FR3032899B1 - Dispositif de decoupe par fil comportant un systeme de lubrification par aspersion du fil et un systeme de nettoyage par aspersion du fil - Google Patents
Dispositif de decoupe par fil comportant un systeme de lubrification par aspersion du fil et un systeme de nettoyage par aspersion du filInfo
- Publication number
- FR3032899B1 FR3032899B1 FR1551524A FR1551524A FR3032899B1 FR 3032899 B1 FR3032899 B1 FR 3032899B1 FR 1551524 A FR1551524 A FR 1551524A FR 1551524 A FR1551524 A FR 1551524A FR 3032899 B1 FR3032899 B1 FR 3032899B1
- Authority
- FR
- France
- Prior art keywords
- wire
- cutting device
- spray lubrication
- cleaning system
- lubrication system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1551524A FR3032899B1 (fr) | 2015-02-23 | 2015-02-23 | Dispositif de decoupe par fil comportant un systeme de lubrification par aspersion du fil et un systeme de nettoyage par aspersion du fil |
PCT/EP2016/053681 WO2016135102A1 (fr) | 2015-02-23 | 2016-02-22 | Dispositif de découpe par fil comportant un système de lubrification par aspersion du fil et un système de nettoyage par aspersion du fil |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1551524A FR3032899B1 (fr) | 2015-02-23 | 2015-02-23 | Dispositif de decoupe par fil comportant un systeme de lubrification par aspersion du fil et un systeme de nettoyage par aspersion du fil |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3032899A1 FR3032899A1 (fr) | 2016-08-26 |
FR3032899B1 true FR3032899B1 (fr) | 2017-03-31 |
Family
ID=52991800
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1551524A Expired - Fee Related FR3032899B1 (fr) | 2015-02-23 | 2015-02-23 | Dispositif de decoupe par fil comportant un systeme de lubrification par aspersion du fil et un systeme de nettoyage par aspersion du fil |
Country Status (2)
Country | Link |
---|---|
FR (1) | FR3032899B1 (fr) |
WO (1) | WO2016135102A1 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113601741B (zh) * | 2021-08-09 | 2023-06-23 | 西安奕斯伟硅片技术有限公司 | 为切割硅棒的多条切割线供应砂浆的装置及硅棒切割设备 |
CN116587451B (zh) * | 2023-06-21 | 2024-01-26 | 苏州博宏源机械制造有限公司 | 一种半导体晶圆材料加工装置及方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1203966C (zh) * | 2001-10-17 | 2005-06-01 | 株式会社新王磁材 | 使用线状锯的切断方法和线状锯装置以及稀土类磁体的制造方法 |
KR20100093877A (ko) * | 2009-02-17 | 2010-08-26 | 네오세미테크 주식회사 | 웨이퍼 절단용 와이어 쏘 시스템에서, 사용 후 와이어 보빈챔버로 회수되는 와이어에 묻은 슬러리 자동 제거용 오일 커튼 방식 시스템 |
DE102010049472A1 (de) * | 2009-10-27 | 2011-06-09 | Meyer Burger Ag | Drahtsäge mit Drahtfeld und Abziehleiste |
WO2011050945A1 (fr) * | 2009-10-28 | 2011-05-05 | Meyer Burger Ag | Scie à fil comprenant une zone de fil et des buses de nettoyage |
DE102012201938B4 (de) * | 2012-02-09 | 2015-03-05 | Siltronic Ag | Verfahren zum gleichzeitigen Trennen einer Vielzahl von Scheiben von einem Werkstück |
-
2015
- 2015-02-23 FR FR1551524A patent/FR3032899B1/fr not_active Expired - Fee Related
-
2016
- 2016-02-22 WO PCT/EP2016/053681 patent/WO2016135102A1/fr active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2016135102A1 (fr) | 2016-09-01 |
FR3032899A1 (fr) | 2016-08-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 2 |
|
PLSC | Publication of the preliminary search report |
Effective date: 20160826 |
|
PLFP | Fee payment |
Year of fee payment: 3 |
|
PLFP | Fee payment |
Year of fee payment: 4 |
|
PLFP | Fee payment |
Year of fee payment: 6 |
|
PLFP | Fee payment |
Year of fee payment: 7 |
|
ST | Notification of lapse |
Effective date: 20221005 |