FR3043821A1 - INHIBITION OF THE CONTACTLESS INTERFACE - Google Patents

Abstract

Microcircuit device (1) comprising a support (2), a microcircuit (4) arranged in the support (2), and a contactless interface comprising an antenna (5) comprising a linear conductor (6), where a portion (7) ) of the conductor (6) is specifically adapted to be removable, over the entire section of the conductor (6).

Description

The present invention relates to a microcircuit device comprising a contactless interface.

Such a contactless interface is advantageous in that it makes it possible to release certain constraints, in particular positioning accuracy or range, during use of the device, in connection with a reader, for a transaction. On the other hand, a contactless interface raises concerns of fraudulent use with certain users. Also in order to reassure these users, it is desired, at least for dual devices (having an alternative interface, typically contact, in addition to the contactless interface), to have a means for inhibiting the contactless interface.

It is known to inhibit the contactless interface by modifying the software contained in the microcircuit. Such a solution is satisfactory but has some disadvantages. This solution requires complex tools such as a reader to communicate with the device and software for modifying the software contained in the microcircuit. On the other hand, the security of such a device is generally critical (e.g. bank card). The solution then requires cryptographic material to which access is strictly controlled. In this case, the solution can only be implemented within the complex framework of a secure environment and therefore only by a few actors, including the microcircuit device delivery organization and / or the manufacturer of said device. Although the complexity and the security of the environment guarantee the inhibition, the latter remains technically reversible. Such inhibition is, by nature, invisible. This can be a psychological barrier for a worried user.

Therefore, it is sought for a microcircuit device, a means of inhibiting the contactless interface does not have the disadvantages of the prior art.

Such a means is advantageously irreversible. This means must typically be able to be implemented by the delivery device of the microcircuit device, or even more preferably by the end user himself. Also this means is still advantageously able to be implemented in a simple manner, without specific tools, or even better without tools. The invention relates to a microcircuit device comprising a support, a microcircuit disposed in the support, and a contactless interface comprising an antenna comprising a linear conductor, and a portion of the conductor is specifically adapted to be able to be removed, on the entire section of the driver.

According to another characteristic, the deletion of the portion is irreversible, without addition of element.

According to another characteristic, the device comprises, in line with the portion, a substantially through hole with the exception of the portion, so that an introduction of a tool into the hole allows to remove the portion.

According to another characteristic, the portion is made of heat fusible material, preferably at a temperature between 80 and 120 °, more preferably at a temperature of 100 °.

According to another feature, the portion is flanked by two accessible electrical contact points.

According to another feature, the portion comprises a through via at least a portion of the thickness of the support.

According to another characteristic, the portion is arranged flush with one of the surfaces of the support.

According to another characteristic, the device further comprises a module comprising the microcircuit, the portion is disposed flush with the external surface of the module and preferably, the module further comprising a contact plate, the portion is disposed in one of the unassigned contacts.

According to another characteristic, the portion is disposed in an area of the outer surface of the module without metal.

According to another feature, the support has a main plane extension and said portion is disposed near an edge of the support.

According to another feature, said portion is disposed in a cavity formed in the thickness of the support.

According to another characteristic, the device further comprises a plug adapted to close said cavity.

According to another characteristic, the device further comprises a module comprising the microcircuit, and the portion is disposed at the interface between the support and the module.

According to another characteristic, the portion is disposed substantially perpendicular to the module contour and preferably flush with the laying surface of the contact plate.

According to another feature, the portion is weakened to facilitate mechanical destruction.

According to another characteristic, the conductor has an interruption, and the portion comprises a conductive tab ensuring electrical contact between the two ends of the interruption and fixed to the device by means of at least one adhesive, so that the portion forms a shunt removable.

