AU2003226491A8 - Use of light emitting chemical reactions for control of semiconductor production processes - Google Patents

Use of light emitting chemical reactions for control of semiconductor production processes

Info

Publication number
AU2003226491A8
AU2003226491A8 AU2003226491A AU2003226491A AU2003226491A8 AU 2003226491 A8 AU2003226491 A8 AU 2003226491A8 AU 2003226491 A AU2003226491 A AU 2003226491A AU 2003226491 A AU2003226491 A AU 2003226491A AU 2003226491 A8 AU2003226491 A8 AU 2003226491A8
Authority
AU
Australia
Prior art keywords
light emitting
control
chemical reactions
production processes
semiconductor production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003226491A
Other versions
AU2003226491A1 (en
Inventor
David Robert Reeve
Mark Burton Holbrook
Robert Bruce Grant
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOC Group Ltd
Original Assignee
BOC Group Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOC Group Ltd filed Critical BOC Group Ltd
Publication of AU2003226491A8 publication Critical patent/AU2003226491A8/en
Publication of AU2003226491A1 publication Critical patent/AU2003226491A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
AU2003226491A 2002-03-15 2003-03-14 Use of light emitting chemical reactions for control of semiconductor production processes Abandoned AU2003226491A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GBGB0206158.8A GB0206158D0 (en) 2002-03-15 2002-03-15 Use of light emitting chemical reactions for control of semiconductor production processes
GB0206158.8 2002-03-15
PCT/GB2003/001104 WO2003079411A2 (en) 2002-03-15 2003-03-14 Use of light emitting chemical reactions for control of semiconductor production processes

Publications (2)

Publication Number Publication Date
AU2003226491A8 true AU2003226491A8 (en) 2003-09-29
AU2003226491A1 AU2003226491A1 (en) 2003-09-29

Family

ID=9933054

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003226491A Abandoned AU2003226491A1 (en) 2002-03-15 2003-03-14 Use of light emitting chemical reactions for control of semiconductor production processes

Country Status (7)

Country Link
US (1) US20050103438A1 (en)
EP (1) EP1485937A2 (en)
JP (1) JP2005521242A (en)
KR (1) KR20040094794A (en)
AU (1) AU2003226491A1 (en)
GB (1) GB0206158D0 (en)
WO (1) WO2003079411A2 (en)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4855015A (en) * 1988-04-29 1989-08-08 Texas Instruments Incorporated Dry etch process for selectively etching non-homogeneous material bilayers
US5290383A (en) * 1991-03-24 1994-03-01 Tokyo Electron Limited Plasma-process system with improved end-point detecting scheme
US5200023A (en) * 1991-08-30 1993-04-06 International Business Machines Corp. Infrared thermographic method and apparatus for etch process monitoring and control
US5567640A (en) * 1996-01-11 1996-10-22 Vanguard International Semiconductor Corporation Method for fabricating T-shaped capacitors in DRAM cells
US5966586A (en) * 1997-09-26 1999-10-12 Lam Research Corporation Endpoint detection methods in plasma etch processes and apparatus therefor
JPH11176815A (en) * 1997-12-15 1999-07-02 Ricoh Co Ltd End point judging method of dry etching and dry etching equipment
KR100257903B1 (en) * 1997-12-30 2000-08-01 윤종용 Plasma etching apparatus capable of in-situ monitoring, its in-situ monitoring method and in-situ cleaning method for removing residues in plasma etching chamber
US6322660B1 (en) * 1998-09-30 2001-11-27 Advanced Micro Devices Apparatus and method for remote endpoint detection
US6942811B2 (en) * 1999-10-26 2005-09-13 Reflectivity, Inc Method for achieving improved selectivity in an etching process
US6451158B1 (en) * 1999-12-21 2002-09-17 Lam Research Corporation Apparatus for detecting the endpoint of a photoresist stripping process
US6716300B2 (en) * 2001-11-29 2004-04-06 Hitachi, Ltd. Emission spectroscopic processing apparatus

Also Published As

Publication number Publication date
JP2005521242A (en) 2005-07-14
WO2003079411A3 (en) 2003-12-18
GB0206158D0 (en) 2002-04-24
WO2003079411A2 (en) 2003-09-25
KR20040094794A (en) 2004-11-10
EP1485937A2 (en) 2004-12-15
AU2003226491A1 (en) 2003-09-29
US20050103438A1 (en) 2005-05-19

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase