EP1240619B1 - Electronic label - Google Patents

Electronic label Download PDF

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Publication number
EP1240619B1
EP1240619B1 EP00981561A EP00981561A EP1240619B1 EP 1240619 B1 EP1240619 B1 EP 1240619B1 EP 00981561 A EP00981561 A EP 00981561A EP 00981561 A EP00981561 A EP 00981561A EP 1240619 B1 EP1240619 B1 EP 1240619B1
Authority
EP
European Patent Office
Prior art keywords
chip
electronic label
antenna
label according
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP00981561A
Other languages
German (de)
French (fr)
Other versions
EP1240619A1 (en
Inventor
François Droz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NID SA
Original Assignee
NID SA
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Filing date
Publication date
Application filed by NID SA filed Critical NID SA
Publication of EP1240619A1 publication Critical patent/EP1240619A1/en
Application granted granted Critical
Publication of EP1240619B1 publication Critical patent/EP1240619B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07758—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
    • G06K19/07762—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag the adhering arrangement making the record carrier wearable, e.g. having the form of a ring, watch, glove or bracelet
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/04—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the shape
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Definitions

  • the present invention relates to an electronic tag, in particular a flexible electronic label.
  • the term electronic label means an assembly comprising at least one support flexible, antenna and microchip.
  • This set may include several antennas or several chips as required. They are found in the form of button, in smart cards, even in luggage tags. Thanks to their antennas, they can communicate with a remote reader.
  • the antenna is not used only as a means of communication, but can also be used to produce the energy required to power the electronic chip.
  • the antenna is attached to the flexible support or directly engraved or cut on this same support.
  • the subject of the present invention particularly focuses on labels flexible electronics. They are found in bracelets, show tickets or badges, or even drowned in the stuff of clothes. They can be added to an object such as clothing or take the form of the object, for example the support flexible acts as a bracelet.
  • the microchip needs a rigid area for its implantation. Indeed, the silicon chip is fragile and this is why it is coated in a resin which will protect it from attack mechanical and against chemical attack (corrosion). This resin will also protect the contacts between the chip and the antenna.
  • Document US5844244 reflects the preamble of claim 1, and describes an electronic label comprising a chip and an antenna incorporated in a dielectric material. This label can be attached on any support removably and interchangeably.
  • the dielectric material is the only protective element of the chip which may be insufficient in many applications due to its lack of rigidity.
  • the area of the chip remains a region which cannot bend under pain of see the chip, or its contacts break. This area can measure approximately 5 to 7 mm in diameter due to the coating of the chip.
  • the coating of the chip constitutes a additional operation to manufacture and increases the cost price of such label.
  • the object of the present invention is firstly to reduce the rigid area on a support flexible while protecting the chip.
  • a flexible electronic label comprising at least one flexible support, an antenna and an electronic chip, said chip being mounted on the flexible support and connected to the antenna.
  • This label is characterized by the fact that the chip is protected by a rigid element attached to the support.
  • rigid element it may for example be an extension of a rigid element already mounted on the flexible support such as a fastening element or clasp.
  • the clasp of a bracelet can be extended to cover the chip mounted on the flexible part of the bracelet. This applies to all types of clasp, whether it is a watch strap with pin or single-use clasp for anyone hospitalized. There is always a rigid part which can act as protection for the chip.
  • this rigid element can also take the form of a independent rigid dome which covers the location of the chip, whether on one or other of the faces of the flexible support, and which has feet passing through this flexible support for clipping into a plate for this purpose.
  • the rigid dome is placed under the chip electronic.
  • the. present invention applies also to a rigid element including the electronic chip, the latter coming connect to the antenna via contact areas provided for this purpose.
  • FIG. 1 there is a dotted line between the antenna 3 embedded in the flexible bracelet 2 .
  • the antenna is generally made between two layers of woven fabric to protect it mechanically.
  • the electronic chip 4 is placed along the antenna 3 and generally connected to the latter by two gold wires.
  • the clasp 1 is rigid and, in this example, has a protrusion 1a which covers the place where the chip 4 is placed.
  • clasps can be used for example with a clip including one part would be extended to be located just above the microchip.
  • the antenna and the microchip are applied to the inside of the bracelet and according to the invention, part of the clasp covers the electronic chip.
  • FIG. 2 shows an embodiment in which one does not wish to use part of the clasp 1 to protect the chip 4 .
  • an added element 5 is used which is placed above the chip 4 .
  • This element 5 here in the form of a dome, is applied to the flexible support 2 . Note that it can be maintained in various ways, either by bonding or heat bonding, or by clipping.
