Priority to GB0604274A priority Critical patent/GB2435719A/en
Publication of GB0604274D0 publication Critical patent/GB0604274D0/en
Priority to KR1020070021088A priority patent/KR20070090839A/en
Publication of GB2435719A publication Critical patent/GB2435719A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
GB0604274A 2006-03-03 2006-03-03 Gripping device with a multitude of small fibres using van der Waals forces Withdrawn GB2435719A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB0604274A GB2435719A (en) 2006-03-03 2006-03-03 Gripping device with a multitude of small fibres using van der Waals forces
KR1020070021088A KR20070090839A (en) 2006-03-03 2007-03-02 Chuck

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0604274A GB2435719A (en) 2006-03-03 2006-03-03 Gripping device with a multitude of small fibres using van der Waals forces

Publications (2)

Publication Number Publication Date
GB0604274D0 true GB0604274D0 (en) 2006-04-12
GB2435719A GB2435719A (en) 2007-09-05

Family

ID=36219057

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0604274A Withdrawn GB2435719A (en) 2006-03-03 2006-03-03 Gripping device with a multitude of small fibres using van der Waals forces

Country Status (2)

Country Link
KR (1) KR20070090839A (en)
GB (1) GB2435719A (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100864732B1 (en) * 2007-03-21 2008-10-23 (주)바로텍 chuck using nano-scale cilium, fabricating method and chucking/de-chucking method for the same
KR100859765B1 (en) * 2007-08-23 2008-09-24 엔티엠 주식회사 Apparatus for processing substrate of flat panel display
KR100914529B1 (en) * 2007-09-28 2009-09-02 세메스 주식회사 Apparatus for chucking substrate
KR20110091197A (en) * 2010-02-05 2011-08-11 서울대학교산학협력단 Upward-type fabrication method of structure using adhesion system with fine ciliary and fabrication apparatus using the same
DE102013105803A1 (en) * 2013-06-05 2014-08-07 Cascade Microtech, Inc. Carrier for supporting semiconductor substrate, used for chuck in prober for testing test substrate, has control device which reduces adhesion of micro-structured surface formed in support surface for supporting substrate
US10499704B2 (en) 2013-09-18 2019-12-10 Nike, Inc. Sole for an article of footwear having regionally varied Auxetic structures
US9698035B2 (en) * 2013-12-23 2017-07-04 Lam Research Corporation Microstructures for improved wafer handling
DE202016100186U1 (en) 2015-01-15 2016-02-01 Fhr Anlagenbau Gmbh substrate holder
EP3275008B1 (en) 2015-03-25 2022-02-23 Applied Materials, Inc. Chamber components for epitaxial growth apparatus
WO2016174565A1 (en) * 2015-04-26 2016-11-03 Frumkin Ted Greg Lee Gecko carrier
CN108474109B (en) 2016-01-13 2021-08-03 应用材料公司 Holding arrangement for holding a substrate, carrier for supporting a substrate, deposition system, method for holding a substrate and method for releasing a substrate
KR20200133031A (en) * 2016-11-07 2020-11-25 어플라이드 머티어리얼스, 인코포레이티드 Carrier for holding a substrate, use of the carrier in a processing system, processing system employing the carrier, and method for controlling a temperature of a substrate
CN107790721B (en) * 2017-10-24 2019-07-12 西北有色金属研究院 A kind of preparation process of 316L stainless steel fibre sintering felt
WO2019096426A1 (en) * 2017-11-20 2019-05-23 Applied Materials, Inc. Substrate process arrangement and method for holding a substrate
KR102150279B1 (en) * 2020-02-10 2020-09-01 건호이엔씨(주) jig for coupling flanges of pipes

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7132161B2 (en) * 1999-06-14 2006-11-07 Energy Science Laboratories, Inc. Fiber adhesive material
US6722026B1 (en) * 2001-09-25 2004-04-20 Kla-Tencor Corporation Apparatus and method for removably adhering a semiconductor substrate to a substrate support
US7335271B2 (en) * 2002-01-02 2008-02-26 Lewis & Clark College Adhesive microstructure and method of forming same
US6872439B2 (en) * 2002-05-13 2005-03-29 The Regents Of The University Of California Adhesive microstructure and method of forming same
DE10223234B4 (en) * 2002-05-24 2005-02-03 MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. Process for the preparation of microstructured surfaces with increased adhesion and adhesion-enhancing modified surfaces
US7074294B2 (en) * 2003-04-17 2006-07-11 Nanosys, Inc. Structures, systems and methods for joining articles and materials and uses therefor
DE10325372B3 (en) * 2003-05-27 2004-10-21 Gottlieb Binder Gmbh & Co. Kg Production of an adhesion closure part for diapers or hospital clothing comprises providing a support with a number of stalks connected to it

Also Published As

Publication number Publication date
GB2435719A (en) 2007-09-05
KR20070090839A (en) 2007-09-06

Similar Documents

Publication Publication Date Title
GB0601803D0 (en) Tool
DE602007002700D1 (en) Interventionsfreies frac-system
DE602007008085D1 (en) Dihydropyrazolopyrimidinonderivate
DE602007014031D1 (en) Luftreifensatz
GB2428609B (en) Chuck
GB0604274D0 (en) Chuck
DE602007003855D1 (en) Isothermer reaktor
EP1983992A4 (en) 2-imino-benzimidazoles
GB2441023B (en) Locking chuck
DE602007001601D1 (en) Glasuntersuchung
GB2441659B (en) Electrostatic chuck
DE602007006989D1 (en) Spiropiperidinderivate
AP2008004724A0 (en) Substituted1-yl)-azolin-2-aryl-1-hetaryl-ethane
DE602007011622D1 (en) Penem-prodrugs
GB2442972B8 (en) Connection tool
EP2024567A4 (en) Earthen-wallpaper
EP2007388A4 (en) Opiopathies
GB0600057D0 (en) Workbench
DK1989111T3 (en) Satellitluftbremseapparat
EP1974618A4 (en) Innerwear
GB0607597D0 (en) Griphub Tool
DE502007001126D1 (en) Eiten
AU3514P (en) ARCBENT Arctotis fastuosa
AU4914P (en) CalflatGL Calothamnus quadrifidus
GB0623184D0 (en) Chanfer tool

Legal Events

Date Code Title Description
COOA Change in applicant's name or ownership of the application

Owner name: BAROTEC CO. LTD.,

Free format text: FORMER APPLICANT(S): MANN, DARRELL L

Owner name: SM-TECH

Free format text: FORMER APPLICANT(S): MANN, DARRELL L

WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)