According to another characteristic, the support comprises an embrittlement at the right of the portion to allow a rupture of the support, preferably without tools, said rupture achieving a deletion of the portion. The invention also relates to a module comprising a microcircuit, for a microcircuit device comprising a contactless interface comprising an antenna comprising a linear conductor, where a portion of the conductor is arranged flush with the external surface of the module and is specifically adapted to be suitable to be deleted, over the entire section of the driver. Other characteristics, details and advantages of the invention will emerge more clearly from the detailed description given below as an indication in relation to drawings in which: FIG. 1 shows a microcircuit device comprising a contactless interface, seen from FIG. 2 shows a detail of the device of FIG. 1, in section AA, FIG. 3 shows a device with a microcircuit comprising an interface without an interface, FIG. FIG. 4 shows a detail of the device of FIG. 3, in section BB, FIGS. 5a, 5b a module and an embodiment where the suppressible portion is disposed on the module, respectively in front view and in profile view, FIGS. 6a, 6b show the interface in being a module and a support, and illustrates several embodiments, respectively in front view and in profile view, FIGS. 7a, 7b show a removable shunt, respectively in bottom view and in profile view, FIG. a microcircuit device comprising a contactless interface, viewed from the front, and illustrates another embodiment of an inhibition means, - Figures 9 and 10 show a detail of the device of Figure 8, in a section CC. The invention relates to a device 1 with a microcircuit comprising a contactless interface.

Such a device 1 may be: a wireless transponder (RFID); a smart card, such as a bank card, a social insurance card, an electronic passport, a telephone subscription card (SIM); a secure memory, such as a microcircuit USB key, a microcircuit SD card, or any other equivalent device. A device 1 with a microcircuit, as illustrated, for example, in FIGS. 1 and 3, comprises a support 2 and a microcircuit 4 arranged in the support 2.

The support 2 can be a plastic card according to the ISO 7812 standard. Other form factors: SIM card, USB key, SD memory card, etc., are possible. The invention applies more particularly to a dual device 1, comprising in addition to a contactless interface, another alternative interface, such as a contact interface, so that the microcircuit 4 maintains an interface enabling it to communicate with the device. outside, after inhibition of the contactless interface. The invention is more particularly intended for a microcircuit device applied to banking applications and still referred to as a bank card. With such a bank card some payment procedures, especially for small amounts, are accessible through a contactless interface, and are the main cause of concern of some users. However, the invention can be applied to any microcircuit device 1 comprising a contactless interface.

A non-contact interface typically comprises an antenna 5 constituted by a linear electrical conductor 6 of small cross-section wound in turns and connected at its two ends to two terminals of the microcircuit 4. Such a conductor 6 can typically be made by a conductive wire or by a linear deposit of a conductive material, such as an ink. The antenna 5 is disposed mainly in the support 2.

Alternatively, the antenna 5 can be entirely arranged in a module 3. In this case, only some of the embodiments of an inhibition means are applicable: those described above, relating to a portion 7 arranged in the module 3 or the contact plate 19.

It is known that at least one interruption of the conductor 6 of the antenna 5 is sufficient to detune said antenna 5 and make it impossible to use the contactless interface. This feature is exploited according to the invention by removing a portion 7 of the conductor 6. This deletion can be on a very short length of conductor 6, of the order of a tenth of a millimeter, but it is appropriate that the continuity, in the sense electrical, driver 6 is interrupted. For this, the deleted portion 7 must cover the section of the conductor 6 in its entirety, ie transversely to the direction of linear elongation of the conductor 6. Thus the resistance of the antenna 5 is significantly modified, thus significantly modifying the tuning frequency of the antenna 5 and making impossible any agreement at the usual frequency expected of a device 1 by a reader.

The deletion of the portion 7 is advantageously carried out in such a way as to be irreversible or difficult to reverse. Thus a return back, to restore the deleted portion 7, should be possible only by means of a complex operation and typically requiring an addition of at least one element, such as a replacement element. Such irreversibility is not, stricto sensu, obligatory, but constitutes an advantage, in the objective sought to reassure a user.

Many embodiments are possible to achieve such a deletion of a portion 7. The general principle is to specifically adapt said portion 7 to make said portion 7 accessible or susceptible to a means to remove it.

