FR3130085A1 - Electric circuit - Google Patents
Electric circuit Download PDFInfo
- Publication number
- FR3130085A1 FR3130085A1 FR2113049A FR2113049A FR3130085A1 FR 3130085 A1 FR3130085 A1 FR 3130085A1 FR 2113049 A FR2113049 A FR 2113049A FR 2113049 A FR2113049 A FR 2113049A FR 3130085 A1 FR3130085 A1 FR 3130085A1
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- Prior art keywords
- conductive
- base
- pillar
- conductive portion
- end portion
- Prior art date
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00015—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
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Abstract
Circuit électronique La présente description concerne un circuit électronique (100) comprenant un élément de contact (212) électrique ; un pilier (302) conducteur s’étendant depuis l’élément de contact (212) ;ledit pilier (302) comprenant une base conductrice (320) d’un premier matériau, sur l’élément de contact (212), et une portion conductrice (306), d’un deuxième matériau, agencée sur la base (320) ; le premier matériau ayant une malléabilité supérieure à celle du deuxième matériau. Figure pour l'abrégé : Fig. 3Electronic Circuit This disclosure relates to an electronic circuit (100) comprising an electrical contact element (212); a conductive pillar (302) extending from the contact element (212);said pillar (302) comprising a conductive base (320) of a first material, on the contact element (212), and a portion conductor (306), of a second material, arranged on the base (320); the first material having a greater malleability than the second material. Figure for the abstract: Fig. 3
Description
La présente description concerne de façon générale les circuits électroniques, et en particulier des structures de contact électrique de tels circuits électroniques.The present description generally relates to electronic circuits, and in particular to electrical contact structures of such electronic circuits.
Les circuits électroniques peuvent comprendre des assemblages, et notamment des assemblages entre des puces électroniques inversées (Flip Chip en anglais) et des substrats de reprise de contact. Ces assemblages mettent en jeux des matériaux de nature différente, ce qui peut entraîner des contraintes mécaniques générant des défaillances dans les circuits.The electronic circuits may comprise assemblies, and in particular assemblies between inverted electronic chips (Flip Chip in English) and contact recovery substrates. These assemblies involve materials of different natures, which can lead to mechanical stresses generating failures in the circuits.
Il existe un besoin de diminuer les défaillances dans les circuits électroniques, par exemple dans des circuits comprenant des assemblages mettant en oeuvre des puces inversées.There is a need to reduce failures in electronic circuits, for example in circuits comprising assemblies implementing inverted chips.
Un mode de réalisation pallie tout ou partie des inconvénients des circuits électroniques connus.One embodiment overcomes all or part of the drawbacks of known electronic circuits.
Un mode de réalisation prévoit un circuit électronique comprenant :
- un élément de contact électrique ;
- un pilier conducteur s’étendant depuis l’élément de contact ;
ledit pilier comprenant une base conductrice d’un premier matériau, sur l’élément de contact, et une portion conductrice, d’un deuxième matériau, agencée sur la base ;
le premier matériau ayant une malléabilité supérieure à celle du deuxième matériau.One embodiment provides an electronic circuit comprising:
- an electrical contact element;
- a conductive pillar extending from the contact element;
said pillar comprising a conductive base of a first material, on the contact element, and a conductive portion, of a second material, arranged on the base;
the first material having a greater malleability than the second material.
Selon un mode de réalisation, le premier matériau est un alliage à base d’étain.According to one embodiment, the first material is a tin-based alloy.
Selon un mode de réalisation, l’alliage comprend en outre du plomb, ou de l’argent et/ou du cuivre.According to one embodiment, the alloy further comprises lead, or silver and/or copper.
Selon un mode de réalisation, une couche d’accroche est agencée entre l’élément de contact et la base du pilier.According to one embodiment, a grip layer is arranged between the contact element and the base of the pillar.
Selon un mode de réalisation, une couche à base de nickel est agencée entre la base et la portion conductrice du pilier.According to one embodiment, a nickel-based layer is arranged between the base and the conductive portion of the pillar.
Selon un mode de réalisation, une couche, ayant une aptitude à la déformation supérieure à celle de la portion conductrice, est agencée entre une partie de l’élément de contact et la base du pilier.According to one embodiment, a layer, having an ability to deform greater than that of the conductive portion, is arranged between a part of the contact element and the base of the pillar.
Selon un mode de réalisation, le pilier comprend une portion d’extrémité agencée sur la portion conductrice, la portion d’extrémité étant d’un troisième matériau dont la température de fusion est inférieure à celle du deuxième matériau.According to one embodiment, the pillar comprises an end portion arranged on the conductive portion, the end portion being of a third material whose melting temperature is lower than that of the second material.
Selon un mode de réalisation, le troisième matériau est un alliage à base d’étain et d’argent.According to one embodiment, the third material is an alloy based on tin and silver.
Selon un mode de réalisation, une couche à base de nickel est agencée entre la portion conductrice et la portion d’extrémité.According to one embodiment, a nickel-based layer is arranged between the conductive portion and the end portion.
Selon un mode de réalisation, le deuxième matériau est à base de cuivre.According to one embodiment, the second material is based on copper.
