GB0209014D0 - Mount for a semiconductor device - Google Patents
Mount for a semiconductor deviceInfo
- Publication number
- GB0209014D0 GB0209014D0 GBGB0209014.0A GB0209014A GB0209014D0 GB 0209014 D0 GB0209014 D0 GB 0209014D0 GB 0209014 A GB0209014 A GB 0209014A GB 0209014 D0 GB0209014 D0 GB 0209014D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- mount
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
- H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
- G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0209014A GB2387714A (en) | 2002-04-19 | 2002-04-19 | Mount for a semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0209014A GB2387714A (en) | 2002-04-19 | 2002-04-19 | Mount for a semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
GB0209014D0 true GB0209014D0 (en) | 2002-05-29 |
GB2387714A GB2387714A (en) | 2003-10-22 |
Family
ID=9935166
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0209014A Withdrawn GB2387714A (en) | 2002-04-19 | 2002-04-19 | Mount for a semiconductor device |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2387714A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111948761A (en) * | 2019-05-14 | 2020-11-17 | 青岛海信宽带多媒体技术有限公司 | Optical module |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5271887A (en) * | 1980-08-04 | 1993-12-21 | Witec Cayman Patents, Ltd. | Method of fabricating complex micro-circuit boards, substrates and microcircuits and the substrates and microcircuits |
JPS6314455A (en) * | 1986-07-07 | 1988-01-21 | Hitachi Maxell Ltd | Semiconductor device |
US5574959A (en) * | 1993-09-16 | 1996-11-12 | Sumitomo Electric Industries, Ltd. | Metal casing for semiconductor device having high thermal conductivity and thermal expansion coefficient |
US5929516A (en) * | 1994-09-23 | 1999-07-27 | Siemens N.V. | Polymer stud grid array |
EP0804323B1 (en) * | 1995-01-18 | 1998-11-04 | Robert Bosch Gmbh | Arrangement for converting optical into electrical signals and process for producing it |
JPH0954227A (en) * | 1995-08-11 | 1997-02-25 | Nippon Telegr & Teleph Corp <Ntt> | Molded substrate for optical packaging and its production |
-
2002
- 2002-04-19 GB GB0209014A patent/GB2387714A/en not_active Withdrawn
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111948761A (en) * | 2019-05-14 | 2020-11-17 | 青岛海信宽带多媒体技术有限公司 | Optical module |
Also Published As
Publication number | Publication date |
---|---|
GB2387714A (en) | 2003-10-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |