GB0105732D0 - Housing semiconductor chips - Google Patents

Housing semiconductor chips

Info

Publication number
GB0105732D0
GB0105732D0 GBGB0105732.2A GB0105732A GB0105732D0 GB 0105732 D0 GB0105732 D0 GB 0105732D0 GB 0105732 A GB0105732 A GB 0105732A GB 0105732 D0 GB0105732 D0 GB 0105732D0
Authority
GB
United Kingdom
Prior art keywords
semiconductor chips
housing semiconductor
housing
chips
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GBGB0105732.2A
Other versions
GB2363904B (en
GB2363904A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IXYS UK Westcode Ltd
Original Assignee
IXYS UK Westcode Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IXYS UK Westcode Ltd filed Critical IXYS UK Westcode Ltd
Publication of GB0105732D0 publication Critical patent/GB0105732D0/en
Priority to EP01305114A priority Critical patent/EP1168446A3/en
Publication of GB2363904A publication Critical patent/GB2363904A/en
Application granted granted Critical
Publication of GB2363904B publication Critical patent/GB2363904B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
GB0105732A 2000-06-23 2001-03-08 Housing semiconductor chips Expired - Lifetime GB2363904B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP01305114A EP1168446A3 (en) 2000-06-23 2001-06-12 Housing semiconductor chips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0015484.9A GB0015484D0 (en) 2000-06-23 2000-06-23 Housing semiconductor chips

Publications (3)

Publication Number Publication Date
GB0105732D0 true GB0105732D0 (en) 2001-04-25
GB2363904A GB2363904A (en) 2002-01-09
GB2363904B GB2363904B (en) 2004-05-19

Family

ID=9894316

Family Applications (2)

Application Number Title Priority Date Filing Date
GBGB0015484.9A Ceased GB0015484D0 (en) 2000-06-23 2000-06-23 Housing semiconductor chips
GB0105732A Expired - Lifetime GB2363904B (en) 2000-06-23 2001-03-08 Housing semiconductor chips

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GBGB0015484.9A Ceased GB0015484D0 (en) 2000-06-23 2000-06-23 Housing semiconductor chips

Country Status (1)

Country Link
GB (2) GB0015484D0 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3258200B2 (en) * 1995-05-31 2002-02-18 株式会社東芝 Pressure contact type semiconductor device
JP3180863B2 (en) * 1993-07-27 2001-06-25 富士電機株式会社 Pressure contact type semiconductor device and method of assembling the same
JP2991010B2 (en) * 1993-09-29 1999-12-20 富士電機株式会社 Semiconductor device and manufacturing method thereof
JP3018971B2 (en) * 1995-12-18 2000-03-13 富士電機株式会社 Semiconductor device
JP2930074B1 (en) * 1998-06-02 1999-08-03 富士電機株式会社 Semiconductor device

Also Published As

Publication number Publication date
GB2363904B (en) 2004-05-19
GB0015484D0 (en) 2000-08-16
GB2363904A (en) 2002-01-09

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Legal Events

Date Code Title Description
PE20 Patent expired after termination of 20 years

Expiry date: 20210307