Selon un mode de réalisation, le circuit électronique comprend :
- plusieurs dudit élément de contact électrique,
- plusieurs dudit pilier ;
chaque pilier étant sur un des éléments de contact électrique correspondant.According to one embodiment, the electronic circuit comprises:
- several of said electrical contact element,
- several of the said pillar;
each pillar being on one of the corresponding electrical contact elements.
Un mode de réalisation prévoit un dispositif électronique comprenant :
- un substrat ayant des éléments conducteurs en surface ;
- un tel circuit dans lequel la portion conductrice de chacun des piliers est solidarisée avec un des éléments conducteurs correspondant du substrat.One embodiment provides an electronic device comprising:
- a substrate having surface conductive elements;
- Such a circuit in which the conductive portion of each of the pillars is secured to one of the corresponding conductive elements of the substrate.
Un mode de réalisation prévoit un procédé de fabrication d’un circuit électronique comprenant une puce électronique comprenant des éléments de contact, le procédé comprenant :
- la formation d’une base conductrice de piliers conducteurs reliée à un des éléments de contact ;
- la formation d’au moins une portion conductrice des piliers agencée sur la base conductrice, la base conductrice étant dotée d’une malléabilité supérieure à celle de la portion conductrice.One embodiment provides a method for manufacturing an electronic circuit comprising an electronic chip comprising contact elements, the method comprising:
- the formation of a conductive base of conductive pillars connected to one of the contact elements;
- the formation of at least one conductive portion of the pillars arranged on the conductive base, the conductive base being endowed with greater malleability than that of the conductive portion.
Selon un mode de réalisation, le procédé comprend la formation d’une portion d’extrémité agencée sur la portion conductrice, la portion d’extrémité ayant une température de fusion inférieure à celle de la portion conductrice.According to one embodiment, the method comprises the formation of an end portion arranged on the conductive portion, the end portion having a melting temperature lower than that of the conductive portion.
Selon un mode de réalisation, la formation de la base conductrice, de la portion conductrice et de la portion d’extrémité est obtenue en :
- créant des ouvertures dans une couche sacrificielle agencé sur la puce électronique du côté de ses éléments de contact, lesdites ouvertures débouchant chacune sur un desdits éléments de contact ;
- faisant croître la base conductrice des piliers à partir des éléments de contacts ;
procédé dans lequel la formation de la portion conductrice est obtenue en faisant croître la portion conductrice à partir de la base conductrice dans lesdites ouvertures;
procédé dans lequel la formation de la portion d’extrémité est obtenue en faisant croître la portion d’extrémité à partir de la portion conductrice dans lesdites ouvertures ;
la couche sacrificielle étant retirée après la formation de la portion d’extrémité.According to one embodiment, the formation of the conductive base, the conductive portion and the end portion is obtained by:
- Creating openings in a sacrificial layer arranged on the electronic chip on the side of its contact elements, said openings each opening onto one of said contact elements;
- growing the conductive base of the pillars from the contact elements;
method in which the formation of the conductive portion is obtained by growing the conductive portion from the conductive base in said openings;
method in which the formation of the end portion is obtained by growing the end portion from the conductive portion in said openings;
the sacrificial layer being removed after the formation of the end portion.
Ces caractéristiques et avantages, ainsi que d'autres, seront exposés en détail dans la description suivante de modes de réalisation particuliers faite à titre non limitatif en relation avec les figures jointes parmi lesquelles :These characteristics and advantages, as well as others, will be set out in detail in the following description of particular embodiments given on a non-limiting basis in relation to the attached figures, among which:
la
la
la
les figures 4a à 4g sont des vues en coupe, représentant des étapes d’un procédé de fabrication d’un circuit électronique selon un mode de réalisation de la présente description.FIGS. 4a to 4g are cross-sectional views, representing steps of a method of manufacturing an electronic circuit according to an embodiment of the present description.
Claims (15)
- un élément de contact (212) électrique ;
- un pilier (302) conducteur s’étendant depuis l’élément de contact (212) ;
ledit pilier (302) comprenant une base conductrice (320) d’un premier matériau, sur l’élément de contact (212), et une portion conductrice (306), d’un deuxième matériau, agencée sur la base (320) ;
le premier matériau ayant une malléabilité supérieure à celle du deuxième matériau.Electronic circuit (100) comprising:
- an electrical contact element (212);
- a conductive pillar (302) extending from the contact element (212);
said pillar (302) comprising a conductive base (320) of a first material, on the contact element (212), and a conductive portion (306), of a second material, arranged on the base (320);
the first material having a greater malleability than the second material.
- plusieurs dudit élément de contact (212) électrique,
- plusieurs dudit pilier (302) ;
chaque pilier (302) étant sur un des éléments de contact (212) électrique correspondant.Circuit according to any one of claims 1 to 10, comprising:
- several of said electrical contact element (212),
- several of said pillar (302);
each pillar (302) being on one of the corresponding electrical contact elements (212).
