FR3036303B1 - Procede de soudure sans apport de matiere et module electronique de puissance realise par ce procede - Google Patents
Procede de soudure sans apport de matiere et module electronique de puissance realise par ce procedeInfo
- Publication number
- FR3036303B1 FR3036303B1 FR1554565A FR1554565A FR3036303B1 FR 3036303 B1 FR3036303 B1 FR 3036303B1 FR 1554565 A FR1554565 A FR 1554565A FR 1554565 A FR1554565 A FR 1554565A FR 3036303 B1 FR3036303 B1 FR 3036303B1
- Authority
- FR
- France
- Prior art keywords
- content
- power module
- welding process
- electronic power
- module made
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
- B23K26/22—Spot welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
- B23K26/24—Seam welding
- B23K26/244—Overlap seam welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/32—Bonding taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1554565A FR3036303B1 (fr) | 2015-05-21 | 2015-05-21 | Procede de soudure sans apport de matiere et module electronique de puissance realise par ce procede |
PCT/FR2016/051201 WO2016185148A1 (fr) | 2015-05-21 | 2016-05-20 | Procede de soudure sans apport de matiere et module electronique de puissance realise par ce procede |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1554565A FR3036303B1 (fr) | 2015-05-21 | 2015-05-21 | Procede de soudure sans apport de matiere et module electronique de puissance realise par ce procede |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3036303A1 FR3036303A1 (fr) | 2016-11-25 |
FR3036303B1 true FR3036303B1 (fr) | 2017-10-20 |
Family
ID=53496862
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1554565A Active FR3036303B1 (fr) | 2015-05-21 | 2015-05-21 | Procede de soudure sans apport de matiere et module electronique de puissance realise par ce procede |
Country Status (2)
Country | Link |
---|---|
FR (1) | FR3036303B1 (fr) |
WO (1) | WO2016185148A1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102019126954A1 (de) * | 2019-10-08 | 2021-04-08 | Rogers Germany Gmbh | Verfahren zur Herstellung eines Metall-Keramik-Substrats, Lötsystem und Metall-Keramik-Substrat, hergestellt mit einem solchen Verfahren |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5992189A (ja) * | 1982-11-18 | 1984-05-28 | Toshiba Corp | 鋼板枠の製造方法 |
FR2877865B1 (fr) | 2004-11-15 | 2008-06-06 | Valeo Electronique Sys Liaison | Procede de soudure sans apport de matiere et dispositif electrique susceptible d'etre realise par ce procede |
JP4858238B2 (ja) * | 2007-03-05 | 2012-01-18 | 富士電機株式会社 | レーザ溶接部材およびそれを用いた半導体装置 |
JP5155598B2 (ja) * | 2007-05-22 | 2013-03-06 | トヨタ自動車株式会社 | 重ねレーザ溶接方法および装置 |
US8963321B2 (en) * | 2011-09-12 | 2015-02-24 | Infineon Technologies Ag | Semiconductor device including cladded base plate |
DE102013103866B3 (de) * | 2013-04-17 | 2014-05-22 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitereinrichtung |
-
2015
- 2015-05-21 FR FR1554565A patent/FR3036303B1/fr active Active
-
2016
- 2016-05-20 WO PCT/FR2016/051201 patent/WO2016185148A1/fr active Application Filing
Also Published As
Publication number | Publication date |
---|---|
FR3036303A1 (fr) | 2016-11-25 |
WO2016185148A1 (fr) | 2016-11-24 |
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Legal Events
Date | Code | Title | Description |
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PLFP | Fee payment |
Year of fee payment: 2 |
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PLSC | Publication of the preliminary search report |
Effective date: 20161125 |
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Year of fee payment: 3 |
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Year of fee payment: 4 |
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Year of fee payment: 5 |
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Year of fee payment: 6 |
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Year of fee payment: 7 |
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PLFP | Fee payment |
Year of fee payment: 8 |
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PLFP | Fee payment |
Year of fee payment: 9 |