Depending on the accessibility mode or the susceptibility mode, a family of solutions emerges. Also, the various embodiments are described in families, with at least one illustrative example per family. It is still possible to mix the solutions of several families.

A first family comprises devices which is applied at least one modification mainly affecting the support 2, in order to make a portion 7 physically accessible, in order to be able to remove it, typically mechanically.

An illustrative example of such a family is illustrated in Figures 1 and 2. The support 2 is modified in that it is practiced, in line with the portion 7 of the conductor 6, a hole 8 substantially through the thickness of the support 2. Whatever its embodiment, as more particularly visible in Figure 2, this hole 8 spare the driver 6 remains identically preserved including the portion 7 suppressible which is an exception to the hole 8. The driver 6, at the portion 7, is placed across the hole 8. Thus the introduction of a tool 9 penetrating into the hole 8 allows to break the portion 7 of the conductor 6 to the right of the hole 8 and thus to remove the 7. Considering the condition described above, a complete section of the conductor 6 must be opposite the hole 8 in order to be deleted in its entirety. This is easy in view of the dimensions reduced to a few tenths of millimeters of the section of a conductor 6. Thus a suitable hole, can allow to use any tip, such as for example an end of a paper clip, as a tool 9.

The term "substantially" in that it qualifies the "through" aspect of the hole 8 in claim 3 deserves precision. Said hole 8 can be effectively opening on both sides of the support 2. However, it can only open on one side to form an opening allowing introduction of the tool 9. In addition it must provide a minimum clearance behind the portion 7, the opposite side to the opening, to allow the tool 9 to cross the portion 7 to break / remove.

Another illustrative example of this same family is illustrated in Figures 8-10. The support 2 is modified in that it is practiced, in its edge, at the level of at least a portion 7 of the conductor 6, a cavity 8 in the thickness of the support 2. Whatever its embodiment, this cavity 8 saves the conductor 6 which remains identically preserved including at least one portion 7. The conductor 6, at said portion 7, is placed across the cavity 8. Thus, as shown in FIG. FIG. 9, the introduction of a tool 9 penetrating into the cavity 8 makes it possible to break said at least one portion 7 of the conductor 6 and thus to eliminate said portion 7. This embodiment is advantageous in that it makes it possible to realize a cut of the antenna 5 in several portions 7.

According to another advantageous characteristic, a plug 16 may be provided for closing, at least partially, the cavity 8. Such a closure, by a plug 16, for example of plastic or elastomer, advantageously allows to restore the structural integrity and or aesthetic of the support 2.

Another family comprises devices 1 to which at least one modification affecting mainly the conductor 6 is applied. A first sub-family comprises devices 1 to which is applied at least one modification mainly affecting the driver 6 in its material. Another subfamily comprises devices to which at least one modification is applied, mainly affecting the conductor 6 in its form.

An illustrative example of a sub-family, where the conductor 6 is modified in its material, comprises a device 1 where the portion 7 is made of thermally fusible material. In such an embodiment, the portion 7 becomes susceptible to a suppression means comprising a heat application. Such a heat application, advantageously punctual to the right of the portion 7 can melt said portion 7 and thus proceed to its removal. It is preferable that the portion 7 is disposed in an open housing, so that the molten material can escape the device 1 and thus facilitate the removal of the portion 7 and interrupt the driver 6.

Said material must initially provide conduction, so it is advantageously a conductive material, such as a metal material. The material is still mainly determined by its melting point. This temperature should not be too low so that the portion 7 does not melt untimely under possible conditions of use, even extreme, of the device 1. The inhibition must remain a voluntary operation. The melting temperature must not be too high so that the application of heat during an inhibition does not risk damaging the microcircuit 4 or the support 2, often made of plastic. Also, said melting temperature is advantageously between 80 and 120 °, and even more preferably close to 100 °.

According to a preferred embodiment, the portion 7 is advantageously arranged remote from the microcircuit 4 to limit the risk of damage to said microcircuit 4 by heat.