  • This dome can also serve as an advertising medium, for example in the form of the company logo.
  • Figure 3 shows us a cross section of an exemplary embodiment of such a rigid element.
  • the flexible support 2 is composed of an upper layer 2a and a lower layer 2b.
  • the antenna 3 is placed between these two layers and connected to the electronic chip 4 .
  • the upper layer covers the electronic chip.
  • the upper layer has an orifice allowing the electronic chip 4 to pass . This latter configuration makes it possible to obtain a reduced thickness.
  • the dome 5 has two orifices 5c and 5d intended to fill the space on the chip 4 with a filling material such as an epoxy resin or a silicone.
  • a filling material such as an epoxy resin or a silicone.
  • the dome 5 is previously filled with a drop of resin before being put in place. The excess resin escapes through a hole provided for this purpose
  • FIG. 4 shows an embodiment of the flexible support 2 including the antenna 3 but without the electronic chip 4 .
  • the flexible support 2 reveals two zones 7a and 7b in which the two conductive ends of the antenna 3 are accessible. As required, these areas are coated with a conductive material (gold, aluminum, copper or carbon).
  • a conductive material gold, aluminum, copper or carbon.
  • two orifices 2c and 2d intended for assembly are placed on either side of the recesses
  • the assembly of this embodiment is illustrated in FIG. 5.
  • the rigid element 5 comprises the electronic chip 4 .
  • the rigid element 5 comprises a substrate 9 on which the electronic chip is placed.
  • the two conductive tracks 8a and 8b which are placed opposite the two recesses 7a and 7b connected to the antenna 3 .
  • These tracks can be produced by carbon deposits for example.
  • the mounting of the rigid element 5 by feet 5a and 5b passing through the flexible support is advantageous because it simultaneously ensures the positioning of the contacts between the antenna and the chip.
  • a conductive adhesive can be applied to the contacts serving as a conductive binder.
  • the chip do not require the presence of the substrate 9 .
  • Electronic chips are known, called “flip chip” which include reliefs intended for connection. Thanks to these reliefs, the chip can be directly applied to the flexible support and thus connect to the antenna.
  • the rigid element 5 comprises accessories such as a battery, vibrator, LED or transducer, for the applications of this label.
  • Single use bracelets are used for applications such as access control to shows or patient identification of a hospital. They are designed so that the opening of such a bracelet can only be done by destroying it. With this in mind, it is important that the authentication made by the label can also be interrupted in the same way as authentication visual.
  • the clasp part of which covers the chip electronic, is designed to destroy the chip or the antenna in the event of an attempt opening.
  • the clasp part of which covers the chip electronic, is designed to destroy the chip or the antenna in the event of an attempt opening.
  • the part of the clasp covering the chip is glued to this last.
  • the electronic chip is torn from its flexible support and, without contact with the antenna, can no longer function.
  • the adhesive for holding the chip on the flexible support has a power adhering below the glue connecting the chip to the clasp.
  • the part of the clasp protecting the chip has two pins which cross the flexible bracelet.
  • the holes of the flexible strap are close together and between them passes at least one of the antenna conductors.
  • Both lugs are widened at their ends to prevent them from coming out. This function is ensured either by attachments by clipping, or obtained by deformation of the lug, by heating for example.
  • the lug cannot escape from its orifice without cause the passage between the two orifices to be torn, thereby causing the final interruption of the antenna and therefore the label is no longer operational.
  • the entire antenna does not need to extend over the length of the bracelet, it it is enough for a turn to pass from one part of the clasp to the other without leaving any passage allowing the interruption of the bracelet.
  • the electronic chip has two connections which must imperatively be connected together to allow the operation of this chip. These two connections are connected to a conductor that runs the full length of the electronic tag and ensures that any cutting this electronic label inevitably causes the interruption of the conductor and therefore stopping the chip.
  • This same thread function can be used to voluntarily render the label does not work.
  • a plane ticket part of which is pre-cut but while letting the common thread pass.
  • the operator cuts the coupon in the space provided for this purpose and causes interruption of the common thread. This operation makes the electronic module inoperative.
  • This part intended for separation can be obtained by pre-cutting or by weakening of a region of the label. Indeed, the thickness of the flexible support can be reduced to facilitate subsequent cutting at this location.

Abstract

Electronic labels consist of an electronic chip ( 4 ) and an antenna ( 3 ) assembled on a flexible support ( 2 ). The electronic chip ( 4 ) needs a rigid zone in order to not be damaged. This is why it is generally covered with a resin that makes this rigid region bigger. In order to reduce this zone the resin that covers the chip is suppressed and replaced with a protection ( 5 ) ensured by a rigid element added to the flexible support ( 2 ).

Description

La présente invention concerne une étiquette électronique, en particulier une étiquette électronique souple.The present invention relates to an electronic tag, in particular a flexible electronic label.

