FR3131981B1 - Dispositif de protection contre les décharges électrostatiques - Google Patents

Dispositif de protection contre les décharges électrostatiques Download PDF

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Publication number
FR3131981B1
FR3131981B1 FR2200347A FR2200347A FR3131981B1 FR 3131981 B1 FR3131981 B1 FR 3131981B1 FR 2200347 A FR2200347 A FR 2200347A FR 2200347 A FR2200347 A FR 2200347A FR 3131981 B1 FR3131981 B1 FR 3131981B1
Authority
FR
France
Prior art keywords
protection device
electrostatic discharge
discharge protection
abstract
transistors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR2200347A
Other languages
English (en)
Other versions
FR3131981A1 (fr
Inventor
Philippe Galy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics France SAS
Original Assignee
STMicroelectronics SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SA filed Critical STMicroelectronics SA
Priority to FR2200347A priority Critical patent/FR3131981B1/fr
Priority to US18/096,160 priority patent/US12501718B2/en
Priority to CN202310056079.9A priority patent/CN116454082B/zh
Publication of FR3131981A1 publication Critical patent/FR3131981A1/fr
Application granted granted Critical
Publication of FR3131981B1 publication Critical patent/FR3131981B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
    • H10D89/811—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using FETs as protective elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
    • H10D89/811—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using FETs as protective elements
    • H10D89/813—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using FETs as protective elements specially adapted to provide an electrical current path other than the field-effect induced current path
    • H10D89/814—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using FETs as protective elements specially adapted to provide an electrical current path other than the field-effect induced current path involving a parasitic bipolar transistor triggered by the electrical biasing of the gate electrode of the FET, e.g. gate coupled transistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/674—Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6741—Group IV materials, e.g. germanium or silicon carbide
    • H10D30/6743—Silicon
    • H10D30/6744—Monocrystalline silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/201—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates the substrates comprising an insulating layer on a semiconductor body, e.g. SOI
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
    • H10D89/611—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using diodes as protective elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
    • H10D89/811—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using FETs as protective elements
    • H10D89/819—Bias arrangements for gate electrodes of FETs, e.g. RC networks or voltage partitioning circuits

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Bipolar Transistors (AREA)
  • Bipolar Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)

Abstract

Dispositif de protection contre les décharges électrostatiques La présente description concerne un dispositif de protection (100) contre les décharges électrostatiques comprenant uniquement des transistors. Figure pour l'abrégé : Fig. 1
FR2200347A 2022-01-17 2022-01-17 Dispositif de protection contre les décharges électrostatiques Active FR3131981B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR2200347A FR3131981B1 (fr) 2022-01-17 2022-01-17 Dispositif de protection contre les décharges électrostatiques
US18/096,160 US12501718B2 (en) 2022-01-17 2023-01-12 Electrostatic discharge protection device
CN202310056079.9A CN116454082B (zh) 2022-01-17 2023-01-16 静电放电保护设备

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR2200347 2022-01-17
FR2200347A FR3131981B1 (fr) 2022-01-17 2022-01-17 Dispositif de protection contre les décharges électrostatiques

Publications (2)

Publication Number Publication Date
FR3131981A1 FR3131981A1 (fr) 2023-07-21
FR3131981B1 true FR3131981B1 (fr) 2024-01-26

Family

ID=81851536

Family Applications (1)

Application Number Title Priority Date Filing Date
FR2200347A Active FR3131981B1 (fr) 2022-01-17 2022-01-17 Dispositif de protection contre les décharges électrostatiques

Country Status (2)

Country Link
US (1) US12501718B2 (fr)
FR (1) FR3131981B1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4531105B1 (fr) * 2023-09-29 2026-04-29 NXP USA, Inc. Une protection contre les décharges électrostatiques utilisant un commutateur mos
US12494634B2 (en) * 2024-02-26 2025-12-09 Nxp B.V. Clamp device activation from ESD clamp transistor body contact

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1314946C (fr) * 1989-02-01 1993-03-23 Colin Harris Protection d'entrees de tension analogiques de reference et de polarisation
US7050282B2 (en) * 2003-07-15 2006-05-23 Faraday Technology Corp. Power supply clamp circuit
JP2005235947A (ja) * 2004-02-18 2005-09-02 Fujitsu Ltd 静電気放電保護回路
JP5593904B2 (ja) 2010-07-16 2014-09-24 株式会社リコー 電圧クランプ回路およびこれを用いた集積回路
US8564917B2 (en) * 2011-06-02 2013-10-22 GlobalFoundries, Inc. Integrated circuit having electrostatic discharge protection
KR101926607B1 (ko) * 2012-09-28 2018-12-07 삼성전자 주식회사 클램핑 회로, 이를 포함하는 반도체 장치 및 반도체 장치의 클램핑 방법
US10177135B2 (en) * 2016-05-18 2019-01-08 Vanguard International Semiconductor Corporation Integrated circuit and electrostatic discharge protection circuit thereof
US10840237B2 (en) * 2017-06-27 2020-11-17 Taiwan Semiconductor Manufacturing Co., Ltd. Electrostatic discharge protection circuit
CN109659303A (zh) 2017-10-10 2019-04-19 群创光电股份有限公司 面板装置
US10673436B1 (en) * 2018-11-30 2020-06-02 Texas Instruments Incorporated Failsafe device
US11315919B2 (en) * 2019-02-05 2022-04-26 Nxp Usa, Inc. Circuit for controlling a stacked snapback clamp
CN111697549B (zh) * 2019-03-14 2021-11-12 中芯国际集成电路制造(上海)有限公司 Esd保护电路以及电子器件
US11159014B2 (en) * 2020-01-30 2021-10-26 Infineon Technologies Ag System and method for ESD protection
DE102020103706A1 (de) * 2020-02-13 2021-08-19 Infineon Technologies Ag Halbleiterschalter mit esd-schutzschaltung
US20230010487A1 (en) * 2021-07-08 2023-01-12 Changxin Memory Technologies, Inc. Electrostatic discharge protection circuit and chip
CN219832660U (zh) 2022-01-17 2023-10-13 意法半导体有限公司 静电放电保护设备

Also Published As

Publication number Publication date
US20230268338A1 (en) 2023-08-24
FR3131981A1 (fr) 2023-07-21
US12501718B2 (en) 2025-12-16

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