FR971597A - Crystal contact device - Google Patents
Crystal contact deviceInfo
- Publication number
- FR971597A FR971597A FR971597DA FR971597A FR 971597 A FR971597 A FR 971597A FR 971597D A FR971597D A FR 971597DA FR 971597 A FR971597 A FR 971597A
- Authority
- FR
- France
- Prior art keywords
- contact device
- crystal contact
- crystal
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2540247A GB632419A (en) | 1947-09-17 | 1947-09-17 | Improvements in or relating to crystal contact devices |
Publications (1)
Publication Number | Publication Date |
---|---|
FR971597A true FR971597A (en) | 1951-01-18 |
Family
ID=10227105
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR971597D Expired FR971597A (en) | 1947-09-17 | 1948-09-13 | Crystal contact device |
Country Status (2)
Country | Link |
---|---|
FR (1) | FR971597A (en) |
GB (1) | GB632419A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1029937B (en) * | 1953-08-28 | 1958-05-14 | Kieler Howaldtswerke Ag | Process for the production of tip diodes of the smallest dimensions |
-
1947
- 1947-09-17 GB GB2540247A patent/GB632419A/en not_active Expired
-
1948
- 1948-09-13 FR FR971597D patent/FR971597A/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1029937B (en) * | 1953-08-28 | 1958-05-14 | Kieler Howaldtswerke Ag | Process for the production of tip diodes of the smallest dimensions |
Also Published As
Publication number | Publication date |
---|---|
GB632419A (en) | 1949-11-28 |
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