Heating, applied to the portion 7, advantageously in a localized manner, allows for deletion of said portion 7 by melting. Such heating can be applied in different ways.

According to a first embodiment, the heat is applied by radiation or by conduction by applying a hot source near or in contact with the portion 7. According to another embodiment, the heat is applied by convection, by means of a diffuser, for example hot air, able to send a flow of hot air towards the portion 7.

According to another embodiment, advantageously located, the heating is obtained by joule effect by applying a current across a conductor portion 6 comprising the portion 7. For this, the device 1 is such that the portion 7 is framed by two points of electrical contact capable of contacting each a touch of an electric power generator. These points are accessible, in that they constitute apparent electrical contacts, available from outside the device 1. These points are advantageously close to the nearest portion 7 to delete.

According to one embodiment, the portion 7 made of heat fusible material comprises a via 17 traversing at least a portion of the thickness of the support 2. At least one such via 17 is present on certain configurations of device 1 to allow ensure the continuity of the antenna 5, from one side of the device 1 where the antenna 5 is arranged, to the opposite side where the microcircuit 4 is arranged. Such a via 17 can thus advantageously be adapted in that it is replaced by a thermo-fusible material, in order to be able to effect an inhibition of the contactless interface.

In order to be able to evacuate the melt coming from the portion 7, during the heating, and to facilitate the deletion of the portion 7, the zone containing the portion 7, for example the via 17, is advantageously opening at least on one face of the device 1 , and preferably on both sides.

Several examples will now be given, illustrative of a sub-family where the driver 6 is modified in its form.

A first embodiment, applicable to an antenna 5, all or part of the conductor 6 is disposed in the support 2, is more particularly illustrated in Figures 3 and 4. While the conductor 6 forming the antenna 5 is usually predominantly buried in the thickness of the support 2, at least one turn of the antenna 5 is deflected / deformed so that a portion 7a comes flush with one of the surfaces 18 of the support 2. Thus said portion 7a, placed on the surface 18 of the support 2, becomes accessible. It is then easier to cut the said turn by removing the portion 7a in the flush portion, by scraping or cutting, by means of a tool, such as a cutter.

According to another embodiment, more particularly illustrated in FIGS. 5a, 5b, applicable to a device 1 comprising a module 3 comprising a contact plate 19, the portion 7 is arranged flush with the external surface of the module 3, or on the surface external of the contact plate 19. For this a conductor 6 of the antenna 5 is deflected to come into the contact plate 19, preferably so as to flush with the outer surface of said contact plate.

A module 3 is more particularly adapted to mounting on a plastic card, and comprises an assembly comprising a microcircuit 4 and typically a contact plate 19. A contact plate 19 comprises different contacts 20, here 9 in the figure, allowing to make a contact interface. The contact plate 19 is generally arranged flush with the surface 18 of the support 2. The module 3 is housed in a cavity made in the thickness of the support 2. The contact plate 19 provides protection for the microcircuit 4 which is typically arranged under the contact plate 19 in said cavity. The cavity typically comprises two steps: a first step substantially resumes the dimensions of the contact plate 19 and has a first depth substantially equal to the thickness of the single contact plate 19 and extends on the periphery of the cavity, so that the contact plate 19 rests on the bottom 30 of the first step which thus forms a laying plane 30 for the contact plate 19 and a second step, substantially centered relative to the first step, having both its contour 32 and its depth, greater dimensions than those of the microcircuit 4, to accommodate the microcircuit 4 and possible wiring, so that the microcircuit 4 does not touch the bottom 31 of said second stage.

According to this embodiment, the conductor 6 is deflected so as to come flush with the outer surface of the contact plate 19. This makes this flush part accessible. It is then easier to cut the conductor 6 by removing a portion 7 in the flush portion, by scraping or cutting, by means of a tool such as a cutter. Advantageously, the portion 7 is disposed in one of the contacts 20 of the contact plate 19. Advantageously, in order not to disturb the electrical operation of the contact interface, the portion 7 is preferably disposed in one of the contacts 21 not assigned to the contact interface. A contact plate 19 comprises a substantially rectangular metal pad. This block is cut by insulating lines in 6 or 9 pieces 20. Most of these pieces 20 form useful contacts. Others, typically the two contacts C4 and C8, within the meaning of ISO 7816, are currently reserved for future use and are therefore unaffected contacts 21. Under certain conditions the contacts C6 and central are also unaffected contacts 21.

