GB0422002D0 - Apparatus for selective soldering - Google Patents

Apparatus for selective soldering

Info

Publication number
GB0422002D0
GB0422002D0 GBGB0422002.6A GB0422002A GB0422002D0 GB 0422002 D0 GB0422002 D0 GB 0422002D0 GB 0422002 A GB0422002 A GB 0422002A GB 0422002 D0 GB0422002 D0 GB 0422002D0
Authority
GB
United Kingdom
Prior art keywords
selective soldering
soldering
selective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GBGB0422002.6A
Other versions
GB2418881B (en
GB2418881A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vitronics Soltec BV
Original Assignee
Vitronics Soltec BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vitronics Soltec BV filed Critical Vitronics Soltec BV
Publication of GB0422002D0 publication Critical patent/GB0422002D0/en
Publication of GB2418881A publication Critical patent/GB2418881A/en
Application granted granted Critical
Publication of GB2418881B publication Critical patent/GB2418881B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/086—Using an inert gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
GB0422002A 2003-10-07 2004-10-05 Apparatus for selective soldering Active GB2418881B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL1024476A NL1024476C2 (en) 2003-10-07 2003-10-07 Device for selective soldering of components on a print plate with classical connecting wires includes means to blow oxygen on solder to make sure its flow in correct direction to prevent formation of bridges between connecting wires

Publications (3)

Publication Number Publication Date
GB0422002D0 true GB0422002D0 (en) 2004-11-03
GB2418881A GB2418881A (en) 2006-04-12
GB2418881B GB2418881B (en) 2008-04-09

Family

ID=33432540

Family Applications (2)

Application Number Title Priority Date Filing Date
GB0422002A Active GB2418881B (en) 2003-10-07 2004-10-05 Apparatus for selective soldering
GBGB0422186.7A Pending GB0422186D0 (en) 2003-10-07 2004-10-07 Apparatus for selective soldering

Family Applications After (1)

Application Number Title Priority Date Filing Date
GBGB0422186.7A Pending GB0422186D0 (en) 2003-10-07 2004-10-07 Apparatus for selective soldering

Country Status (2)

Country Link
GB (2) GB2418881B (en)
NL (1) NL1024476C2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6313423B2 (en) * 2014-02-28 2018-04-18 株式会社Ｆｕｊｉ Viscous fluid adhesion device
DE102014110720A1 (en) * 2014-07-29 2016-02-04 Illinois Tool Works Inc. soldering module
CN105345208B (en) * 2015-12-18 2019-05-31 东莞市合易自动化科技有限公司 A kind of tin jet device with blow structure
EP3936271A1 (en) * 2020-07-08 2022-01-12 Illinois Tool Works, Inc. Soldering nozzle, system and use

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3092059A (en) * 1958-01-20 1963-06-04 Motorola Inc Assembly apparatus
GB1110892A (en) * 1965-04-28 1968-04-24 British Aircraft Corp Ltd Improvements relating to wave soldering
US3705457A (en) * 1970-11-02 1972-12-12 Electrovert Mfg Co Ltd Wave soldering using inert gas to protect pretinned and soldered surfaces of relatively flat workpieces
GB2008013B (en) * 1977-08-31 1982-01-20 Frys Metals Ltd Wace soldering machines
US4824010A (en) * 1980-12-26 1989-04-25 Matsushita Electric Industrial Co., Ltd. Process and apparatus for soldering printed circuit boards
US4934309A (en) * 1988-04-15 1990-06-19 International Business Machines Corporation Solder deposition system
US5292055A (en) * 1991-12-06 1994-03-08 Electrovert Ltd. Gas shrouded wave improvement
DE19807696C2 (en) * 1998-02-24 2001-09-06 Manfred Fehrenbach Dip soldering process
GB2360237B (en) * 2000-03-16 2003-09-03 Evenoak Ltd Nozzle for soldering apparatus

Also Published As

Publication number Publication date
GB2418881B (en) 2008-04-09
NL1024476C2 (en) 2005-04-08
GB0422186D0 (en) 2004-11-03
GB2418881A (en) 2006-04-12

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