FR3034334A1 - METHOD AND MACHINE FOR CUTTING A PIECE USING AN ABRASIVE WIRE - Google Patents
METHOD AND MACHINE FOR CUTTING A PIECE USING AN ABRASIVE WIRE Download PDFInfo
- Publication number
- FR3034334A1 FR3034334A1 FR1552734A FR1552734A FR3034334A1 FR 3034334 A1 FR3034334 A1 FR 3034334A1 FR 1552734 A FR1552734 A FR 1552734A FR 1552734 A FR1552734 A FR 1552734A FR 3034334 A1 FR3034334 A1 FR 3034334A1
- Authority
- FR
- France
- Prior art keywords
- wire
- machine
- cutting
- piece
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/047—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by ultrasonic cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
Abstract
Le procédé comprend une étape d'entraînement en déplacement du fil (1) et, concomitamment, une étape de mise en contact du fil (1) et de la pièce à découper (3) de sorte à usiner au moins un sillon dans la pièce à découper (3), caractérisé en ce qu'il comprend une étape de mise en vibration lors de laquelle le fil traverse au moins une zone (8A, 8B) contenant un fluide de transmission auquel des vibrations produites par ultrason sont restituées, ladite zone étant située au voisinage direct de la pièce à découper (3) de sorte à appliquer au fil (1) des vibrations qui sont transmises à l'intérieur du sillon.The method comprises a step of moving the wire (1) and, at the same time, a step of contacting the wire (1) and the workpiece (3) so as to machine at least one groove in the workpiece cutter (3), characterized in that it comprises a step of vibrating during which the wire passes through at least one zone (8A, 8B) containing a transmission fluid to which vibrations produced by ultrasound are restored, said zone being located in the direct vicinity of the workpiece (3) so as to apply to the wire (1) vibrations which are transmitted inside the groove.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1552734A FR3034334B1 (en) | 2015-03-31 | 2015-03-31 | METHOD AND MACHINE FOR CUTTING A PIECE USING AN ABRASIVE WIRE |
EP16714832.9A EP3277472A1 (en) | 2015-03-31 | 2016-03-30 | Method and machine for cutting a workpiece using an abrasive wire |
PCT/EP2016/056844 WO2016156345A1 (en) | 2015-03-31 | 2016-03-30 | Method and machine for cutting a workpiece using an abrasive wire |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1552734A FR3034334B1 (en) | 2015-03-31 | 2015-03-31 | METHOD AND MACHINE FOR CUTTING A PIECE USING AN ABRASIVE WIRE |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3034334A1 true FR3034334A1 (en) | 2016-10-07 |
FR3034334B1 FR3034334B1 (en) | 2017-09-29 |
Family
ID=53200180
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1552734A Expired - Fee Related FR3034334B1 (en) | 2015-03-31 | 2015-03-31 | METHOD AND MACHINE FOR CUTTING A PIECE USING AN ABRASIVE WIRE |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP3277472A1 (en) |
FR (1) | FR3034334B1 (en) |
WO (1) | WO2016156345A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120292367A1 (en) | 2006-01-31 | 2012-11-22 | Ethicon Endo-Surgery, Inc. | Robotically-controlled end effector |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0432288A1 (en) * | 1988-06-14 | 1991-06-19 | Nippei Toyama Corporation | Brittle material cutting method |
DE10220638A1 (en) * | 2002-05-08 | 2003-11-27 | Wacker Siltronic Halbleitermat | Method an apparatus for separating slices from a brittle workpiece using a wire saw where the cutter is cleaned during the cutting process by ultrasound |
JP2012006136A (en) * | 2010-06-24 | 2012-01-12 | Kazumasa Onishi | Ultrasonic cleaning device used in wire saw machine |
WO2013024451A2 (en) * | 2011-08-18 | 2013-02-21 | Memc Electronic Materials S.P.A. | Methods and systems for removing contamination from a wire of a saw |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011167836A (en) * | 2010-02-16 | 2011-09-01 | Kazumasa Onishi | Wire saw device and cutting method using the same |
JP2011224762A (en) * | 2010-04-19 | 2011-11-10 | Kazumasa Onishi | Wire saw machine and cutting method using the same |
-
2015
- 2015-03-31 FR FR1552734A patent/FR3034334B1/en not_active Expired - Fee Related
-
2016
- 2016-03-30 EP EP16714832.9A patent/EP3277472A1/en not_active Withdrawn
- 2016-03-30 WO PCT/EP2016/056844 patent/WO2016156345A1/en active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0432288A1 (en) * | 1988-06-14 | 1991-06-19 | Nippei Toyama Corporation | Brittle material cutting method |
DE10220638A1 (en) * | 2002-05-08 | 2003-11-27 | Wacker Siltronic Halbleitermat | Method an apparatus for separating slices from a brittle workpiece using a wire saw where the cutter is cleaned during the cutting process by ultrasound |
JP2012006136A (en) * | 2010-06-24 | 2012-01-12 | Kazumasa Onishi | Ultrasonic cleaning device used in wire saw machine |
WO2013024451A2 (en) * | 2011-08-18 | 2013-02-21 | Memc Electronic Materials S.P.A. | Methods and systems for removing contamination from a wire of a saw |
Also Published As
Publication number | Publication date |
---|---|
EP3277472A1 (en) | 2018-02-07 |
FR3034334B1 (en) | 2017-09-29 |
WO2016156345A1 (en) | 2016-10-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 2 |
|
PLSC | Publication of the preliminary search report |
Effective date: 20161007 |
|
PLFP | Fee payment |
Year of fee payment: 3 |
|
PLFP | Fee payment |
Year of fee payment: 4 |
|
PLFP | Fee payment |
Year of fee payment: 5 |
|
PLFP | Fee payment |
Year of fee payment: 6 |
|
ST | Notification of lapse |
Effective date: 20211105 |