GB0405844D0 - "Microelectronic and optoelectronic device packaging" - Google Patents

"Microelectronic and optoelectronic device packaging"

Info

Publication number
GB0405844D0
GB0405844D0 GBGB0405844.2A GB0405844A GB0405844D0 GB 0405844 D0 GB0405844 D0 GB 0405844D0 GB 0405844 A GB0405844 A GB 0405844A GB 0405844 D0 GB0405844 D0 GB 0405844D0
Authority
GB
United Kingdom
Prior art keywords
microelectronic
optoelectronic device
device packaging
packaging
optoelectronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB0405844.2A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ADVANCED MICROPACKAGING TECHNO
Original Assignee
ADVANCED MICROPACKAGING TECHNO
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ADVANCED MICROPACKAGING TECHNO filed Critical ADVANCED MICROPACKAGING TECHNO
Priority to GBGB0405844.2A priority Critical patent/GB0405844D0/en
Publication of GB0405844D0 publication Critical patent/GB0405844D0/en
Priority to PCT/GB2005/000654 priority patent/WO2005091352A1/en
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00333—Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4245—Mounting of the opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4251—Sealed packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/03—Processes for manufacturing substrate-free structures
    • B81C2201/034—Moulding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
GBGB0405844.2A 2004-03-16 2004-03-16 "Microelectronic and optoelectronic device packaging" Ceased GB0405844D0 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GBGB0405844.2A GB0405844D0 (en) 2004-03-16 2004-03-16 "Microelectronic and optoelectronic device packaging"
PCT/GB2005/000654 WO2005091352A1 (en) 2004-03-16 2005-02-22 Packaging of microelectronic, optoelectronic and other devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0405844.2A GB0405844D0 (en) 2004-03-16 2004-03-16 "Microelectronic and optoelectronic device packaging"

Publications (1)

Publication Number Publication Date
GB0405844D0 true GB0405844D0 (en) 2004-04-21

Family

ID=32117750

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB0405844.2A Ceased GB0405844D0 (en) 2004-03-16 2004-03-16 "Microelectronic and optoelectronic device packaging"

Country Status (2)

Country Link
GB (1) GB0405844D0 (en)
WO (1) WO2005091352A1 (en)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0314245A (en) * 1989-06-13 1991-01-22 Toshiba Corp Resin-sealing method for semiconductor device
JP2994171B2 (en) * 1993-05-11 1999-12-27 株式会社東芝 Method for manufacturing semiconductor device and method for manufacturing sealing member
JPH11105474A (en) * 1997-10-03 1999-04-20 Tsutsunaka Plast Ind Co Ltd Non-contact type ic card and its manufacture
FR2793054B1 (en) * 1999-04-29 2001-06-29 Schlumberger Systems & Service METHOD FOR MANUFACTURING CONTACTLESS CARDS BY LAMINATION AND CONTACTLESS CARD MANUFACTURED ACCORDING TO SUCH A PROCESS

Also Published As

Publication number Publication date
WO2005091352A1 (en) 2005-09-29

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)