FR3105718B1 - System for cooling an electronic device and electronic system comprising such a cooling system - Google Patents

System for cooling an electronic device and electronic system comprising such a cooling system Download PDF

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Publication number
FR3105718B1
FR3105718B1 FR1915592A FR1915592A FR3105718B1 FR 3105718 B1 FR3105718 B1 FR 3105718B1 FR 1915592 A FR1915592 A FR 1915592A FR 1915592 A FR1915592 A FR 1915592A FR 3105718 B1 FR3105718 B1 FR 3105718B1
Authority
FR
France
Prior art keywords
cooling
electronic device
face
wall
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1915592A
Other languages
French (fr)
Other versions
FR3105718A1 (en
Inventor
Pierre Smal
Emmanuel Talon
Arnaud Coia
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Systemes de Controle Moteur SAS
Original Assignee
Valeo Systemes de Controle Moteur SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Systemes de Controle Moteur SAS filed Critical Valeo Systemes de Controle Moteur SAS
Priority to FR1915592A priority Critical patent/FR3105718B1/en
Publication of FR3105718A1 publication Critical patent/FR3105718A1/en
Application granted granted Critical
Publication of FR3105718B1 publication Critical patent/FR3105718B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20872—Liquid coolant without phase change
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/60—Other road transportation technologies with climate change mitigation effect
    • Y02T10/70—Energy storage systems for electromobility, e.g. batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/60—Other road transportation technologies with climate change mitigation effect
    • Y02T10/7072—Electromobility specific charging systems or methods for batteries, ultracapacitors, supercapacitors or double-layer capacitors

Abstract

L’invention concerne un système de refroidissement (700’’) d’un composant électronique (T10) d’un dispositif électronique (400) comprenant un boitier (100) comprenant au moins une paroi, une première face de ladite paroi étant tournée vers l’extérieur dudit boîtier (100) et une deuxième face (130) de ladite paroi étant tournée vers l’intérieur dudit boitier (100), ledit boîtier (100) comprenant une cavité (150) formée dans ladite paroi du côté de ladite deuxième face (130), et un capot de séparation (200) en appui sur ladite deuxième face (130) et fixé à ladite paroi de sorte à fermer ladite cavité (150) et à délimiter un premier volume du boitier (100) dans lequel un fluide de refroidissement est destiné à circuler par rapport à un deuxième volume du boitier (100) dans lequel est destiné à être positionné ledit dispositif électronique (400), ledit capot de séparation (200) comportant un dissipateur thermique (200) destiné à refroidir au moins ledit composant électronique (T10) dudit dispositif électronique (400), ledit dissipateur thermique (200) comportant au moins une ailette (220), ladite au moins une ailette (220) s’étendant dans ledit premier volume. Figure pour l’abrégé : Figure 1The invention relates to a cooling system (700'') for an electronic component (T10) of an electronic device (400) comprising a case (100) comprising at least one wall, a first face of said wall facing the exterior of said casing (100) and a second face (130) of said wall facing the interior of said casing (100), said casing (100) comprising a cavity (150) formed in said wall on the side of said second face (130), and a separation cover (200) resting on said second face (130) and fixed to said wall so as to close said cavity (150) and to delimit a first volume of the case (100) in which a cooling fluid is intended to circulate relative to a second volume of the case (100) in which said electronic device (400) is intended to be positioned, said separation cover (200) comprising a heat sink (200) intended to cool the minus said electronic component (T10) of said d electronic device (400), said heat sink (200) including at least one fin (220), said at least one fin (220) extending into said first volume. Figure for abstract: Figure 1

FR1915592A 2019-12-24 2019-12-24 System for cooling an electronic device and electronic system comprising such a cooling system Active FR3105718B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR1915592A FR3105718B1 (en) 2019-12-24 2019-12-24 System for cooling an electronic device and electronic system comprising such a cooling system

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1915592 2019-12-24
FR1915592A FR3105718B1 (en) 2019-12-24 2019-12-24 System for cooling an electronic device and electronic system comprising such a cooling system

Publications (2)

Publication Number Publication Date
FR3105718A1 FR3105718A1 (en) 2021-06-25
FR3105718B1 true FR3105718B1 (en) 2022-03-11

Family

ID=70154606

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1915592A Active FR3105718B1 (en) 2019-12-24 2019-12-24 System for cooling an electronic device and electronic system comprising such a cooling system

Country Status (1)

Country Link
FR (1) FR3105718B1 (en)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020162673A1 (en) * 2001-05-03 2002-11-07 Cook Derrick E. Use of doped synthetic polymer materials for packaging of power electric assemblies for a liquid cooled module
FR2861894B1 (en) * 2003-10-31 2008-01-18 Valeo Equip Electr Moteur DEVICE FOR COOLING A POWER ELECTRONIC
JP4797077B2 (en) * 2009-02-18 2011-10-19 株式会社日立製作所 Semiconductor power module, power converter, and method for manufacturing semiconductor power module
DE112015000024B4 (en) * 2015-03-30 2017-03-02 Komatsu Ltd. Coolant discharge mechanism of a housing, power storage device and construction machine

Also Published As

Publication number Publication date
FR3105718A1 (en) 2021-06-25

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