GB0206158D0 - Use of light emitting chemical reactions for control of semiconductor production processes - Google Patents

Use of light emitting chemical reactions for control of semiconductor production processes

Info

Publication number
GB0206158D0
GB0206158D0 GBGB0206158.8A GB0206158A GB0206158D0 GB 0206158 D0 GB0206158 D0 GB 0206158D0 GB 0206158 A GB0206158 A GB 0206158A GB 0206158 D0 GB0206158 D0 GB 0206158D0
Authority
GB
United Kingdom
Prior art keywords
light emitting
control
chemical reactions
production processes
semiconductor production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB0206158.8A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intellemetrics Ltd
Original Assignee
Intellemetrics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intellemetrics Ltd filed Critical Intellemetrics Ltd
Priority to GBGB0206158.8A priority Critical patent/GB0206158D0/en
Publication of GB0206158D0 publication Critical patent/GB0206158D0/en
Priority to EP03744445A priority patent/EP1485937A2/en
Priority to KR10-2004-7014351A priority patent/KR20040094794A/en
Priority to AU2003226491A priority patent/AU2003226491A1/en
Priority to US10/508,628 priority patent/US20050103438A1/en
Priority to JP2003577311A priority patent/JP2005521242A/en
Priority to PCT/GB2003/001104 priority patent/WO2003079411A2/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
GBGB0206158.8A 2002-03-15 2002-03-15 Use of light emitting chemical reactions for control of semiconductor production processes Ceased GB0206158D0 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
GBGB0206158.8A GB0206158D0 (en) 2002-03-15 2002-03-15 Use of light emitting chemical reactions for control of semiconductor production processes
EP03744445A EP1485937A2 (en) 2002-03-15 2003-03-14 Use of light emitting chemical reactions for control of semiconductor production processes
KR10-2004-7014351A KR20040094794A (en) 2002-03-15 2003-03-14 Use of light emitting chemical reactions for control of semiconductor production processes
AU2003226491A AU2003226491A1 (en) 2002-03-15 2003-03-14 Use of light emitting chemical reactions for control of semiconductor production processes
US10/508,628 US20050103438A1 (en) 2002-03-15 2003-03-14 Use of light emitting chemical reactions for control of semiconductor production processes
JP2003577311A JP2005521242A (en) 2002-03-15 2003-03-14 Use of luminescent chemical reactions to control semiconductor manufacturing processes.
PCT/GB2003/001104 WO2003079411A2 (en) 2002-03-15 2003-03-14 Use of light emitting chemical reactions for control of semiconductor production processes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0206158.8A GB0206158D0 (en) 2002-03-15 2002-03-15 Use of light emitting chemical reactions for control of semiconductor production processes

Publications (1)

Publication Number Publication Date
GB0206158D0 true GB0206158D0 (en) 2002-04-24

Family

ID=9933054

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB0206158.8A Ceased GB0206158D0 (en) 2002-03-15 2002-03-15 Use of light emitting chemical reactions for control of semiconductor production processes

Country Status (7)

Country Link
US (1) US20050103438A1 (en)
EP (1) EP1485937A2 (en)
JP (1) JP2005521242A (en)
KR (1) KR20040094794A (en)
AU (1) AU2003226491A1 (en)
GB (1) GB0206158D0 (en)
WO (1) WO2003079411A2 (en)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4855015A (en) * 1988-04-29 1989-08-08 Texas Instruments Incorporated Dry etch process for selectively etching non-homogeneous material bilayers
US5290383A (en) * 1991-03-24 1994-03-01 Tokyo Electron Limited Plasma-process system with improved end-point detecting scheme
US5200023A (en) * 1991-08-30 1993-04-06 International Business Machines Corp. Infrared thermographic method and apparatus for etch process monitoring and control
US5567640A (en) * 1996-01-11 1996-10-22 Vanguard International Semiconductor Corporation Method for fabricating T-shaped capacitors in DRAM cells
US5966586A (en) * 1997-09-26 1999-10-12 Lam Research Corporation Endpoint detection methods in plasma etch processes and apparatus therefor
JPH11176815A (en) * 1997-12-15 1999-07-02 Ricoh Co Ltd End point judging method of dry etching and dry etching equipment
KR100257903B1 (en) * 1997-12-30 2000-08-01 윤종용 Plasma etching apparatus capable of in-situ monitoring, its in-situ monitoring method and in-situ cleaning method for removing residues in plasma etching chamber
US6322660B1 (en) * 1998-09-30 2001-11-27 Advanced Micro Devices Apparatus and method for remote endpoint detection
US6942811B2 (en) * 1999-10-26 2005-09-13 Reflectivity, Inc Method for achieving improved selectivity in an etching process
US6451158B1 (en) * 1999-12-21 2002-09-17 Lam Research Corporation Apparatus for detecting the endpoint of a photoresist stripping process
US6716300B2 (en) * 2001-11-29 2004-04-06 Hitachi, Ltd. Emission spectroscopic processing apparatus

Also Published As

Publication number Publication date
US20050103438A1 (en) 2005-05-19
KR20040094794A (en) 2004-11-10
WO2003079411A2 (en) 2003-09-25
JP2005521242A (en) 2005-07-14
EP1485937A2 (en) 2004-12-15
AU2003226491A1 (en) 2003-09-29
AU2003226491A8 (en) 2003-09-29
WO2003079411A3 (en) 2003-12-18

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)