On entend par étiquette électronique, un ensemble comprenant au moins un support souple, une antenne et une puce électronique. Cet ensemble peut comporter plusieurs antennes ou plusieurs puces selon les besoins. On les trouve en forme de bouton, dans des cartes à puce, voire dans des étiquettes à bagages. Grâce à leurs antennes, elles peuvent communiquer avec un lecteur distant. L'antenne sert non seulement comme moyen de communication, mais peut servir également à produire l'énergie nécessaire à alimenter la puce électronique.The term electronic label means an assembly comprising at least one support flexible, antenna and microchip. This set may include several antennas or several chips as required. They are found in the form of button, in smart cards, even in luggage tags. Thanks to their antennas, they can communicate with a remote reader. The antenna is not used only as a means of communication, but can also be used to produce the energy required to power the electronic chip.

Selon les modes de réalisation, l'antenne est rapportée sur le support souple ou directement gravée ou découpée sur ce même support.According to the embodiments, the antenna is attached to the flexible support or directly engraved or cut on this same support.

Il existe de nombreuses puces qui diffèrent par leurs fonctionnalités, par exemple certaines ne permettant que la lecture d'information alors que d'autres permettent la mémorisation et la modification de leur mémoire. Ces dernières sont utilisées entre autre pour des applications de porte-monnaie électronique qui bien entendu, doit être diminué en fonction de la consommation de l'utilisateur.There are many chips which differ in their functionality, for example some only allow the reading of information while others allow the memorization and modification of their memory. These are used between other for electronic wallet applications which of course must be decreased according to the consumption of the user.

Le sujet de la présente invention se concentre particulièrement sur des étiquettes électroniques souples. On les trouve dans des bracelets, des tickets de spectacle ou des badges, voire même noyées dans l'étoffe d'habit. Elles peuvent être adjointes à un objet tel qu'un vêtement ou prendre la forme de l'objet, par exemple le support souple fait office de bracelet.The subject of the present invention particularly focuses on labels flexible electronics. They are found in bracelets, show tickets or badges, or even drowned in the stuff of clothes. They can be added to an object such as clothing or take the form of the object, for example the support flexible acts as a bracelet.

Si les antennes fabriquées en un ensemble de fils de cuivre fins, se prêtent docilement aux flexions et autres torsions, la puce électronique quant à elle, a besoin d'une zone rigide pour son implantation. En effet, la puce en silicium est fragile et c'est pourquoi elle est enrobée dans une résine qui va la protéger des agressions mécaniques et contre les attaques chimiques (corrosion). Cette résine va également protéger les contacts entre la puce et l'antenne. If the antennas made of a set of fine copper wires are suitable obediently to bending and other twists, the microchip meanwhile, needs a rigid area for its implantation. Indeed, the silicon chip is fragile and this is why it is coated in a resin which will protect it from attack mechanical and against chemical attack (corrosion). This resin will also protect the contacts between the chip and the antenna.

Le document US5844244 reflète le préambule de la revendication 1, et décrit une étiquette électronique comprenant une puce et une antenne incorporées dans une matière diélectrique. Cette étiquette peut être fixée sur un support quelconque de façon amovible et interchangeable. Dans cette réalisation, la matière diélectrique est le seul élément de protection de la puce qui peut se révéler insuffisant dans de nombreuses applications à cause de son manque de rigidité. Document US5844244 reflects the preamble of claim 1, and describes an electronic label comprising a chip and an antenna incorporated in a dielectric material. This label can be attached on any support removably and interchangeably. In this realization, the dielectric material is the only protective element of the chip which may be insufficient in many applications due to its lack of rigidity.

C'est pourquoi la zone de la puce reste une région qui ne peut se plier sous peine de voir la puce, ou ses contacts se casser. Cette zone peut mesurer environ 5 à 7 mm de diamètre du fait de l'enrobage de la puce. L'enrobage de la puce constitue une opération supplémentaire à la fabrication et renchérit le prix de revient d'une telle étiquette.This is why the area of the chip remains a region which cannot bend under pain of see the chip, or its contacts break. This area can measure approximately 5 to 7 mm in diameter due to the coating of the chip. The coating of the chip constitutes a additional operation to manufacture and increases the cost price of such label.

Le but de la présente invention est d'une part de réduire la zone rigide sur un support souple tout en assurant la protection de la puce.The object of the present invention is firstly to reduce the rigid area on a support flexible while protecting the chip.

Ce but est atteint par une étiquette électronique souple, comprenant au moins un support souple, une antenne et une puce électronique, ladite puce étant montée sur le support souple et raccordée à l'antenne. Cette étiquette se caractérise par le fait que la protection de la puce est assurée par un élément rigide rapporté sur le support.This object is achieved by a flexible electronic label, comprising at least one flexible support, an antenna and an electronic chip, said chip being mounted on the flexible support and connected to the antenna. This label is characterized by the fact that the chip is protected by a rigid element attached to the support.

