GB0518105D0 - Step-and-repeat laser ablation of electronic devices - Google Patents

Step-and-repeat laser ablation of electronic devices

Info

Publication number
GB0518105D0
GB0518105D0 GBGB0518105.2A GB0518105A GB0518105D0 GB 0518105 D0 GB0518105 D0 GB 0518105D0 GB 0518105 A GB0518105 A GB 0518105A GB 0518105 D0 GB0518105 D0 GB 0518105D0
Authority
GB
United Kingdom
Prior art keywords
electronic devices
laser ablation
repeat laser
repeat
ablation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB0518105.2A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Plastic Logic Ltd
Original Assignee
Plastic Logic Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plastic Logic Ltd filed Critical Plastic Logic Ltd
Priority to GBGB0518105.2A priority Critical patent/GB0518105D0/en
Publication of GB0518105D0 publication Critical patent/GB0518105D0/en
Priority to GBGB0523141.0A priority patent/GB0523141D0/en
Priority to JP2008529697A priority patent/JP5185118B2/en
Priority to US14/260,240 priority patent/USRE45885E1/en
Priority to US12/065,722 priority patent/US8062984B2/en
Priority to EP06779619.3A priority patent/EP1922775B1/en
Priority to PCT/GB2006/050265 priority patent/WO2007029028A1/en
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/621—Providing a shape to conductive layers, e.g. patterning or selective deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thin Film Transistor (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Lasers (AREA)
GBGB0518105.2A 2005-06-01 2005-09-06 Step-and-repeat laser ablation of electronic devices Ceased GB0518105D0 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
GBGB0518105.2A GB0518105D0 (en) 2005-09-06 2005-09-06 Step-and-repeat laser ablation of electronic devices
GBGB0523141.0A GB0523141D0 (en) 2005-09-06 2005-11-14 Laser ablation of electronic devices
JP2008529697A JP5185118B2 (en) 2005-09-06 2006-08-31 Laser ablation of electronic devices
US14/260,240 USRE45885E1 (en) 2005-06-01 2006-08-31 Laser ablation of electronic devices
US12/065,722 US8062984B2 (en) 2005-09-06 2006-08-31 Laser ablation of electronic devices
EP06779619.3A EP1922775B1 (en) 2005-09-06 2006-08-31 Laser ablation of electronic devices
PCT/GB2006/050265 WO2007029028A1 (en) 2005-09-06 2006-08-31 Laser ablation of electronic devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0518105.2A GB0518105D0 (en) 2005-09-06 2005-09-06 Step-and-repeat laser ablation of electronic devices

Publications (1)

Publication Number Publication Date
GB0518105D0 true GB0518105D0 (en) 2005-10-12

Family

ID=35220929

Family Applications (2)

Application Number Title Priority Date Filing Date
GBGB0518105.2A Ceased GB0518105D0 (en) 2005-06-01 2005-09-06 Step-and-repeat laser ablation of electronic devices
GBGB0523141.0A Ceased GB0523141D0 (en) 2005-06-01 2005-11-14 Laser ablation of electronic devices

Family Applications After (1)

Application Number Title Priority Date Filing Date
GBGB0523141.0A Ceased GB0523141D0 (en) 2005-06-01 2005-11-14 Laser ablation of electronic devices

Country Status (3)

Country Link
US (1) US8062984B2 (en)
JP (1) JP5185118B2 (en)
GB (2) GB0518105D0 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100700654B1 (en) 2005-02-22 2007-03-27 삼성에스디아이 주식회사 Laser Irradiation Device and Laser Induced Thermal Imaging
CA2628100C (en) 2005-11-02 2016-08-23 Visualsonics Inc. High frequency array ultrasound system
US9173047B2 (en) 2008-09-18 2015-10-27 Fujifilm Sonosite, Inc. Methods for manufacturing ultrasound transducers and other components
EP3576137A1 (en) 2008-09-18 2019-12-04 FUJIFILM SonoSite, Inc. Ultrasound transducers
US9184369B2 (en) 2008-09-18 2015-11-10 Fujifilm Sonosite, Inc. Methods for manufacturing ultrasound transducers and other components
US8187795B2 (en) * 2008-12-09 2012-05-29 The Board Of Trustees Of The University Of Illinois Patterning methods for stretchable structures
US8809733B2 (en) * 2009-10-16 2014-08-19 Apple Inc. Sub-surface marking of product housings
KR102107871B1 (en) 2013-02-18 2020-05-08 오르보테크 엘티디. Two-step, direct-write laser metallization
US10622244B2 (en) 2013-02-18 2020-04-14 Orbotech Ltd. Pulsed-mode direct-write laser metallization
US20220406601A1 (en) * 2021-06-16 2022-12-22 Monolithic Power Systems, Inc. Laser induced semiconductor wafer patterning

