GB0415434D0 - Two stage radiation thermoelectric cooling apparatus - Google Patents

Two stage radiation thermoelectric cooling apparatus

Info

Publication number
GB0415434D0
GB0415434D0 GBGB0415434.0A GB0415434A GB0415434D0 GB 0415434 D0 GB0415434 D0 GB 0415434D0 GB 0415434 A GB0415434 A GB 0415434A GB 0415434 D0 GB0415434 D0 GB 0415434D0
Authority
GB
United Kingdom
Prior art keywords
cooling apparatus
thermoelectric cooling
stage radiation
radiation thermoelectric
stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GBGB0415434.0A
Other versions
GB2416243A (en
GB2416243B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Giga Byte Technology Co Ltd
Original Assignee
Giga Byte Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giga Byte Technology Co Ltd filed Critical Giga Byte Technology Co Ltd
Priority to GB0415434A priority Critical patent/GB2416243B/en
Publication of GB0415434D0 publication Critical patent/GB0415434D0/en
Publication of GB2416243A publication Critical patent/GB2416243A/en
Application granted granted Critical
Publication of GB2416243B publication Critical patent/GB2416243B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B25/00—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00
    • F25B25/005—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00 using primary and secondary systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L35/30—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
GB0415434A 2004-07-09 2004-07-09 Two stage radiation thermoelectric cooling apparatus Expired - Fee Related GB2416243B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0415434A GB2416243B (en) 2004-07-09 2004-07-09 Two stage radiation thermoelectric cooling apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0415434A GB2416243B (en) 2004-07-09 2004-07-09 Two stage radiation thermoelectric cooling apparatus

Publications (3)

Publication Number Publication Date
GB0415434D0 true GB0415434D0 (en) 2004-08-11
GB2416243A GB2416243A (en) 2006-01-18
GB2416243B GB2416243B (en) 2006-05-24

Family

ID=32865739

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0415434A Expired - Fee Related GB2416243B (en) 2004-07-09 2004-07-09 Two stage radiation thermoelectric cooling apparatus

Country Status (1)

Country Link
GB (1) GB2416243B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8453467B2 (en) * 2006-10-13 2013-06-04 Dell Products, Lp Hybrid heat exchanger
TWI663903B (en) * 2015-12-30 2019-06-21 微星科技股份有限公司 Thermoelectric cooling module and heat dissipation apparatus including the same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5457342A (en) * 1994-03-30 1995-10-10 Herbst, Ii; Gerhardt G. Integrated circuit cooling apparatus
US6997241B2 (en) * 2001-01-13 2006-02-14 Enertron, Inc. Phase-change heat reservoir device for transient thermal management
US6415612B1 (en) * 2001-06-29 2002-07-09 Intel Corporation Method and apparatus for external cooling an electronic component of a mobile hardware product, particularly a notebook computer, at a docking station having a thermoelectric cooler
DE20302732U1 (en) * 2003-02-20 2003-04-24 Chen Wilson Cooling system for a CPU has a metal heat sink with a coupled contact plate for the CPU
US6798659B2 (en) * 2003-02-21 2004-09-28 Wilson Chen CPU cooling structure

Also Published As

Publication number Publication date
GB2416243A (en) 2006-01-18
GB2416243B (en) 2006-05-24

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20140709