Ainsi, ce n'est plus l'enrobage de la puce qui assure sa rigidité mais un élément rigide qui est placé soit au dessus, soit au dessous de la puce. Cet élément peut servir avantageusement d'élément décoratif.Thus, it is no longer the coating of the chip which ensures its rigidity but an element rigid which is placed either above or below the chip. This item can advantageously serve as a decorative element.

Par élément rigide, il peut s'agir par exemple d'une extension d'un élément rigide déjà monté sur le support souple tel qu'un élément de fixation ou fermoir. De cette manière, le fermoir d'un bracelet peut être rallongé pour recouvrir la puce montée sur la partie souple du bracelet. Ceci s'applique pour tous type de fermoir, que ce soit un bracelet de montre avec ardillon ou un fermoir mono-usage pour personne hospitalisée. Il existe toujours une partie rigide qui peut faire office de protection pour la puce.By rigid element, it may for example be an extension of a rigid element already mounted on the flexible support such as a fastening element or clasp. Of this way, the clasp of a bracelet can be extended to cover the chip mounted on the flexible part of the bracelet. This applies to all types of clasp, whether it is a watch strap with pin or single-use clasp for anyone hospitalized. There is always a rigid part which can act as protection for the chip.

En l'absence de fermoir, cet élément rigide peut également prendre la forme d'un dôme rigide indépendant qui vient recouvrir l'emplacement de la puce, que ce soit sur l'une ou l'autre des faces du support souple, et qui dispose de pieds traversant ce support souple pour se clipser dans une plaquette à cet effet.In the absence of a clasp, this rigid element can also take the form of a independent rigid dome which covers the location of the chip, whether on one or other of the faces of the flexible support, and which has feet passing through this flexible support for clipping into a plate for this purpose.

Selon une autre forme de réalisation, le dôme rigide est placé sous la puce électronique. According to another embodiment, the rigid dome is placed under the chip electronic.

D'autres formes ou moyens de montage peuvent être imaginés tels que le collage, le soudage ou la déformation du pied à chaud.Other forms or mounting means can be imagined such as bonding, welding or deformation of the hot foot.

Dans certaines applications, il peut être intéressant de monter la puce plus tard, voire la changer selon les besoins. Pour cela, la. présente invention s'applique également à un élément rigide incluant la puce électronique, cette dernière venant se connecter sur l'antenne par l'intermédiaire de plages de contacts prévues à cet effet.In some applications, it may be interesting to mount the chip later, or even change it as needed. For this, the. present invention applies also to a rigid element including the electronic chip, the latter coming connect to the antenna via contact areas provided for this purpose.

L'invention sera mieux comprise grâce à la description détaillée qui va suivre et qui se réfère aux dessins annexés qui sont donnés à titre d'exemple nullement limitatif, dans lesquels :

  • la figure 1 représente un bracelet avec fermoir à ardillon incluant une étiquette électronique selon l'invention;
  • la figure 2 représente un bracelet souple incluant une étiquette électronique et un élément rigide rapporté;
  • la figure 3 représente une vue en coupe du bracelet souple de la figure 2;
  • la figure 4 représente une antenne d'étiquette électronique sur laquelle peut ce connecter une puce électronique;
  • la figure 5 représente le montage d'une puce électronique venant se connecter sur l'antenne montée dans un support souple.
    • The invention will be better understood thanks to the detailed description which follows and which refers to the appended drawings which are given by way of non-limiting example, in which:
  • FIG. 1 represents a bracelet with a pin clasp including an electronic label according to the invention;
  • FIG. 2 represents a flexible bracelet including an electronic label and an attached rigid element;
  • Figure 3 shows a sectional view of the flexible bracelet of Figure 2;
  • FIG. 4 represents an antenna of electronic label to which this electronic chip can connect;
  • FIG. 5 represents the mounting of an electronic chip coming to connect on the antenna mounted in a flexible support.

    • Sur la figure 1, on distingue en pointillé l'antenne 3 noyée dans le bracelet souple 2. L'antenne est généralement réalisée entre deux couches de tissé pour la protéger mécaniquement. La puce électronique 4 est placée le long de l'antenne 3 et connectée à celle-ci généralement par deux fils d'or. Le fermoir 1 est rigide et, dans cet exemple, dispose d'une protubérance 1a qui recouvre l'endroit ou la puce 4 est placée.In FIG. 1, there is a dotted line between the antenna 3 embedded in the flexible bracelet 2 . The antenna is generally made between two layers of woven fabric to protect it mechanically. The electronic chip 4 is placed along the antenna 3 and generally connected to the latter by two gold wires. The clasp 1 is rigid and, in this example, has a protrusion 1a which covers the place where the chip 4 is placed.

    D'autres formes de fermoir peuvent être utilisés par exemple avec un clips dont une partie serait prolongée pour se situer juste au-dessus de la puce électronique. Other forms of clasp can be used for example with a clip including one part would be extended to be located just above the microchip.

