FR932898A - Improvements in methods for manufacturing conductive configurations, such as wiring circuits, chokes, etc. - Google Patents
Improvements in methods for manufacturing conductive configurations, such as wiring circuits, chokes, etc.Info
- Publication number
- FR932898A FR932898A FR932898DA FR932898A FR 932898 A FR932898 A FR 932898A FR 932898D A FR932898D A FR 932898DA FR 932898 A FR932898 A FR 932898A
- Authority
- FR
- France
- Prior art keywords
- chokes
- methods
- wiring circuits
- manufacturing conductive
- conductive configurations
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2847—Sheets; Strips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2154445A GB602492A (en) | 1945-08-23 | 1945-08-23 | Improvements in or relating to methods of making electrically conducting patterns, such as wiring circuits, coils and the like |
GB990146 | 1946-03-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR932898A true FR932898A (en) | 1948-04-05 |
Family
ID=41806072
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR932898D Expired FR932898A (en) | 1945-08-23 | 1946-08-27 | Improvements in methods for manufacturing conductive configurations, such as wiring circuits, chokes, etc. |
Country Status (3)
Country | Link |
---|---|
ES (1) | ES174665A1 (en) |
FR (1) | FR932898A (en) |
GB (1) | GB602492A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2628592A1 (en) * | 1988-03-11 | 1989-09-15 | Thomson Csf | METHOD FOR MAKING CIRCUITS PRINTED ON A THREE-DIMENSIONAL SUPPORT, AND SUPPORT THUS EQUIPPED |
WO1995032605A1 (en) * | 1994-05-25 | 1995-11-30 | James Cook University Of North Queensland | Printed circuit board socket |
AU699033B2 (en) * | 1994-05-25 | 1998-11-19 | James Cook University Of North Queensland | Printed circuit board socket |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2734150A (en) * | 1956-02-07 | Circuit component and method of making same | ||
NL152100B (en) * | 1949-03-08 | Matsushita Electric Ind Co Ltd | VOLTAGE-DEPENDENT RESISTANCE OF THE TYPE WITH SURFACE BARRIER. | |
NL189131B (en) * | 1950-01-12 | Basf Ag | PROCESS FOR THE PREPARATION OF N, N-DIMETHYLPIPERIDINIUM CHLORIDE OR N, N-DIMETHYL MORPHOLINIUM CHLORIDE. | |
US2695351A (en) * | 1950-01-12 | 1954-11-23 | Beck S Inc | Electric circuit components and methods of preparing the same |
US2762113A (en) * | 1950-11-03 | 1956-09-11 | Standard Coil Prod Co Inc | Method of making tuner devices |
US2716268A (en) * | 1952-10-16 | 1955-08-30 | Erie Resistor Corp | Method of making printed circuits |
US2943956A (en) * | 1952-12-18 | 1960-07-05 | Automated Circuits Inc | Printed electrical circuits and method of making the same |
US2876391A (en) * | 1953-12-09 | 1959-03-03 | Sanders Associates Inc | Electrical circuit assembly |
US2946936A (en) * | 1954-03-05 | 1960-07-26 | Motorola Inc | Semiconductor device |
US3000079A (en) * | 1955-05-05 | 1961-09-19 | Aladdin Ind Inc | Tuner and method for making same |
US3234632A (en) * | 1955-08-25 | 1966-02-15 | Hazeltine Research Inc | Method of manufacturing magnetic deflection yokes |
US2966429A (en) * | 1956-08-31 | 1960-12-27 | Gen Electric | Method of and apparatus for making printed circuits |
US3098951A (en) * | 1959-10-29 | 1963-07-23 | Sippican Corp | Weldable circuit cards |
GB2307354A (en) * | 1995-11-14 | 1997-05-21 | Daewoo Electronics Co Ltd | Flyback transformer with a cylindrical printed circuit coil structure |
-
1945
- 1945-08-23 GB GB2154445A patent/GB602492A/en not_active Expired
-
1946
- 1946-08-17 ES ES174665A patent/ES174665A1/en not_active Expired
- 1946-08-27 FR FR932898D patent/FR932898A/en not_active Expired
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2628592A1 (en) * | 1988-03-11 | 1989-09-15 | Thomson Csf | METHOD FOR MAKING CIRCUITS PRINTED ON A THREE-DIMENSIONAL SUPPORT, AND SUPPORT THUS EQUIPPED |
EP0333550A1 (en) * | 1988-03-11 | 1989-09-20 | Thomson-Csf | Process for producing printed circuits on a three-dimensional plastic carrier, and carrier so equipped |
WO1995032605A1 (en) * | 1994-05-25 | 1995-11-30 | James Cook University Of North Queensland | Printed circuit board socket |
AU699033B2 (en) * | 1994-05-25 | 1998-11-19 | James Cook University Of North Queensland | Printed circuit board socket |
Also Published As
Publication number | Publication date |
---|---|
ES174665A1 (en) | 1946-10-01 |
GB602492A (en) | 1948-05-27 |
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