GB0302483D0 - Improvements in or relating to an electrical device - Google Patents

Improvements in or relating to an electrical device

Info

Publication number
GB0302483D0
GB0302483D0 GBGB0302483.3A GB0302483A GB0302483D0 GB 0302483 D0 GB0302483 D0 GB 0302483D0 GB 0302483 A GB0302483 A GB 0302483A GB 0302483 D0 GB0302483 D0 GB 0302483D0
Authority
GB
United Kingdom
Prior art keywords
relating
electrical device
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB0302483.3A
Other versions
GB2398181A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TRANSPARENT ENGINEERING Ltd
Original Assignee
TRANSPARENT ENGINEERING Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TRANSPARENT ENGINEERING Ltd filed Critical TRANSPARENT ENGINEERING Ltd
Priority to GB0302483A priority Critical patent/GB2398181A/en
Publication of GB0302483D0 publication Critical patent/GB0302483D0/en
Publication of GB2398181A publication Critical patent/GB2398181A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/08—Cooling; Ventilating
    • H01F27/22—Cooling by heat conduction through solid or powdered fillings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H05K7/14329—Housings specially adapted for power drive units or power converters specially adapted for the configuration of power bus bars
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/02—Casings
    • H01F27/04—Leading of conductors or axles through casings, e.g. for tap-changing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/06—Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
    • H01L2924/15747—Copper [Cu] as principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
GB0302483A 2003-02-04 2003-02-04 Nonplanar lead-frame; mounting magnetic components and a circuit board; lead-frame and heat sink Withdrawn GB2398181A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0302483A GB2398181A (en) 2003-02-04 2003-02-04 Nonplanar lead-frame; mounting magnetic components and a circuit board; lead-frame and heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0302483A GB2398181A (en) 2003-02-04 2003-02-04 Nonplanar lead-frame; mounting magnetic components and a circuit board; lead-frame and heat sink

Publications (2)

Publication Number Publication Date
GB0302483D0 true GB0302483D0 (en) 2003-03-05
GB2398181A GB2398181A (en) 2004-08-11

Family

ID=9952362

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0302483A Withdrawn GB2398181A (en) 2003-02-04 2003-02-04 Nonplanar lead-frame; mounting magnetic components and a circuit board; lead-frame and heat sink

Country Status (1)

Country Link
GB (1) GB2398181A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3127339A1 (en) * 2021-09-20 2023-03-24 Valeo Systemes De Controle Moteur Electronic module with improved connection element

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3002532A1 (en) * 1980-01-24 1981-07-30 Siemens AG, 1000 Berlin und 8000 München METHOD FOR ELECTRICALLY CONTACTING AND INSULATING AN ELECTRICAL COMPONENT
JPS60161643A (en) * 1984-02-01 1985-08-23 Hitachi Micro Comput Eng Ltd Semiconductor device
JPS615559A (en) * 1984-06-20 1986-01-11 Hitachi Tokyo Electronics Co Ltd Lead frame
JPS60258944A (en) * 1985-02-15 1985-12-20 Hitachi Ltd Ic device
US5430613A (en) * 1993-06-01 1995-07-04 Eaton Corporation Current transformer using a laminated toroidal core structure and a lead frame
US5697689A (en) * 1993-08-09 1997-12-16 General Automotive Specialty Co., Inc. Rotary switch indicator including horseshoe light guide
JPH11284119A (en) * 1998-03-27 1999-10-15 Mitsumi Electric Co Ltd Heat dissipation structure of semiconductor integrated device
CN1162877C (en) * 1998-08-06 2004-08-18 台达电子工业股份有限公司 Winding with core tube
GB9920238D0 (en) * 1999-08-27 1999-10-27 Pearce Grahame K Vermin trap
KR100370231B1 (en) * 2000-06-13 2003-01-29 페어차일드코리아반도체 주식회사 Power module package having a insulator type heat sink attached a backside of leadframe & manufacturing method thereof

Also Published As

Publication number Publication date
GB2398181A (en) 2004-08-11

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)