    Lors de l'utilisation de bracelet de faible coût, ce dernier peut n'avoir qu'une seule couche; l'antenne ainsi que la puce électronique sont appliquées sur l'intérieur du bracelet et selon l'invention, une partie du fermoir recouvre la puce électronique.When using low cost bracelet, it may have only one layer; the antenna and the microchip are applied to the inside of the bracelet and according to the invention, part of the clasp covers the electronic chip.

    La figure 2 montre une exécution dans laquelle l'on ne souhaite pas utiliser une partie du fermoir 1 pour protéger la puce 4. Dans ce cas, on utilise un élément 5 rapporté qui se place au-dessus de la puce 4. Cet élément 5, ici en forme de dôme, s'applique sur le support souple 2. On notera qu'il peut être maintenu de diverses manières, soit par collage ou thermo-collage, soit par clipsage. Ce dôme peut également servir de support publicitaire, par exemple en ayant la forme du logo de l'entreprise.FIG. 2 shows an embodiment in which one does not wish to use part of the clasp 1 to protect the chip 4 . In this case, an added element 5 is used which is placed above the chip 4 . This element 5 , here in the form of a dome, is applied to the flexible support 2 . Note that it can be maintained in various ways, either by bonding or heat bonding, or by clipping. This dome can also serve as an advertising medium, for example in the form of the company logo.

    Cette manière de monter l'étiquette électronique s'applique à tout support souple et ne se limite pas à des bracelets. On peut incorporer un tel ensemble dans un ticket d'avion ou de théâtre à l'intérieur d'un habit, dans un dossard de coureur.This way of mounting the electronic label applies to any flexible support and is not limited to bracelets. We can incorporate such a set in a ticket plane or theater inside a coat, in a runner's bib.

    La figure 3 nous montre une coupe transversale d'un exemple d'exécution d'un tel élément rigide. On peut distinguer la partie supérieure du dôme 5 qui dispose de deux pieds 5a et 5b qui traversent le support souple 2 pour se clipser dans une plaquette 6. Le support souple 2 est composé d'une couche supérieure 2a et d'une couche inférieure 2b. L'antenne 3 est placée entre ces deux couches et connectées à la puce électronique 4. Dans une forme d'exécution non représentée, la couche supérieure recouvre la puce électronique. Dans une autre forme de réalisation telle que représentée à la figure 3, la couche supérieure dispose d'un orifice laissant passer la puce électronique 4. Cette dernière configuration permet d'obtenir une épaisseur réduite.Figure 3 shows us a cross section of an exemplary embodiment of such a rigid element. We can distinguish the upper part of the dome 5 which has two feet 5a and 5b which pass through the flexible support 2 to be clipped into a plate 6 . The flexible support 2 is composed of an upper layer 2a and a lower layer 2b. The antenna 3 is placed between these two layers and connected to the electronic chip 4 . In an embodiment not shown, the upper layer covers the electronic chip. In another embodiment as shown in FIG. 3, the upper layer has an orifice allowing the electronic chip 4 to pass . This latter configuration makes it possible to obtain a reduced thickness.

    Selon une autre forme de réalisation, le dôme 5 dispose de deux orifices 5c et 5d destinés à remplir l'espace sur la puce 4 d'un matériau de remplissage tel qu'une résine epoxy ou un silicone. Ceci présente l'avantage de protéger la puce 4 de la corrosion due à l'humidité, la transpiration ou des agents nettoyants corrosifs. La résine est injectée par un premier orifice 5c et lorsque l'espace sous le dôme 5 est rempli, la résine en excédent ressort par le deuxième orifice 5d. According to another embodiment, the dome 5 has two orifices 5c and 5d intended to fill the space on the chip 4 with a filling material such as an epoxy resin or a silicone. This has the advantage of protecting the chip 4 from corrosion due to humidity, perspiration or corrosive cleaning agents. The resin is injected through a first orifice 5c and when the space under the dome 5 is filled, the excess resin comes out through the second orifice 5d.

    Selon une variante de cette exécution, le dôme 5 est préalablement rempli d'une goutte de résine avant d'être mis en place. L'excédent de résine s'échappe par un orifice prévu à cet effetAccording to a variant of this embodiment, the dome 5 is previously filled with a drop of resin before being put in place. The excess resin escapes through a hole provided for this purpose

    La figure 4 montre une exécution du support souple 2 incluant l'antenne 3 mais sans la puce électronique 4. Le support souple 2 laisse apparaítre deux zones 7a et 7b dans lesquelles les deux extrémités conductrices de l'antenne 3 sont accessibles. Selon les besoins, ces zones sont revêtues d'un matériau conducteur (or, aluminium, cuivre ou carbone). Dans le but de faciliter le montage, deux orifices 2c et 2d destinés au montage sont placés de part et d'autres des évidementsFIG. 4 shows an embodiment of the flexible support 2 including the antenna 3 but without the electronic chip 4 . The flexible support 2 reveals two zones 7a and 7b in which the two conductive ends of the antenna 3 are accessible. As required, these areas are coated with a conductive material (gold, aluminum, copper or carbon). In order to facilitate assembly, two orifices 2c and 2d intended for assembly are placed on either side of the recesses