In order to place the portion 7 in place of an unassigned contact 21, this contact 21 is at least partially demetallized to include only the conductor loop 6 comprising the portion 7. As illustrated in FIG. 5a, the conductor 6 advantageously forms a loop of which at least a portion 7 is at the surface, in order to be accessible and to be destroyed.

Thus the portion 7 is disposed in an area of the outer surface of the module 3 / of the contact plate 19 without metal. According to a first embodiment, such a de-metallized zone is made by removing the metal covering a contact 20, for example an unaffected contact 21. According to another embodiment, a demetallized zone can be made between two contiguous contacts 20, possibly widening at least one insulating line separating two contacts 20, including two affected contacts. This is made possible by the dimensional tolerances of the contacts 20.

All the unassigned contacts 21 are candidates for the reception of the portion 7. However, the deletion of the portion 7 being performed by means of a blunt or cutting tool with a possible support, it is preferred a contact 21 having no component, such as the microcircuit 4 below him, to avoid any risk of deterioration of the latter. Thus it is preferred a peripheral contact 21 to the central contact.

Moreover, the portion 7 is advantageously disposed close to the periphery of the contact plate 19, outside the contour 32 of the second step, in order to be located above the cavity accommodating the module 3 in an area where the cavity has its first depth and where the contact plate 19 rests on the bottom 30 of the first stage of the cavity. Thus, any support with the tool for removing the portion 7 on the outer surface of the contact plate 19 is less likely to deform the contact plate 19.

According to another embodiment, more particularly illustrated in FIG. 3, more particularly adapted to the case where the support 2 has a main plane extension, or in the cases where the support 2 comprises a card (ISO 7816 plastic card, SIM card, SD card, Etc.) / · the portion 7 is advantageously disposed near an edge 22 of the support 2. This is more particularly illustrated, in three embodiments, by the portions 7b, 7c and 7d. Thus the deletion of the portion 7b, 7c, 7d can be achieved by scraping, trimming, or cutting the support 2, together the portion 7b, 7c, 7d on its edge on a small extension. This advantageously eliminates only a very small portion of the support 2, virtually invisible in the case of trimming or scraping.

The deletion of a portion 7b can be achieved by trimming or scraping the edge 22 of the support to the right of the portion 7b, in the form 15b, to cut the conductor 6 at the portion 7b. Trimming or scraping can be done by milling.

The deletion of a portion 7c can be achieved by a cut along a cutting line 15c substantially perpendicular to the main extension, to cut the conductor 6 at the portion 7c.

The suppression of a portion 7d, adapted in a corner of the support 2, can be achieved by a cut along a cutting line 15d cutting a corner of the support 2.

According to another embodiment, more particularly illustrated in FIGS. 6a and 6b, it is taken advantage of the fact that a gap 33 exists between the external contour of a module 3 and the internal contour facing the cavity in which the module 3 takes place. In addition, an antenna 5 disposed on the support 2 being connected to the terminals of a microcircuit 4 disposed in the module 3, the conductor 6 necessarily traverses at least twice said gap 33.

Thus a passage of a thin cutting tool, such as a cutter, in the gap 33, which has a width of the order of one tenth of a mm, may allow cutting said conductor 6. The gap 33 advantageously guides the cutter during the cutting operation. According to another advantageous characteristic, the conductor 6 is positioned so as to be flush with the laying surface of the contact plate 19. As illustrated in FIGS. 6a, 6b, a device 1 comprises two metal blocks 23, 24 which can be solid 23 or alternatively made by means of a coil 24 wire. These blocks 23,24 make it possible to make the electrical connection between the antenna 5 and the module 3 when the module 3 is placed in the cavity.

