GB0101587D0 - Cooling apparatus - Google Patents

Cooling apparatus

Info

Publication number
GB0101587D0
GB0101587D0 GB0101587A GB0101587A GB0101587D0 GB 0101587 D0 GB0101587 D0 GB 0101587D0 GB 0101587 A GB0101587 A GB 0101587A GB 0101587 A GB0101587 A GB 0101587A GB 0101587 D0 GB0101587 D0 GB 0101587D0
Authority
GB
United Kingdom
Prior art keywords
cooling apparatus
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0101587A
Other versions
GB2358464A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3Com Corp
Original Assignee
3Com Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3Com Corp filed Critical 3Com Corp
Publication of GB0101587D0 publication Critical patent/GB0101587D0/en
Publication of GB2358464A publication Critical patent/GB2358464A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB0101587A 2000-01-21 2001-01-22 A cooling apparatus Withdrawn GB2358464A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0001442A GB2358463A (en) 2000-01-21 2000-01-21 A cooling apparatus

Publications (2)

Publication Number Publication Date
GB0101587D0 true GB0101587D0 (en) 2001-03-07
GB2358464A GB2358464A (en) 2001-07-25

Family

ID=9884134

Family Applications (2)

Application Number Title Priority Date Filing Date
GB0001442A Withdrawn GB2358463A (en) 2000-01-21 2000-01-21 A cooling apparatus
GB0101587A Withdrawn GB2358464A (en) 2000-01-21 2001-01-22 A cooling apparatus

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB0001442A Withdrawn GB2358463A (en) 2000-01-21 2000-01-21 A cooling apparatus

Country Status (3)

Country Link
AU (1) AU6713300A (en)
GB (2) GB2358463A (en)
WO (1) WO2001054169A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2101351B1 (en) 2008-03-13 2016-08-17 Siemens Aktiengesellschaft Cooling device for cooling a component
JP2013526028A (en) * 2010-04-23 2013-06-20 ナパテック アクティーゼルスカブ Thermally controlled assembly

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA795886A (en) * 1962-02-16 1968-10-01 The General Electric Company Limited. London Electronic assemblies
US4851965A (en) * 1987-03-09 1989-07-25 Unisys Corporation Directed air management system for cooling multiple heat sinks
US5103374A (en) * 1990-05-23 1992-04-07 At&T Bell Laboratories Circuit pack cooling using turbulators
US5110335A (en) * 1990-06-25 1992-05-05 At&T Bell Laboratories Method of glass soot deposition using ultrasonic nozzle
JP2934493B2 (en) * 1990-10-24 1999-08-16 株式会社日立製作所 Electronic equipment cooling device
EP0563755B1 (en) * 1992-03-24 1997-01-29 Hitachi, Ltd. Jet cooling apparatus for cooling electronic equipment and computer having the same mounted thereon
JPH09123732A (en) * 1995-11-01 1997-05-13 Zexel Corp Air conditioner for automobile
EP0893042A1 (en) * 1996-04-10 1999-01-27 Intergraph Corporation Removable circuit board with ducted cooling

Also Published As

Publication number Publication date
AU6713300A (en) 2001-07-31
GB0001442D0 (en) 2000-03-08
GB2358464A (en) 2001-07-25
WO2001054169A2 (en) 2001-07-26
GB2358463A (en) 2001-07-25

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)