    L'assemblage de cette exécution est illustré à la figure 5. L'élément rigide 5 comprend la puce électronique 4. Ainsi, c'est par l'action de la mise en place de la protection 5 que la puce va être en contact avec l'antenne et l'étiquette devenir ainsi opérationnelle. A cet effet, selon une forme d'exécution, l'élément rigide 5 comprend un substrat 9 sur lequel est placée la puce électronique. Egalement sur ce substrat, se trouvent les deux pistes conductrices 8a et 8b qui viennent se placer en face des deux évidements 7a et 7b reliés à l'antenne 3. Ces pistes peuvent être réalisées par des dépôts de carbone par exemple. Le montage de l'élément rigide 5 par des pieds 5a et 5b traversant le support souple est avantageux car il assure en même temps le positionnement des contacts entre l'antenne et la puce.The assembly of this embodiment is illustrated in FIG. 5. The rigid element 5 comprises the electronic chip 4 . Thus, it is by the action of setting up protection 5 that the chip will be in contact with the antenna and the label will thus become operational. To this end, according to one embodiment, the rigid element 5 comprises a substrate 9 on which the electronic chip is placed. Also on this substrate are the two conductive tracks 8a and 8b which are placed opposite the two recesses 7a and 7b connected to the antenna 3 . These tracks can be produced by carbon deposits for example. The mounting of the rigid element 5 by feet 5a and 5b passing through the flexible support is advantageous because it simultaneously ensures the positioning of the contacts between the antenna and the chip.

    Afin d'améliorer la tenue et la conductivité électrique entre la puce et l'antenne, il peut être appliqué une colle conductrice sur les contacts servant de liant conducteur.In order to improve the behavior and the electrical conductivity between the chip and the antenna, it a conductive adhesive can be applied to the contacts serving as a conductive binder.

    D'autres formes d'exécution de la puce ne nécessitent pas la présence du substrat 9. Il est connu des puces électroniques, dénommées "flip chip" qui incluent des reliefs destinés à la connexion. Grâce à ces reliefs, la puce peut être directement appliquée sur le support souple et se connecter ainsi à l'antenne. Selon une autre variante, il est connu d'appliquer un film conducteur sur la puce, film qui assure la conduction entre la puce et l'antenne. Les zones conductrices sont délimitées dans ce type d'exécution, par traitement thermique. Other embodiments of the chip do not require the presence of the substrate 9 . Electronic chips are known, called "flip chip" which include reliefs intended for connection. Thanks to these reliefs, the chip can be directly applied to the flexible support and thus connect to the antenna. According to another variant, it is known to apply a conductive film to the chip, a film which provides conduction between the chip and the antenna. The conductive areas are delimited in this type of execution, by heat treatment.

    Selon une variante de cette exécution, l'élément rigide 5 comprend des accessoires tels qu'une pile, vibreur, LED ou transducteur, pour les applications de cette étiquette.According to a variant of this embodiment, the rigid element 5 comprises accessories such as a battery, vibrator, LED or transducer, for the applications of this label.

    Les bracelets à utilisation unique sont utilisés pour des applications telles que le contrôle d'accès à des spectacles ou l'identification de patient d'un hôpital. Ils sont conçus pour que l'ouverture d'un tel bracelet ne peut se faire qu'en le détruisant. Dans cette optique, il est important que l'authentification faite par l'étiquette électronique puisse également s'interrompre au même titre que l'authentification visuelle.Single use bracelets are used for applications such as access control to shows or patient identification of a hospital. They are designed so that the opening of such a bracelet can only be done by destroying it. With this in mind, it is important that the authentication made by the label can also be interrupted in the same way as authentication visual.

    Selon une variante de l'invention, le fermoir, dont une partie recouvre la puce électronique, est agencé pour détruire la puce ou l'antenne en cas de tentative d'ouverture. Pour cela, plusieurs variantes peuvent être utilisées.According to a variant of the invention, the clasp, part of which covers the chip electronic, is designed to destroy the chip or the antenna in the event of an attempt opening. For this, several variants can be used.

    Selon une première variante, la partie du fermoir recouvrant la puce est collée à cette dernière. Ainsi, en cas d'ouverture forcée du fermoir, la puce électronique est arrachée de son support souple et, sans contact avec l'antenne, ne peut plus fonctionner. La colle de maintien de la puce sur le support souple a un pouvoir adhérant inférieur à la colle reliant la puce au fermoir.According to a first variant, the part of the clasp covering the chip is glued to this last. Thus, in the event of forced opening of the clasp, the electronic chip is torn from its flexible support and, without contact with the antenna, can no longer function. The adhesive for holding the chip on the flexible support has a power adhering below the glue connecting the chip to the clasp.

