GB0208078D0 - Sacrificial side tilting mirror for on-wafer optical testing - Google Patents

Sacrificial side tilting mirror for on-wafer optical testing

Info

Publication number
GB0208078D0
GB0208078D0 GB0208078A GB0208078A GB0208078D0 GB 0208078 D0 GB0208078 D0 GB 0208078D0 GB 0208078 A GB0208078 A GB 0208078A GB 0208078 A GB0208078 A GB 0208078A GB 0208078 D0 GB0208078 D0 GB 0208078D0
Authority
GB
United Kingdom
Prior art keywords
tilting mirror
optical testing
side tilting
wafer optical
sacrificial side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0208078A
Other versions
GB2387479A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DenseLight Semiconductors Pte Ltd
Original Assignee
DenseLight Semiconductors Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DenseLight Semiconductors Pte Ltd filed Critical DenseLight Semiconductors Pte Ltd
Priority to GB0208078A priority Critical patent/GB2387479A/en
Publication of GB0208078D0 publication Critical patent/GB0208078D0/en
Publication of GB2387479A publication Critical patent/GB2387479A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/0014—Measuring characteristics or properties thereof
    • H01S5/0042—On wafer testing, e.g. lasers are tested before separating wafer into chips
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/0201—Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
GB0208078A 2002-04-08 2002-04-08 Sacrificial side tilting mirror for on-wafer optical testing Withdrawn GB2387479A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0208078A GB2387479A (en) 2002-04-08 2002-04-08 Sacrificial side tilting mirror for on-wafer optical testing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0208078A GB2387479A (en) 2002-04-08 2002-04-08 Sacrificial side tilting mirror for on-wafer optical testing

Publications (2)

Publication Number Publication Date
GB0208078D0 true GB0208078D0 (en) 2002-05-22
GB2387479A GB2387479A (en) 2003-10-15

Family

ID=9934461

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0208078A Withdrawn GB2387479A (en) 2002-04-08 2002-04-08 Sacrificial side tilting mirror for on-wafer optical testing

Country Status (1)

Country Link
GB (1) GB2387479A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114706172A (en) * 2022-02-25 2022-07-05 武汉光迅科技股份有限公司 Eight-channel optical transceiver module

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008045980A1 (en) * 2008-09-05 2010-06-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for characterizing laser emission properties of edge-emitting semiconductor laser, for wafer testing of edge semiconductor laser elements, involves structuring semiconductor blocks for production of edge-emitting individual laser
JP5475104B2 (en) * 2009-04-01 2014-04-16 オクラロ テクノロジー リミテッド Sacrificial waveguide test structure
US8749772B2 (en) * 2009-07-13 2014-06-10 Oclaro Technology Limited Integrated photodiode wavelength monitor
US8934512B2 (en) * 2011-12-08 2015-01-13 Binoptics Corporation Edge-emitting etched-facet lasers
US9213155B2 (en) 2013-12-26 2015-12-15 Futurewei Technologies, Inc. Light steering for silicon photonic devices
US10012798B2 (en) * 2016-06-30 2018-07-03 International Business Machines Corporation Sacrificial coupler for testing V-grooved integrated circuits
US12105141B2 (en) 2020-04-28 2024-10-01 Poet Technologies, Inc. Structure and method for testing of PIC with an upturned mirror
CN112787210B (en) * 2020-12-31 2022-05-27 厦门三安光电有限公司 Laser diode

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4807238A (en) * 1986-03-12 1989-02-21 Ricoh Co., Ltd. A semiconductor laser device
JP2705130B2 (en) * 1988-08-09 1998-01-26 日本電気株式会社 Manufacturing method of semiconductor laser
US5357103A (en) * 1991-10-02 1994-10-18 Sumitomo Electric Industries, Inc. Light receiving module with optical fiber coupling
JP3537881B2 (en) * 1994-03-29 2004-06-14 株式会社リコー LED array head
US5808293A (en) * 1996-08-28 1998-09-15 Hewlett-Packard Company Photo detector with an integrated mirror and a method of making the same
US6071426A (en) * 1997-12-08 2000-06-06 The Regents Of The University Of California Micro benchtop optics by bulk silicon micromachining

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114706172A (en) * 2022-02-25 2022-07-05 武汉光迅科技股份有限公司 Eight-channel optical transceiver module
CN114706172B (en) * 2022-02-25 2023-06-27 武汉光迅科技股份有限公司 Eight-channel optical transceiver module

Also Published As

Publication number Publication date
GB2387479A (en) 2003-10-15

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)