GB0126979D0 - Retaining clamp for cooling fins - Google Patents

Retaining clamp for cooling fins

Info

Publication number
GB0126979D0
GB0126979D0 GB0126979A GB0126979A GB0126979D0 GB 0126979 D0 GB0126979 D0 GB 0126979D0 GB 0126979 A GB0126979 A GB 0126979A GB 0126979 A GB0126979 A GB 0126979A GB 0126979 D0 GB0126979 D0 GB 0126979D0
Authority
GB
United Kingdom
Prior art keywords
cooling fins
retaining clamp
retaining
clamp
fins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB0126979A
Other versions
GB2369156A (en
GB2369156B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asia Vital Components Co Ltd
Ray Long Enterprise Co Ltd
Original Assignee
Asia Vital Components Co Ltd
Ray Long Enterprise Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asia Vital Components Co Ltd, Ray Long Enterprise Co Ltd filed Critical Asia Vital Components Co Ltd
Publication of GB0126979D0 publication Critical patent/GB0126979D0/en
Publication of GB2369156A publication Critical patent/GB2369156A/en
Application granted granted Critical
Publication of GB2369156B publication Critical patent/GB2369156B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Clamps And Clips (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Insertion Pins And Rivets (AREA)
GB0126979A 2000-11-20 2001-11-09 Retaining clamp for cooling fins Expired - Fee Related GB2369156B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW089220134U TW486233U (en) 2000-11-20 2000-11-20 Improved structure for heat sink fastener

Publications (3)

Publication Number Publication Date
GB0126979D0 true GB0126979D0 (en) 2002-01-02
GB2369156A GB2369156A (en) 2002-05-22
GB2369156B GB2369156B (en) 2003-02-12

Family

ID=21675186

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0126979A Expired - Fee Related GB2369156B (en) 2000-11-20 2001-11-09 Retaining clamp for cooling fins

Country Status (4)

Country Link
DE (1) DE20118015U1 (en)
FR (1) FR2817027B3 (en)
GB (1) GB2369156B (en)
TW (1) TW486233U (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100573936C (en) * 2006-12-29 2009-12-23 富准精密工业(深圳)有限公司 The combination of light-emitting diode and heat abstractor

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5617292A (en) * 1995-09-14 1997-04-01 International Electronic Research Corporation Two piece clip for heat dissipating assemblies
US5791403A (en) * 1997-06-10 1998-08-11 Chiou; Ming Chin Clamping device adapted for securing a heat sink to a CPU mount to hold down a CPU
US5771960A (en) * 1997-07-09 1998-06-30 Lin; Bob CPU heat sink fastener
TW338536U (en) * 1997-07-12 1998-08-11 Hon Hai Prec Ind Co Ltd A fastener
US5982620A (en) * 1998-06-01 1999-11-09 Asia Vital Components Co., Ltd. CPU casing structure with improved heat dissipator anchoring configuration
US5933325A (en) * 1998-06-17 1999-08-03 Hon Hai Precision Ind. Co., Ltd. Detachable fastening device for use with heat sink
DE20007250U1 (en) * 2000-04-19 2000-08-03 Pentalpha International Inc., Taipeh/T'ai-Pei Retaining clip for mounting a heat sink on a CPU
DE20013641U1 (en) * 2000-08-08 2000-12-14 Pentalpha International Inc., Taipeh/T'ai-Pei Fastening device for a composite construction consisting of cooling fins, CPU and mounting base

Also Published As

Publication number Publication date
FR2817027B3 (en) 2003-01-10
DE20118015U1 (en) 2002-03-14
GB2369156A (en) 2002-05-22
TW486233U (en) 2002-05-01
FR2817027A3 (en) 2002-05-24
GB2369156B (en) 2003-02-12

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20071109