    Selon une deuxième variante, la partie du fermoir protégeant la puce dispose de deux ergots qui traversent le bracelet souple. Les orifices du bracelet souple sont rapprochés et entre eux passe au moins un des conducteurs de l'antenne. Les deux ergots sont élargis à leurs extrémités afin de les empêcher de ressortir. Cette fonction est assurée soit par des pièces rapportées par clipsage, soit obtenue par déformation de l'ergot, par échauffement par exemple.According to a second variant, the part of the clasp protecting the chip has two pins which cross the flexible bracelet. The holes of the flexible strap are close together and between them passes at least one of the antenna conductors. Both lugs are widened at their ends to prevent them from coming out. This function is ensured either by attachments by clipping, or obtained by deformation of the lug, by heating for example.

    Lors d'une tentative d'ouverture forcée, l'ergot ne peut s'échapper de son orifice sans provoquer le déchirement du passage entre les deux orifices et provoque ainsi l'interruption définitive de l'antenne et par conséquent, l'étiquette n'est plus opérationnelle.During a forced opening attempt, the lug cannot escape from its orifice without cause the passage between the two orifices to be torn, thereby causing the final interruption of the antenna and therefore the label is no longer operational.

    Bien que ce type de sécurité est bien adaptée aux agressions dirigées contre le fermoir, il existe toujours pour le fraudeur, la possibilité de couper le bracelet pour le transmettre à un tiers qui pourra ainsi s'identifier grâce à la fonction électronique de l'étiquette.Although this type of security is well suited to attacks against the clasp, there is always for the fraudster, the possibility of cutting the bracelet for the forward to a third party who can thus identify themselves using the electronic function of the label.

    Afin d'empêcher ce type d'agissement, il est proposé, selon une forme particulière de l'invention, qu'au moins une spire de l'antenne est déployée sur toute la longueur de l'étiquette électronique. Ainsi, il n'est pas possible de couper ce type de bracelet sans interrompre l'antenne et par là même, le fonctionnement du module électronique.In order to prevent this type of action, it is proposed, according to a particular form of the invention, that at least one turn of the antenna is deployed over the entire length of the electronic label. Thus, it is not possible to cut this type of bracelet without interrupt the antenna and thereby the operation of the electronic module.

    Il n'est pas nécessaire que toute l'antenne se déploie sur la longueur du bracelet, il suffit qu'une spire passe d'une des parties du fermoir à l'autre sans laisser de passage permettant l'interruption du bracelet.The entire antenna does not need to extend over the length of the bracelet, it it is enough for a turn to pass from one part of the clasp to the other without leaving any passage allowing the interruption of the bracelet.

    Selon une variante de cette exécution, la puce électronique dispose de deux connections qui doivent impérativement être reliées entre-elles pour permettre le fonctionnement de cette puce. Ces deux connections sont reliées à un conducteur qui parcours toute la longueur de l'étiquette électronique et garantit que toute coupure de cette étiquette électronique provoque immanquablement l'interruption du conducteur et par conséquent, l'arrêt de la puce.According to a variant of this embodiment, the electronic chip has two connections which must imperatively be connected together to allow the operation of this chip. These two connections are connected to a conductor that runs the full length of the electronic tag and ensures that any cutting this electronic label inevitably causes the interruption of the conductor and therefore stopping the chip.

    Cette même fonction du fil conducteur peut être utilisée pour volontairement rendre l'étiquette inopérante. On peut imaginer un ticket d'avion dont une partie est prédécoupée mais tout en laissant passer le fil conducteur. Lors de la validation dudit ticket, l'opérateur découpe le coupon à l'endroit prévu à cet effet et provoque l'interruption du fil conducteur. Cette opération rend le module électronique inopérant.This same thread function can be used to voluntarily render the label does not work. We can imagine a plane ticket, part of which is pre-cut but while letting the common thread pass. When validating said ticket, the operator cuts the coupon in the space provided for this purpose and causes interruption of the common thread. This operation makes the electronic module inoperative.

    Cette partie destinée à la séparation peut être obtenue par pré-découpage ou par affaiblissement d'une région de l'étiquette. En effet, l'épaisseur du support souple peut être réduite afin de faciliter la découpe ultérieure à cet endroit.This part intended for separation can be obtained by pre-cutting or by weakening of a region of the label. Indeed, the thickness of the flexible support can be reduced to facilitate subsequent cutting at this location.