Thus it is possible, in this mode, to perform an inhibition of the antenna 5, directly by cutting the conductor 6 at the level of at least one of these two blocks 23,24. Each such block 23,24 thus forms a portion 7a deleteable. This is quite satisfactory for a pad 24 made by means of a coil where a cut through the pad 24 causes an adequate interruption of continuity.

However, in the case of a solid paver 23, even after a clean cut, a bending of the support 2 can restore an electrical contact. Also inhibition is not systematically guaranteed. In this case, according to an alternative embodiment, between block 23, 24 and antenna 5, or alternatively between block 23, 24 and microcircuit 4, there may be a deflection of conductor 6 in order to passing it opposite said gap 33 and advantageously flush with the laying surface 30 of the contact plate 19, to form a portion 7b able to be removed by cutting. This deflection 25 can take the simple form of a loop, thus ensuring a double cut, or the shape of a coil, allowing a multiple cut. In all cases this portion 7b is disposed facing the gap 33 between the support 2 and the module 3 and flush with the surface 30 of the contact plate 19.

In order to favor a clean cut of the portion 7a, 7b, the conductor 6 or conductors forming said portion 7a, 7b, or the conductor (s) 6 disposed (s) under the gap 33 is / are advantageously arranged (s) ) substantially perpendicular (s) to the gap 33, is perpendicular to the contour of the module 3.

For all the embodiments described above, particularly those where the portion 7,7a, 7b, 7c, 7d is mechanically removed by scraping, trimming or cutting, the portion 7,7a, 7b, 7c, 7d may advantageously be weakened, so to facilitate its destruction. This embrittlement is typically achieved by reducing one of the dimensions: thickness or preferably width of the conductor 6 at the portion 7.7a, 7b, 7c, 7d. Thus a scraping or cutting makes it easier to cut the driver 6.

For all the embodiments described above, particularly those in which the portion 7, 7a, 7b, 7c, 7d is mechanically removed by breaking, scraping, trimming or cutting, the deletable portion 7, 7a, 7b, 7c, 7d may alternatively advantageously as shown in Figures 7a, 7b, by means of a conductive tab 11 forming a removable shunt. In this case, a conductor 6 is adapted to present an interruption 10, with two ends 12, 13 of the interruption 10. The conductive tab 11 is adapted to be arranged so as to electrically connect the two ends 12, 13 together. For this, the conductive tongue 11 is provided with at least one adhesive 14, so as to ensure that the conductive tongue 11 is secured to the device 1 and electrical contact is made between the conductive tongue 11 and each of the two ends 12, 13 of such to electrically close said interruption 10.

According to one embodiment, the adhesive 14 is advantageously conductive, particularly if it is placed in line with the electrical contact between the conductive tongue 11 and an end 12, 13. The adhesive 14 is able to be peeled off, thus allowing removal of the conductive tongue 11 and an opening of the conductor 6 at the level of the interruption 10. A shunt is thus formed, initially in place through the interruption 10 so as to ensure electrical contact, and able to be removed by taking off the conductive tongue 11, thus ensuring a removal of the portion 7 of conductor 6 formed by said conductive tongue 11. A withdrawal, by takeoff, of the conductive tongue 11 thus performs the inhibition of the wireless interface.

It should be noted that this embodiment is applicable both for a conductor 6 disposed on the support 2 itself, as for a conductor 6 disposed on another support, such as for example the module 3, and more particularly the contact plate 19.

According to another characteristic applicable to the embodiments previously described, the support 2, at the right of the suppressible portion 7, is advantageously weakened, so as to allow a breakage of said support 2, such that said breakage, applying to a part support 2 carrying the portion 7, at the same time performs a break of the conductor 6 to the right of the portion 7 making a deletion of the portion 7. The embrittlement is advantageously such that the break can be performed without tools. This may be, for example, made by a precut of the support 2 made by a partial cut in length and / or partial thickness.