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2864915B2 (en) 1992-12-07 1999-03-08 株式会社日立製作所 Method for manufacturing semiconductor device
US5446521A (en) 1993-06-30 1995-08-29 Intel Corporation Phase-shifted opaquing ring
KR19990007929A (en) * 1995-04-26 1999-01-25 데이빗로스클리블랜드 Multi-faced repeated exposure method and apparatus
JP3197484B2 (en) 1995-05-31 2001-08-13 シャープ株式会社 Photomask and method of manufacturing the same
KR100627210B1 (en) 1995-08-04 2006-12-01 다이니폰 인사츠 가부시키가이샤 Phase Shift Mask
JP3402921B2 (en) * 1996-04-26 2003-05-06 三洋電機株式会社 Method for removing metal film, method for manufacturing solar cell, and solar cell
EP0968537B1 (en) 1997-08-22 2012-05-02 Creator Technology B.V. A method of manufacturing a field-effect transistor substantially consisting of organic materials
JPH11320166A (en) * 1998-05-21 1999-11-24 Ricoh Microelectronics Co Ltd Light processing device
US6207472B1 (en) * 1999-03-09 2001-03-27 International Business Machines Corporation Low temperature thin film transistor fabrication
US6719916B2 (en) * 2001-04-18 2004-04-13 National Research Council Of Canada Multilayer microstructures and laser based method for precision and reduced damage patterning of such structures
JP2003258256A (en) * 2002-02-27 2003-09-12 Konica Corp Organic tft device and its manufacturing method
JP2004165068A (en) * 2002-11-14 2004-06-10 Sanyo Electric Co Ltd Manufacturing method of organic electroluminescent panel
GB0300105D0 (en) 2003-01-03 2003-02-05 Cambridge Display Tech Ltd Ablation methods & apparatus
JP4389447B2 (en) * 2003-01-28 2009-12-24 セイコーエプソン株式会社 Manufacturing method of electro-optical device
US6927108B2 (en) * 2003-07-09 2005-08-09 Hewlett-Packard Development Company, L.P. Solution-processed thin film transistor formation method
GB0426126D0 (en) 2004-11-29 2004-12-29 Plastic Logic Ltd Distortion compensation for multiple head printing
GB0511132D0 (en) 2005-06-01 2005-07-06 Plastic Logic Ltd Layer-selective laser ablation patterning

Also Published As

Publication number Publication date
JP5185118B2 (en) 2013-04-17
US8062984B2 (en) 2011-11-22
JP2009507388A (en) 2009-02-19
GB0523141D0 (en) 2005-12-21
US20090298299A1 (en) 2009-12-03

Similar Documents

Publication Publication Date Title
GB0518105D0 (en) Step-and-repeat laser ablation of electronic devices
GB0502583D0 (en) Laser circuit
DE602006021391D1 (en) ELECTRONIC ENDOSCOPE
GB0611325D0 (en) Laser marking
BRPI0619079A2 (en) electronic equipment
EP1920708A4 (en) Electronic endoscope
ZA200802585B (en) Pyridopyrimidinone inhibitors of Pl3Kα
IL190292A0 (en) PYRIDOPYRIMIDINONE INHIBITORS OF P13Ka
EP1878007A4 (en) Operating method of music composing device
EP1852270A4 (en) Laminate for laser marking
EP1956993A4 (en) Precision ablating device
EP1852269A4 (en) Laminate for laser marking
EP1883357A4 (en) Laser-resistant surgical devices
GB0713811D0 (en) Laser drilling components
GB2437708B (en) Myringotomy instrument
EP1937192A4 (en) An orthosis
GB0525449D0 (en) Forming Electronic Devices
GB0608052D0 (en) Q-modulated semiconductor laser
GB0603866D0 (en) Medical laser device
ITUD20050157A1 (en) WEARABLE ELECTRONIC EQUIPMENT
EP2034597A4 (en) Self-excited oscillation circuit
GB0611843D0 (en) Laser device
GB2426574B (en) Laser micrometer
GB2422568B (en) Hole puncher
PL1710760T3 (en) Secured activation of devices

Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)