FR3098079B1 - Procédé d’intégration d’un caloduc à une plaque destinée à former un contact électrique - Google Patents
Procédé d’intégration d’un caloduc à une plaque destinée à former un contact électrique Download PDFInfo
- Publication number
- FR3098079B1 FR3098079B1 FR1907133A FR1907133A FR3098079B1 FR 3098079 B1 FR3098079 B1 FR 3098079B1 FR 1907133 A FR1907133 A FR 1907133A FR 1907133 A FR1907133 A FR 1907133A FR 3098079 B1 FR3098079 B1 FR 3098079B1
- Authority
- FR
- France
- Prior art keywords
- heat pipe
- integrating
- electrical contact
- groove
- plate intended
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title abstract 3
- 238000005452 bending Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
- F28F13/12—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4878—Mechanical treatment, e.g. deforming
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2225/00—Reinforcing means
- F28F2225/04—Reinforcing means for conduits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
- F28F2255/08—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes pressed; stamped; deep-drawn
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Sustainable Development (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
L’invention concerne un procédé d’intégration d’un caloduc à une plaque (20) destinée à former un contact électrique au sein d’un ou plusieurs appareils électriques, le procédé comprenant :a) une étape de formation d’une gorge sur une face principale d’une plaque (20) métallique ;b) une étape de positionnement d’une première section d’un tube (11) de caloduc (10), de diamètre D, dans la gorge, la première section s’étendant à partir d’une première extrémité dudit tube ;c) une étape de pliage de la plaque (20) de manière à refermer la gorge et ainsi enserrer la première section dans ladite gorge. Figure pour l’abrégé : figure 2d .
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1907133A FR3098079B1 (fr) | 2019-06-28 | 2019-06-28 | Procédé d’intégration d’un caloduc à une plaque destinée à former un contact électrique |
EP20181973.7A EP3731613B1 (fr) | 2019-04-25 | 2020-06-24 | Procédé d'intégration d'un caloduc à une plaque destinée à former un contact électrique |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1907133 | 2019-06-28 | ||
FR1907133A FR3098079B1 (fr) | 2019-06-28 | 2019-06-28 | Procédé d’intégration d’un caloduc à une plaque destinée à former un contact électrique |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3098079A1 FR3098079A1 (fr) | 2021-01-01 |
FR3098079B1 true FR3098079B1 (fr) | 2022-04-01 |
Family
ID=68343059
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1907133A Active FR3098079B1 (fr) | 2019-04-25 | 2019-06-28 | Procédé d’intégration d’un caloduc à une plaque destinée à former un contact électrique |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR3098079B1 (fr) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5826645A (en) * | 1997-04-23 | 1998-10-27 | Thermal Corp. | Integrated circuit heat sink with rotatable heat pipe |
US20110162206A1 (en) * | 2010-01-07 | 2011-07-07 | Shyh-Ming Chen | Method for connecting heat-dissipating fin and heat pipe |
WO2015098824A1 (fr) * | 2013-12-24 | 2015-07-02 | 古河電気工業株式会社 | Structure de réception de chaleur et dissipateur thermique |
-
2019
- 2019-06-28 FR FR1907133A patent/FR3098079B1/fr active Active
Also Published As
Publication number | Publication date |
---|---|
FR3098079A1 (fr) | 2021-01-01 |
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Legal Events
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PLFP | Fee payment |
Year of fee payment: 2 |
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PLSC | Publication of the preliminary search report |
Effective date: 20210101 |
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Year of fee payment: 3 |
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PLFP | Fee payment |
Year of fee payment: 4 |
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PLFP | Fee payment |
Year of fee payment: 5 |