GB0015484D0 - Housing semiconductor chips - Google Patents

Housing semiconductor chips

Info

Publication number
GB0015484D0
GB0015484D0 GB0015484A GB0015484A GB0015484D0 GB 0015484 D0 GB0015484 D0 GB 0015484D0 GB 0015484 A GB0015484 A GB 0015484A GB 0015484 A GB0015484 A GB 0015484A GB 0015484 D0 GB0015484 D0 GB 0015484D0
Authority
GB
Grant status
Grant
Patent type
Prior art keywords
semiconductor chips
housing semiconductor
housing
chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GB0015484A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IXYS UK Westcode Ltd
Original Assignee
IXYS UK Westcode Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Grant date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304Transistor
    • H01L2924/1305Bipolar Junction Transistor [BJT]
    • H01L2924/13055Insulated gate bipolar transistor [IGBT]
GB0015484A 2000-06-23 2000-06-23 Housing semiconductor chips Ceased GB0015484D0 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0015484A GB0015484D0 (en) 2000-06-23 2000-06-23 Housing semiconductor chips

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB0015484A GB0015484D0 (en) 2000-06-23 2000-06-23 Housing semiconductor chips
GB0105732A GB2363904B (en) 2000-06-23 2001-03-08 Housing semiconductor chips
EP20010305114 EP1168446A3 (en) 2000-06-23 2001-06-12 Housing semiconductor chips

Publications (1)

Publication Number Publication Date
GB0015484D0 true GB0015484D0 (en) 2000-08-16

Family

ID=9894316

Family Applications (2)

Application Number Title Priority Date Filing Date
GB0015484A Ceased GB0015484D0 (en) 2000-06-23 2000-06-23 Housing semiconductor chips
GB0105732A Active GB2363904B (en) 2000-06-23 2001-03-08 Housing semiconductor chips

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB0105732A Active GB2363904B (en) 2000-06-23 2001-03-08 Housing semiconductor chips

Country Status (1)

Country Link
GB (2) GB0015484D0 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3180863B2 (en) * 1993-07-27 2001-06-25 富士電機株式会社 Pressure contact type semiconductor device and an assembling method thereof
JP2991010B2 (en) * 1993-09-29 1999-12-20 富士電機株式会社 Semiconductor device and manufacturing method thereof
JP3258200B2 (en) * 1995-05-31 2002-02-18 株式会社東芝 Pressure-contact type semiconductor device
JP3018971B2 (en) * 1995-12-18 2000-03-13 富士電機株式会社 Semiconductor device
JP2930074B1 (en) * 1998-06-02 1999-08-03 富士電機株式会社 Semiconductor device

Also Published As

Publication number Publication date Type
GB2363904B (en) 2004-05-19 grant
GB2363904A (en) 2002-01-09 application
GB0105732D0 (en) 2001-04-25 grant

Similar Documents

Publication Publication Date Title
EP1288955A3 (en) Semiconductor memory device
GB2380604B (en) Semiconductor switch
GB2362508B (en) Semiconductor integrated circuit fabrication
GB2371229B (en) De-odourising device
GB0026925D0 (en) Semiconductor laser module
GB2378421B (en) Multi-embossing device
GB0000511D0 (en) Led package
GB0121487D0 (en) Compounds
GB0102670D0 (en) Compounds
GB0101628D0 (en) Compounds
GB0126441D0 (en) Compounds
GB0119472D0 (en) Compounds
GB0130342D0 (en) Compounds
GB0127432D0 (en) Compounds
GB0115862D0 (en) Compounds
GB0102665D0 (en) Compounds
GB0102673D0 (en) Compounds
GB0112324D0 (en) Compounds
GB0102668D0 (en) Compounds
GB0118364D0 (en) Compounds
GB0100183D0 (en) Vovel compounds
GB0126433D0 (en) Compounds
GB0104398D0 (en) Compounds
GB0129059D0 (en) Compounds
GB0120321D0 (en) Compounds

Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)