GB0513245D0 - Ablations methods and apparatus - Google Patents

Ablations methods and apparatus

Info

Publication number
GB0513245D0
GB0513245D0 GBGB0513245.1A GB0513245A GB0513245D0 GB 0513245 D0 GB0513245 D0 GB 0513245D0 GB 0513245 A GB0513245 A GB 0513245A GB 0513245 D0 GB0513245 D0 GB 0513245D0
Authority
GB
United Kingdom
Prior art keywords
ablations
methods
ablations methods
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GBGB0513245.1A
Other versions
GB2415090B (en
GB2415090A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cambridge Display Technology Ltd
Original Assignee
Cambridge Display Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cambridge Display Technology Ltd filed Critical Cambridge Display Technology Ltd
Publication of GB0513245D0 publication Critical patent/GB0513245D0/en
Publication of GB2415090A publication Critical patent/GB2415090A/en
Application granted granted Critical
Publication of GB2415090B publication Critical patent/GB2415090B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Laser Beam Processing (AREA)
  • Electroluminescent Light Sources (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
GB0513245A 2003-01-03 2003-12-18 Ablation methods and apparatus Expired - Fee Related GB2415090B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB0300105.4A GB0300105D0 (en) 2003-01-03 2003-01-03 Ablation methods & apparatus
PCT/GB2003/005546 WO2004060600A2 (en) 2003-01-03 2003-12-18 Ablation methods and apparatus

Publications (3)

Publication Number Publication Date
GB0513245D0 true GB0513245D0 (en) 2005-08-03
GB2415090A GB2415090A (en) 2005-12-14
GB2415090B GB2415090B (en) 2006-06-07

Family

ID=9950643

Family Applications (2)

Application Number Title Priority Date Filing Date
GBGB0300105.4A Ceased GB0300105D0 (en) 2003-01-03 2003-01-03 Ablation methods & apparatus
GB0513245A Expired - Fee Related GB2415090B (en) 2003-01-03 2003-12-18 Ablation methods and apparatus

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GBGB0300105.4A Ceased GB0300105D0 (en) 2003-01-03 2003-01-03 Ablation methods & apparatus

Country Status (3)

Country Link
AU (1) AU2003290283A1 (en)
GB (2) GB0300105D0 (en)
WO (1) WO2004060600A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2313806B1 (en) * 2004-12-30 2009-12-17 Universidad De Granada LASER CALIBRATION PROCEDURE CONSIDERING PULSE SOLUTION.
WO2007029028A1 (en) * 2005-09-06 2007-03-15 Plastic Logic Limited Laser ablation of electronic devices
GB0518105D0 (en) * 2005-09-06 2005-10-12 Plastic Logic Ltd Step-and-repeat laser ablation of electronic devices
GB0511132D0 (en) 2005-06-01 2005-07-06 Plastic Logic Ltd Layer-selective laser ablation patterning
WO2012037468A1 (en) * 2010-09-16 2012-03-22 Raydiance, Inc. Singulation of layered materials using selectively variable laser output
US10363586B2 (en) * 2017-01-03 2019-07-30 The Boeing Company Large-area selective ablation methods
US10744539B2 (en) 2017-10-27 2020-08-18 The Boeing Company Optimized-coverage selective laser ablation systems and methods

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4539507A (en) * 1983-03-25 1985-09-03 Eastman Kodak Company Organic electroluminescent devices having improved power conversion efficiencies
GB8909011D0 (en) * 1989-04-20 1989-06-07 Friend Richard H Electroluminescent devices
GB9317932D0 (en) * 1993-08-26 1993-10-13 Cambridge Display Tech Ltd Electroluminescent devices
JPH08235517A (en) * 1994-05-10 1996-09-13 Mitsubishi Electric Corp Magnetic head and its production
GB9805476D0 (en) * 1998-03-13 1998-05-13 Cambridge Display Tech Ltd Electroluminescent devices
DE19919009B4 (en) * 1999-04-27 2005-03-03 Institut für Oberflächenmodifizierung e.V. Mask and its application in laser ablation
GB9928014D0 (en) * 1999-11-26 2000-01-26 Cambridge Display Tech Ltd Method of producing an organic light-emissive device
WO2001074529A2 (en) * 2000-03-30 2001-10-11 Electro Scientific Industries, Inc. Laser system and method for single pass micromachining of multilayer workpieces

Also Published As

Publication number Publication date
AU2003290283A1 (en) 2004-07-29
AU2003290283A8 (en) 2004-07-29
GB2415090B (en) 2006-06-07
GB2415090A (en) 2005-12-14
WO2004060600A2 (en) 2004-07-22
GB0300105D0 (en) 2003-02-05
WO2004060600A3 (en) 2007-11-15

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20141218