    Claims (14)

    1. A flexible electronic label that comprises at least a flexible support (2), an antenna (3), and an electronic chip (4), said chip (4) being connected to the antenna (3), characterized in that the protection of the chip (4) is ensured by a rigid element (1, 5) added on at least one of the faces of the support.
    2. An electronic label according to Claim 1, characterized in that the added element (1) is a part (1 a) of an element that serves as a closing element or fixation of the label.
    3. An electronic label according to Claim 1 characterized in that the antenna comprises two zones (7 a and 7 b) of electric access to its poles and in that an added rigid element (5) comprises the electronic chip (4) as well as two zones of electric connection (8 a and 8 b) destined, during the assembly of the rigid element (5), to contact with the two zones (7 a and 7 b) of the antenna (3).
    4. An electronic label according to Claim 3, characterized in that the rigid element (5) comprises accessories such as a battery, a vibrator, a LED or transducer
    5. An electronic label according to Claims 1 and 3, characterized in that the added element (1) is an independent element (5) specific for this use.
    6. An electronic label according to Claim 5, characterized in that the independent element (5) is assembled on the flexible support (2) by gluing, welding, or by engagement.
    7. An electronic label according to Claims 5 and 6, characterized in that the independent element (5) is filled with a substance that covers the chip (4).
    8. An electronic label according to Claims 1 to 7, characterized in that it comprises at least one conductive wire that is displayed along all its length and whose interruption produces the stopping of the functioning of said label.
    9. An electronic label according to Claim 8, characterized in that this conductive wire is a part of the antenna (3).
    10. An electronic label according to Claim 8, characterized in that this conductive wire is linked by its two ends to the electronic chip (4).
    11. An electronic label according to Claims 8 to 10, characterized in that this conductive wire crosses a separation zone with reduced solidity.
    12. An electronic label according to Claims 1 to 11, characterized in that the rigid element (1) has means to produce the destruction of the chip (4) and/or the antenna (3) during the separation of the rigid element (1) from the flexible support (2).
    13. An electronic label according to Claim 12, characterized in that these means consist of a glue placed between the chip (4) and the rigid element (1), and whose adhesive power is greater than that of the binding agent placed between the chip (4) and the flexible support (2).
    14. An electronic label according to Claim 12, characterized in that the flexible support (2) has at least two orifices between which passes at least one of the conductors of the antenna (3), and in that these means comprise at least two spigots that are connected to the rigid element (1) and that cross said orifices, said spigots being widened at their ends either by adding a piece or by deformation.
    EP00981561A 1999-12-23 2000-12-22 Electronic label Expired - Lifetime EP1240619B1 (en)

    Applications Claiming Priority (7)

    Application Number Priority Date Filing Date Title
    CH236199 1999-12-23
    CH236199 1999-12-23
    CH1672000 2000-01-28
    CH167002000 2000-01-28
    CH216002000 2000-02-03
    CH2162000 2000-02-03
    PCT/IB2000/001952 WO2001048687A1 (en) 1999-12-23 2000-12-22 Electronic label

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    EP1240619A1 EP1240619A1 (en) 2002-09-18
    EP1240619B1 true EP1240619B1 (en) 2004-02-25

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    EP (1) EP1240619B1 (en)
    JP (1) JP4687940B2 (en)
    KR (1) KR100731852B1 (en)
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    CA (1) CA2395316C (en)
    CZ (1) CZ301189B6 (en)
    DE (1) DE60008591T2 (en)
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    HU (1) HU229540B1 (en)
    IL (1) IL150140A0 (en)
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    CZ20022084A3 (en) 2002-11-13
    KR100731852B1 (en) 2007-06-25
    IL150140A0 (en) 2002-12-01
    AU771053B2 (en) 2004-03-11
    CA2395316C (en) 2010-04-27
    DE60008591T2 (en) 2004-12-16
    CN1413337A (en) 2003-04-23
    ATE260493T1 (en) 2004-03-15
    JP4687940B2 (en) 2011-05-25
    HK1053525A1 (en) 2003-10-24
    ES2215763T3 (en) 2004-10-16
    NO334608B1 (en) 2014-04-22
    BR0016714A (en) 2002-09-03
    EP1240619A1 (en) 2002-09-18
    CZ301189B6 (en) 2009-12-02
    DE60008591D1 (en) 2004-04-01
    HUP0203879A2 (en) 2003-03-28
    BRPI0016714B1 (en) 2016-11-01
    AU1879201A (en) 2001-07-09
    PL203214B1 (en) 2009-09-30
    CN1178162C (en) 2004-12-01
    KR20020063915A (en) 2002-08-05
    WO2001048687A1 (en) 2001-07-05
    US6971581B2 (en) 2005-12-06
    MXPA02006235A (en) 2002-12-05
    MA25512A1 (en) 2002-07-01
    NO20022928L (en) 2002-06-18
    US20020190131A1 (en) 2002-12-19
    HU229540B1 (en) 2014-01-28
    JP2003519424A (en) 2003-06-17
    NO20022928D0 (en) 2002-06-18
    CA2395316A1 (en) 2001-07-05
    PL363107A1 (en) 2004-11-15

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