GB0010164D0 - Technique for hybrid integration of heteropolysiloxane lenses and alignment structures onto vertical cavity surface emitting laser chips - Google Patents

Technique for hybrid integration of heteropolysiloxane lenses and alignment structures onto vertical cavity surface emitting laser chips

Info

Publication number
GB0010164D0
GB0010164D0 GB0010164A GB0010164A GB0010164D0 GB 0010164 D0 GB0010164 D0 GB 0010164D0 GB 0010164 A GB0010164 A GB 0010164A GB 0010164 A GB0010164 A GB 0010164A GB 0010164 D0 GB0010164 D0 GB 0010164D0
Authority
GB
United Kingdom
Prior art keywords
heteropolysiloxane
lenses
technique
emitting laser
surface emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GB0010164A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Centre Suisse dElectronique et Microtechnique SA CSEM
Original Assignee
Centre Suisse dElectronique et Microtechnique SA CSEM
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Centre Suisse dElectronique et Microtechnique SA CSEM filed Critical Centre Suisse dElectronique et Microtechnique SA CSEM
Priority to GB0010164A priority Critical patent/GB0010164D0/en
Publication of GB0010164D0 publication Critical patent/GB0010164D0/en
Priority to PCT/GB2001/001863 priority patent/WO2001082427A1/en
Ceased legal-status Critical Current

Links

GB0010164A 2000-04-27 2000-04-27 Technique for hybrid integration of heteropolysiloxane lenses and alignment structures onto vertical cavity surface emitting laser chips Ceased GB0010164D0 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB0010164A GB0010164D0 (en) 2000-04-27 2000-04-27 Technique for hybrid integration of heteropolysiloxane lenses and alignment structures onto vertical cavity surface emitting laser chips
PCT/GB2001/001863 WO2001082427A1 (en) 2000-04-27 2001-04-27 Method and apparatus for fabricating a lens encapsulation on a semiconductor laser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0010164A GB0010164D0 (en) 2000-04-27 2000-04-27 Technique for hybrid integration of heteropolysiloxane lenses and alignment structures onto vertical cavity surface emitting laser chips

Publications (1)

Publication Number Publication Date
GB0010164D0 true GB0010164D0 (en) 2000-06-14

Family

ID=9890542

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0010164A Ceased GB0010164D0 (en) 2000-04-27 2000-04-27 Technique for hybrid integration of heteropolysiloxane lenses and alignment structures onto vertical cavity surface emitting laser chips

Country Status (2)

Country Link
GB (1) GB0010164D0 (en)
WO (1) WO2001082427A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7446057B2 (en) * 2003-09-29 2008-11-04 International Business Machines Corporation Fabrication method
KR20190120715A (en) * 2018-04-16 2019-10-24 리지텍 일렉트로닉스 컴퍼니 리미티드 Structured light projection system

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56103481A (en) * 1980-01-21 1981-08-18 Fuji Photo Film Co Ltd Manufacture of semiconductor device for photoelectric conversion
JPH01167802A (en) * 1987-12-24 1989-07-03 Hitachi Chem Co Ltd Production of microlens array
JP2687167B2 (en) * 1989-06-06 1997-12-08 松下電器産業株式会社 Semiconductor laser device and manufacturing method thereof
US5833903A (en) * 1996-12-10 1998-11-10 Great American Gumball Corporation Injection molding encapsulation for an electronic device directly onto a substrate
JP3606063B2 (en) * 1998-09-21 2005-01-05 セイコーエプソン株式会社 Manufacturing method of surface emitting semiconductor laser

Also Published As

Publication number Publication date
WO2001082427A1 (en) 2001-11-01

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)