FR3068535B1 - Convertisseur de tension comportant un module d'excitation d'un rotor d'un machine electrique - Google Patents

Convertisseur de tension comportant un module d'excitation d'un rotor d'un machine electrique Download PDF

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Publication number
FR3068535B1
FR3068535B1 FR1755947A FR1755947A FR3068535B1 FR 3068535 B1 FR3068535 B1 FR 3068535B1 FR 1755947 A FR1755947 A FR 1755947A FR 1755947 A FR1755947 A FR 1755947A FR 3068535 B1 FR3068535 B1 FR 3068535B1
Authority
FR
France
Prior art keywords
electric machine
excitation
voltage converter
rotor
excitation module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1755947A
Other languages
English (en)
Other versions
FR3068535A1 (fr
Inventor
Manuel Falguier
Romain Henneguet
Ludovic Bodin
Michael Chemin
Yann Lecocq
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Equipements Electriques Moteur SAS
Original Assignee
Valeo Equipements Electriques Moteur SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Equipements Electriques Moteur SAS filed Critical Valeo Equipements Electriques Moteur SAS
Priority to FR1755947A priority Critical patent/FR3068535B1/fr
Publication of FR3068535A1 publication Critical patent/FR3068535A1/fr
Application granted granted Critical
Publication of FR3068535B1 publication Critical patent/FR3068535B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/30—Structural association with control circuits or drive circuits
    • H02K11/33—Drive circuits, e.g. power electronics
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/04—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for rectification
    • H02K11/049—Rectifiers associated with stationary parts, e.g. stator cores
    • H02K11/05—Rectifiers associated with casings, enclosures or brackets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H05K7/14329—Housings specially adapted for power drive units or power converters specially adapted for the configuration of power bus bars
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Control Of Ac Motors In General (AREA)

Abstract

Le convertisseur de tension (104) comporte : - au moins un module de puissance (110) conçu pour effectuer une conversion entre la tension continue et au moins une des tensions de phase ; - une carte électronique de commande du ou des modules de puissance (110) ; et - un module d'excitation (210) conçu pour convertir la tension continue en une tension d'excitation et pour fournir la tension d'excitation à un collecteur tournant (208) de la machine électrique (130). Le module d'excitation (210) est détaché de la carte électronique et connecté au collecteur tournant (208) de la machine électrique (130) par des connexions électriques détachées de la carte électronique.
FR1755947A 2017-06-28 2017-06-28 Convertisseur de tension comportant un module d'excitation d'un rotor d'un machine electrique Active FR3068535B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR1755947A FR3068535B1 (fr) 2017-06-28 2017-06-28 Convertisseur de tension comportant un module d'excitation d'un rotor d'un machine electrique

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1755947A FR3068535B1 (fr) 2017-06-28 2017-06-28 Convertisseur de tension comportant un module d'excitation d'un rotor d'un machine electrique
FR1755947 2017-06-28

Publications (2)

Publication Number Publication Date
FR3068535A1 FR3068535A1 (fr) 2019-01-04
FR3068535B1 true FR3068535B1 (fr) 2020-12-11

Family

ID=60382288

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1755947A Active FR3068535B1 (fr) 2017-06-28 2017-06-28 Convertisseur de tension comportant un module d'excitation d'un rotor d'un machine electrique

Country Status (1)

Country Link
FR (1) FR3068535B1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3098042B1 (fr) * 2019-06-26 2021-08-27 Valeo Equip Electr Moteur Systeme de moteur electrique a rotor bobine

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4580999B2 (ja) * 2008-03-19 2010-11-17 日立オートモティブシステムズ株式会社 モータのコントロールユニット
JP5904235B2 (ja) * 2014-05-30 2016-04-13 トヨタ自動車株式会社 電動車両用の電力変換器
FR3026602B1 (fr) * 2014-09-30 2018-01-19 Valeo Siemens Eautomotive France Sas Dispositif electrique modulaire ou chaque module est destine a etre fixe a un support respectif, et systeme electrique comportant un tel dispositif electrique

Also Published As

Publication number Publication date
FR3068535A1 (fr) 2019-01-04

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