FR3130111B1 - Procede de realisation d’une connexion electrique pour un module de puissance d’un aeronef - Google Patents

Procede de realisation d’une connexion electrique pour un module de puissance d’un aeronef Download PDF

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Publication number
FR3130111B1
FR3130111B1 FR2112865A FR2112865A FR3130111B1 FR 3130111 B1 FR3130111 B1 FR 3130111B1 FR 2112865 A FR2112865 A FR 2112865A FR 2112865 A FR2112865 A FR 2112865A FR 3130111 B1 FR3130111 B1 FR 3130111B1
Authority
FR
France
Prior art keywords
aircraft
producing
electrical connection
power module
metallization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR2112865A
Other languages
English (en)
Other versions
FR3130111A1 (fr
Inventor
Rabih Khazaka
Baptiste Joël Christian Fedi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Safran SA
Original Assignee
Safran SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Safran SA filed Critical Safran SA
Priority to FR2112865A priority Critical patent/FR3130111B1/fr
Priority to PCT/FR2022/052205 priority patent/WO2023099844A1/fr
Priority to EP22834687.0A priority patent/EP4442085A1/fr
Priority to CN202280079196.0A priority patent/CN118370006A/zh
Publication of FR3130111A1 publication Critical patent/FR3130111A1/fr
Application granted granted Critical
Publication of FR3130111B1 publication Critical patent/FR3130111B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/057—Shape retainable
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10272—Busbars, i.e. thick metal bars mounted on the printed circuit board [PCB] as high-current conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

Le procédé comporte : - une mise en forme tridimensionnelle non plane d’au moins une portion d’un circuit imprimé (900) flexible comprenant un film polymère (902) isolant électrique, et, sur au moins un côté du film polymère (902), une métallisation (904) ; puis - un dépôt électrolytique au cours duquel une couche conductrice est déposée sur au moins la métallisation (904) d’au moins la portion mise en forme. Figure pour l’abrégé : Fig. 11
FR2112865A 2021-12-02 2021-12-02 Procede de realisation d’une connexion electrique pour un module de puissance d’un aeronef Active FR3130111B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR2112865A FR3130111B1 (fr) 2021-12-02 2021-12-02 Procede de realisation d’une connexion electrique pour un module de puissance d’un aeronef
PCT/FR2022/052205 WO2023099844A1 (fr) 2021-12-02 2022-12-01 Procede de realisation d'une connexion electrique pour un module de puissance d'un aeronef
EP22834687.0A EP4442085A1 (fr) 2021-12-02 2022-12-01 Procede de realisation d'une connexion electrique pour un module de puissance d'un aeronef
CN202280079196.0A CN118370006A (zh) 2021-12-02 2022-12-01 用于产生飞行器的功率模块的电连接的方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR2112865A FR3130111B1 (fr) 2021-12-02 2021-12-02 Procede de realisation d’une connexion electrique pour un module de puissance d’un aeronef
FR2112865 2021-12-02

Publications (2)

Publication Number Publication Date
FR3130111A1 FR3130111A1 (fr) 2023-06-09
FR3130111B1 true FR3130111B1 (fr) 2023-10-27

Family

ID=81326335

Family Applications (1)

Application Number Title Priority Date Filing Date
FR2112865A Active FR3130111B1 (fr) 2021-12-02 2021-12-02 Procede de realisation d’une connexion electrique pour un module de puissance d’un aeronef

Country Status (4)

Country Link
EP (1) EP4442085A1 (fr)
CN (1) CN118370006A (fr)
FR (1) FR3130111B1 (fr)
WO (1) WO2023099844A1 (fr)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01183192A (ja) * 1988-01-18 1989-07-20 Fujikura Ltd フレキシブルプリント配線板およびその製造方法
JP2003032840A (ja) * 2001-07-23 2003-01-31 Fujikura Ltd 電気接続箱
US8998454B2 (en) * 2013-03-15 2015-04-07 Sumitomo Electric Printed Circuits, Inc. Flexible electronic assembly and method of manufacturing the same
JP6376637B2 (ja) * 2013-12-10 2018-08-22 アルプス電気株式会社 立体配線基板の製造方法
JP2017220559A (ja) * 2016-06-07 2017-12-14 パナソニックＩｐマネジメント株式会社 立体電子回路およびその製造方法

Also Published As

Publication number Publication date
FR3130111A1 (fr) 2023-06-09
CN118370006A (zh) 2024-07-19
WO2023099844A1 (fr) 2023-06-08
EP4442085A1 (fr) 2024-10-09

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