GB0012706D0 - Pcb assembly and method therefor - Google Patents

Pcb assembly and method therefor

Info

Publication number
GB0012706D0
GB0012706D0 GB0012706A GB0012706A GB0012706D0 GB 0012706 D0 GB0012706 D0 GB 0012706D0 GB 0012706 A GB0012706 A GB 0012706A GB 0012706 A GB0012706 A GB 0012706A GB 0012706 D0 GB0012706 D0 GB 0012706D0
Authority
GB
United Kingdom
Prior art keywords
method therefor
pcb assembly
pcb
assembly
therefor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0012706A
Other versions
GB2362761A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Priority to GB0012706A priority Critical patent/GB2362761A/en
Publication of GB0012706D0 publication Critical patent/GB0012706D0/en
Publication of GB2362761A publication Critical patent/GB2362761A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/2049—Pressing means used to urge contact, e.g. springs

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
GB0012706A 2000-05-24 2000-05-24 PCB assembly and method therefor Withdrawn GB2362761A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0012706A GB2362761A (en) 2000-05-24 2000-05-24 PCB assembly and method therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0012706A GB2362761A (en) 2000-05-24 2000-05-24 PCB assembly and method therefor

Publications (2)

Publication Number Publication Date
GB0012706D0 true GB0012706D0 (en) 2000-07-19
GB2362761A GB2362761A (en) 2001-11-28

Family

ID=9892339

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0012706A Withdrawn GB2362761A (en) 2000-05-24 2000-05-24 PCB assembly and method therefor

Country Status (1)

Country Link
GB (1) GB2362761A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111867344A (en) * 2019-04-30 2020-10-30 安波福技术有限公司 Radar unit with heat transfer via radome

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10206271A1 (en) * 2002-02-15 2003-08-28 Conti Temic Microelectronic Thermal conductor connecting heat sink to substrate carrying electronic components used for engine valve control, has wavy profile and resilience

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4063791A (en) * 1976-12-27 1977-12-20 Cutchaw John M Connector for leadless integrated circuit packages
DE19625755A1 (en) * 1996-06-27 1998-01-02 Bosch Gmbh Robert Fastener

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111867344A (en) * 2019-04-30 2020-10-30 安波福技术有限公司 Radar unit with heat transfer via radome

Also Published As

Publication number Publication date
GB2362761A (en) 2001-11-28

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)