This feature is advantageously combined with a deflection of the conductor 6 to place the portion 7 near an edge 22 of the support 2. Thus the portion of the support 2 which is removed by the break can be very small.

This is illustrated by the portion 7d of FIG. 3. Said portion 7d is adapted in that it is deflected to be close to the edge 22 of the support 2, here the corner of the support 2. A precut 15d is made in the support 2 in order to weaken it, here at the corner, the pre-cut 15d intercepting the conductor 6 so as to place a portion 7d outside the precut 15d. Thus a rupture of the support 2 along the precut 15d makes it possible, advantageously without tools, to remove the wedge and with it the portion 7d, thereby achieving an inhibition of the contactless interface.

Claims (18)

A microcircuit device (1) comprising a support (2), a microcircuit (4) arranged in the support (2), and a contactless interface comprising an antenna (5) comprising a linear conductor (6), characterized in that that a portion (7) of the conductor (6) is specifically adapted to be able to be removed, over the entire section of the conductor (6). 2. Device (1) according to claim 1, wherein the deletion of the portion (7) is irreversible without adding element. 3. Device (1) according to any one of claims 1 or 2, comprising, in line with the portion (7), a substantially through hole (8) with the exception of the portion (7), so that introducing a tool (9) in the hole (8) makes it possible to remove the portion (7). 4. Device (1) according to any one of claims 1 to 3, wherein the portion (7) is made of thermally fusible material, preferably at a temperature between 80 and 120 °, more preferably at a temperature of 100 ° . 5. Device (1) according to claim 4, wherein the portion (7) is flanked by two accessible electrical contact points. 6. Device (1) according to any one of claims 1 to 5, wherein the portion (7) comprises a via (17) passing through at least a portion of the thickness of the support (2). 7. Device (1) according to any one of claims 1 to 6, wherein the portion (7) is disposed flush with one of the surfaces (18) of the support (2). 8. Device (1) according to any one of claims 1 to 6, further comprising a module (3) comprising the microcircuit (4), wherein the portion (7) is disposed flush with the outer surface of the module (3) and preferably, the module (3) further comprising a contact plate (19), the portion (7) is disposed in one of the contacts (21) not affected. 9. Device (1) according to claim 8, wherein the portion (7) is disposed in a region of the outer surface of the module (3) free of metal. 10. Device (1) according to any one of claims 1 to 6, wherein the support (2) has a main plane extension and wherein said portion (7) is disposed near an edge (22) of the support (2) . 11. Device (1) according to any one of claims 1 to 6, wherein said portion (7) is disposed in a cavity (8) formed in the thickness of the support (2). 12. Device (1) according to claim 11, further comprising a plug (16) adapted to close said cavity (8). 13. Device (1) according to any one of claims 1 to 6, further comprising a module (3) comprising the microcircuit (4), wherein the portion (7) is disposed at the interface (33) between the support ( 2) and the module (3). 14. Device (1) according to claim 13, wherein the portion (7) is disposed substantially perpendicular to the contour of the module (3) and preferably flush with the surface (30) for laying the contact plate (19). 15. Device (1) according to any one of claims 1 to 14, wherein the portion (7) is weakened, to facilitate mechanical destruction. 16. Device (1) according to any one of claims 1 to 15, wherein the conductor (6) has an interruption (10), and the portion (7) comprises a conductive tongue (11) providing electrical contact between the two ends (12,13) of the interruption (10) and attached to the device (1) by means of at least one adhesive (14), so that the portion (7) forms a removable shunt. 17. Device (1) according to claim 10, wherein the support (2) comprises an embrittlement at the right of the portion (7) to allow a rupture of the support (2), preferably without tools, said rupture achieving a suppression of the portion (7). 18. Module (3) comprising a microcircuit (4), for a microcircuit device (1) comprising a contactless interface comprising an antenna (5) comprising a linear conductor (6), characterized in that a portion (7) of the conductor (6) arranged flush with the external surface of the module (3) is specifically adapted to be able to be removed, over the entire section of the conductor (6).