FR3091015B1 - ELECTRONIC MODULE, ELECTRONIC CARD AND ASSOCIATED METHODS - Google Patents

ELECTRONIC MODULE, ELECTRONIC CARD AND ASSOCIATED METHODS Download PDF

Info

Publication number
FR3091015B1
FR3091015B1 FR1873285A FR1873285A FR3091015B1 FR 3091015 B1 FR3091015 B1 FR 3091015B1 FR 1873285 A FR1873285 A FR 1873285A FR 1873285 A FR1873285 A FR 1873285A FR 3091015 B1 FR3091015 B1 FR 3091015B1
Authority
FR
France
Prior art keywords
electronic
associated methods
substrate
electronic module
card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1873285A
Other languages
French (fr)
Other versions
FR3091015A1 (en
Inventor
Benjamin Touzet
Thomas Edwiges
Stéphane Guenot
Jean-Claire Pradier
Eric Soulhol
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Safran Electrical and Power SAS
Original Assignee
Zodiac Aero Electric SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zodiac Aero Electric SAS filed Critical Zodiac Aero Electric SAS
Priority to FR1873285A priority Critical patent/FR3091015B1/en
Publication of FR3091015A1 publication Critical patent/FR3091015A1/en
Application granted granted Critical
Publication of FR3091015B1 publication Critical patent/FR3091015B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601—Structure
    • H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Combinations Of Printed Boards (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

Le module électronique pour aéronef comprenant un substrat (7) destiné à être fixé sur une carte d’un circuit contrôleur de puissance à semi-conducteurs (SSPC). Il comprend une pluralité de puces (8) montées sur le substrat et surmontées d’un élément de protection, lesdites puces étant destinées à être connectées à la carte par l’intermédiaire du substrat. Figure pour l’abrégé : Fig 2The electronic module for aircraft comprising a substrate (7) intended to be fixed on a board of a semiconductor power controller circuit (SSPC). It comprises a plurality of chips (8) mounted on the substrate and surmounted by a protection element, said chips being intended to be connected to the card via the substrate. Figure for abstract: Fig 2

FR1873285A 2018-12-19 2018-12-19 ELECTRONIC MODULE, ELECTRONIC CARD AND ASSOCIATED METHODS Active FR3091015B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR1873285A FR3091015B1 (en) 2018-12-19 2018-12-19 ELECTRONIC MODULE, ELECTRONIC CARD AND ASSOCIATED METHODS

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1873285A FR3091015B1 (en) 2018-12-19 2018-12-19 ELECTRONIC MODULE, ELECTRONIC CARD AND ASSOCIATED METHODS
FR1873285 2018-12-19

Publications (2)

Publication Number Publication Date
FR3091015A1 FR3091015A1 (en) 2020-06-26
FR3091015B1 true FR3091015B1 (en) 2022-07-15

Family

ID=66641059

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1873285A Active FR3091015B1 (en) 2018-12-19 2018-12-19 ELECTRONIC MODULE, ELECTRONIC CARD AND ASSOCIATED METHODS

Country Status (1)

Country Link
FR (1) FR3091015B1 (en)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6475830B1 (en) * 2000-07-19 2002-11-05 Cisco Technology, Inc. Flip chip and packaged memory module
JP6076865B2 (en) * 2013-09-02 2017-02-08 ルネサスエレクトロニクス株式会社 Electronic equipment
US10002829B2 (en) * 2015-11-30 2018-06-19 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor device and manufacturing method thereof

Also Published As

Publication number Publication date
FR3091015A1 (en) 2020-06-26

Similar Documents

Publication Publication Date Title
ATE381248T1 (en) FLEXIBLE INTERMEDIATE CIRCUIT STRUCTURES FOR ELECTRICAL DEVICES AND LIGHT SOURCES WITH SUCH STRUCTURES
DE602004021682D1 (en) BY USING MULTILAYER ORGANIC LNTE
SE9702923L (en) Mounting structure for a power transistor module
SE9902300D0 (en) Device for chip mounting in multilayer PCBs
FR2963478B1 (en) SEMICONDUCTOR DEVICE COMPRISING A PASSIVE COMPONENT OF CAPACITORS AND METHOD FOR MANUFACTURING SAME
FR2792803B1 (en) CARD-MOUNTED SEMICONDUCTOR DEVICE
TW200721432A (en) Semiconductor device, fabrication method therefor, and film fabrication method
ATE356541T1 (en) ELECTRONIC POWER SYSTEM WITH PASSIVE COOLING
CY1108717T1 (en) PROCEDURE TO INSTALL A COMPUTER ON A SUBSTRATE AND TO INSTALL A COMPUTER INSTALLATION
DE602004016558D1 (en) COOLING SYSTEM FOR COOLING HEAT-GENERATING DEVICES IN A PLANE
JPS5772349A (en) Semiconductor integrated circuit device
EP1508917A3 (en) Semiconductor integrated circuit
MY201016A (en) Integrated Bridge for Die-to-Die Interconnects
WO2017050047A1 (en) Chipset and electronic device
FR3091015B1 (en) ELECTRONIC MODULE, ELECTRONIC CARD AND ASSOCIATED METHODS
TW200640349A (en) Electronic device
DE602006020484D1 (en) DEVICE COMPRISING A SUBSTRATE WITH AN ELECTRICAL CONTACT AND TRANSPONDER
US8861219B2 (en) Printed circuit board for providing operation voltages
FR3083642B1 (en) ENCAPSULATION STRUCTURE OF A FEED DEVICE
ATE300165T1 (en) ELECTRONIC DEVICE
MY198129A (en) Thermoelectric bonding for integrated circuits
ATE357741T1 (en) POWER SEMICONDUCTOR MODULE WITH SENSOR COMPONENT
FR3085575B1 (en) ELECTRONIC CHIP BOX
FR3089056B1 (en) Electronic device comprising a support substrate and electronic chips, stacked
FR3074012B1 (en) ELECTRONIC POWER MODULE

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 2

PLSC Publication of the preliminary search report

Effective date: 20200626

PLFP Fee payment

Year of fee payment: 3

CD Change of name or company name

Owner name: SAFRAN ELECTRICAL & POWER, FR

Effective date: 20210819

TP Transmission of property

Owner name: SAFRAN ELECTRICAL & POWER, FR

Effective date: 20210819

PLFP Fee payment

Year of fee payment: 4

PLFP Fee payment

Year of fee payment: 5

PLFP Fee payment

Year of fee payment: 6