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GB0015484D0 - Housing semiconductor chips - Google Patents

Housing semiconductor chips

Info

Publication number
GB0015484D0
GB0015484D0 GBGB0015484.9A GB0015484A GB0015484D0 GB 0015484 D0 GB0015484 D0 GB 0015484D0 GB 0015484 A GB0015484 A GB 0015484A GB 0015484 D0 GB0015484 D0 GB 0015484D0
Authority
GB
UNITED KINGDOM
Prior art keywords
semiconductor chips
housing semiconductor
housing
chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB0015484.9A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IXYS UK Westcode Ltd
Original Assignee
IXYS UK Westcode Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IXYS UK Westcode Ltd filed Critical IXYS UK Westcode Ltd
Priority to GBGB0015484.9A priority Critical patent/GB0015484D0/en
Publication of GB0015484D0 publication Critical patent/GB0015484D0/en
Priority claimed from EP01305114A external-priority patent/EP1168446A3/en
Application status is Ceased legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304Transistor
    • H01L2924/1305Bipolar Junction Transistor [BJT]
    • H01L2924/13055Insulated gate bipolar transistor [IGBT]
GBGB0015484.9A 2000-06-23 2000-06-23 Housing semiconductor chips Ceased GB0015484D0 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GBGB0015484.9A GB0015484D0 (en) 2000-06-23 2000-06-23 Housing semiconductor chips

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GBGB0015484.9A GB0015484D0 (en) 2000-06-23 2000-06-23 Housing semiconductor chips
GB0105732A GB2363904B (en) 2000-06-23 2001-03-08 Housing semiconductor chips
EP01305114A EP1168446A3 (en) 2000-06-23 2001-06-12 Housing semiconductor chips

Publications (1)

Publication Number Publication Date
GB0015484D0 true GB0015484D0 (en) 2000-08-16

Family

ID=9894316

Family Applications (2)

Application Number Title Priority Date Filing Date
GBGB0015484.9A Ceased GB0015484D0 (en) 2000-06-23 2000-06-23 Housing semiconductor chips
GB0105732A Active GB2363904B (en) 2000-06-23 2001-03-08 Housing semiconductor chips

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB0105732A Active GB2363904B (en) 2000-06-23 2001-03-08 Housing semiconductor chips

Country Status (1)

Country Link
GB (2) GB0015484D0 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3180863B2 (en) * 1993-07-27 2001-06-25 富士電機株式会社 Pressure contact type semiconductor device and an assembling method thereof
JP2991010B2 (en) * 1993-09-29 1999-12-20 富士電機株式会社 Semiconductor device and manufacturing method thereof
JP3258200B2 (en) * 1995-05-31 2002-02-18 株式会社東芝 Pressure-contact type semiconductor device
JP3018971B2 (en) * 1995-12-18 2000-03-13 富士電機株式会社 Semiconductor device
JP2930074B1 (en) * 1998-06-02 1999-08-03 富士電機株式会社 Semiconductor device

Also Published As

Publication number Publication date
GB2363904B (en) 2004-05-19
GB2363904A (en) 2002-01-09
GB0105732D0 (en) 2001-04-25

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)