- un substrat (106) ayant des éléments conducteurs (422) en surface ;
- un circuit (100) selon la revendication 11 dans lequel la portion conductrice (306) de chacun des piliers (302) est solidarisée avec un des éléments conducteurs (422) correspondant du substrat.Electronic device comprising:
- a substrate (106) having conductive elements (422) on the surface;
- A circuit (100) according to claim 11 wherein the conductive portion (306) of each of the pillars (302) is secured to one of the corresponding conductive elements (422) of the substrate.
- la formation d’une base conductrice (320) de piliers (302) conducteurs reliée à un des éléments de contact (212) ;
- la formation d’au moins une portion conductrice (306) des piliers agencée sur la base conductrice (320), la base conductrice étant dotée d’une malléabilité supérieure à celle de la portion conductrice (306).A method of manufacturing an electronic circuit (100) comprising an electronic chip (104) comprising contact elements (212), the method comprising:
- the formation of a conductive base (320) of conductive pillars (302) connected to one of the contact elements (212);
- the formation of at least one conductive portion (306) of the pillars arranged on the conductive base (320), the conductive base being endowed with greater malleability than that of the conductive portion (306).
- créant des ouvertures (420) dans une couche sacrificielle (418) agencé sur la puce électronique du côté de ses éléments de contact, lesdites ouvertures débouchant chacune sur un desdits éléments de contact ;
- faisant croître la base conductrice (320) des piliers à partir des éléments de contacts (212) ;
procédé dans lequel la formation de la portion conductrice (306) est obtenue en faisant croître la portion conductrice (306) à partir de la base conductrice (320) dans lesdites ouvertures (420);
procédé dans lequel la formation de la portion d’extrémité (308) est obtenue en faisant croître la portion d’extrémité à partir de la portion conductrice (306) dans lesdites ouvertures ;
la couche sacrificielle (418) étant retirée après la formation de la portion d’extrémité (308).Method according to claim 14, wherein the formation of the conductive base (320), the conductive portion (306) and the end portion (308) is obtained by:
- creating openings (420) in a sacrificial layer (418) arranged on the electronic chip on the side of its contact elements, said openings each opening onto one of said contact elements;
- growing the conductive base (320) of the pillars from the contact elements (212);
method in which the formation of the conductive portion (306) is obtained by growing the conductive portion (306) from the conductive base (320) in said openings (420);
method in which the formation of the end portion (308) is obtained by growing the end portion from the conductive portion (306) in said openings;
the sacrificial layer (418) being removed after the end portion (308) is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR2113049A FR3130085A1 (en) | 2021-12-07 | 2021-12-07 | Electric circuit |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR2113049 | 2021-12-07 | ||
| FR2113049A FR3130085A1 (en) | 2021-12-07 | 2021-12-07 | Electric circuit |
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| FR3130085A1 true FR3130085A1 (en) | 2023-06-09 |
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| FR2113049A Pending FR3130085A1 (en) | 2021-12-07 | 2021-12-07 | Electric circuit |
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|---|---|---|---|---|
| US20050214971A1 (en) * | 2004-03-26 | 2005-09-29 | Ching-Fu Hung | Bumping process, bump structure, packaging process and package structure |
| US20100314161A1 (en) * | 2009-06-10 | 2010-12-16 | Hueng Jae Oh | Substrate for flip chip bonding and method of fabricating the same |
| US20130241071A1 (en) * | 2012-03-16 | 2013-09-19 | Stats Chippac, Ltd. | Semiconductor Device and Method of Forming Compliant Conductive Interconnect Structure in Flipchip Package |
| US20140035131A1 (en) * | 2012-07-31 | 2014-02-06 | Boin Noh | Semiconductor devices having multi-bump electrical interconnections and methods for fabricating the same |
| US20150041985A1 (en) * | 2013-08-06 | 2015-02-12 | Stats Chippac, Ltd. | Semiconductor Device and Method of Making Wafer Level Chip Scale Package |
| US20200251432A1 (en) * | 2019-01-31 | 2020-08-06 | United Microelectronics Corporation | Semiconductor apparatus and method for manufacturing semiconductor apparatus |
-
2021
- 2021-12-07 FR FR2113049A patent/FR3130085A1/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050214971A1 (en) * | 2004-03-26 | 2005-09-29 | Ching-Fu Hung | Bumping process, bump structure, packaging process and package structure |
| US20100314161A1 (en) * | 2009-06-10 | 2010-12-16 | Hueng Jae Oh | Substrate for flip chip bonding and method of fabricating the same |
| US20130241071A1 (en) * | 2012-03-16 | 2013-09-19 | Stats Chippac, Ltd. | Semiconductor Device and Method of Forming Compliant Conductive Interconnect Structure in Flipchip Package |
| US20140035131A1 (en) * | 2012-07-31 | 2014-02-06 | Boin Noh | Semiconductor devices having multi-bump electrical interconnections and methods for fabricating the same |
| US20150041985A1 (en) * | 2013-08-06 | 2015-02-12 | Stats Chippac, Ltd. | Semiconductor Device and Method of Making Wafer Level Chip Scale Package |
| US20200251432A1 (en) * | 2019-01-31 | 2020-08-06 | United Microelectronics Corporation | Semiconductor apparatus and method for manufacturing semiconductor apparatus |
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