FR3027244B1 - Systeme de decoupe ou de perforation a distance - Google Patents

Systeme de decoupe ou de perforation a distance

Info

Publication number
FR3027244B1
FR3027244B1 FR1402318A FR1402318A FR3027244B1 FR 3027244 B1 FR3027244 B1 FR 3027244B1 FR 1402318 A FR1402318 A FR 1402318A FR 1402318 A FR1402318 A FR 1402318A FR 3027244 B1 FR3027244 B1 FR 3027244B1
Authority
FR
France
Prior art keywords
punching system
remote cutting
remote
cutting
punching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1402318A
Other languages
English (en)
Other versions
FR3027244A1 (fr
Inventor
Thierry Bernigaud
Robin Marijon
Jean Marc Claveau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thales SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thales SA filed Critical Thales SA
Priority to FR1402318A priority Critical patent/FR3027244B1/fr
Publication of FR3027244A1 publication Critical patent/FR3027244A1/fr
Application granted granted Critical
Publication of FR3027244B1 publication Critical patent/FR3027244B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/703—Cooling arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F41—WEAPONS
    • F41H—ARMOUR; ARMOURED TURRETS; ARMOURED OR ARMED VEHICLES; MEANS OF ATTACK OR DEFENCE, e.g. CAMOUFLAGE, IN GENERAL
    • F41H13/00—Means of attack or defence not otherwise provided for
    • F41H13/0043—Directed energy weapons, i.e. devices that direct a beam of high energy content toward a target for incapacitating or destroying the target
    • F41H13/005—Directed energy weapons, i.e. devices that direct a beam of high energy content toward a target for incapacitating or destroying the target the high-energy beam being a laser beam
    • F41H13/0062—Directed energy weapons, i.e. devices that direct a beam of high energy content toward a target for incapacitating or destroying the target the high-energy beam being a laser beam causing structural damage to the target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/04—Arrangements for thermal management
    • H01S3/042—Arrangements for thermal management for solid state lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
    • H01S3/06—Construction or shape of active medium
    • H01S3/063—Waveguide lasers, i.e. whereby the dimensions of the waveguide are of the order of the light wavelength
    • H01S3/067—Fibre lasers
    • H01S3/06704—Housings; Packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02438—Characterized by cooling of elements other than the laser chip, e.g. an optical element being part of an external cavity or a collimating lens
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
    • H01S3/06—Construction or shape of active medium
    • H01S3/063—Waveguide lasers, i.e. whereby the dimensions of the waveguide are of the order of the light wavelength
    • H01S3/067—Fibre lasers
    • H01S3/06754—Fibre amplifiers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/09—Processes or apparatus for excitation, e.g. pumping
    • H01S3/091—Processes or apparatus for excitation, e.g. pumping using optical pumping
    • H01S3/094—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light
    • H01S3/094003—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light the pumped medium being a fibre
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/09—Processes or apparatus for excitation, e.g. pumping
    • H01S3/091—Processes or apparatus for excitation, e.g. pumping using optical pumping
    • H01S3/094—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light
    • H01S3/0941—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light of a laser diode
    • H01S3/09415—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light of a laser diode the pumping beam being parallel to the lasing mode of the pumped medium, e.g. end-pumping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4012—Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
FR1402318A 2014-10-15 2014-10-15 Systeme de decoupe ou de perforation a distance Active FR3027244B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR1402318A FR3027244B1 (fr) 2014-10-15 2014-10-15 Systeme de decoupe ou de perforation a distance

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1402318A FR3027244B1 (fr) 2014-10-15 2014-10-15 Systeme de decoupe ou de perforation a distance

Publications (2)

Publication Number Publication Date
FR3027244A1 FR3027244A1 (fr) 2016-04-22
FR3027244B1 true FR3027244B1 (fr) 2016-12-09

Family

ID=52779685

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1402318A Active FR3027244B1 (fr) 2014-10-15 2014-10-15 Systeme de decoupe ou de perforation a distance

Country Status (1)

Country Link
FR (1) FR3027244B1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106969668A (zh) * 2017-05-15 2017-07-21 清华大学 一种柔性可变的防护结构

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02134885A (ja) * 1988-11-16 1990-05-23 Mitsubishi Electric Corp レーザ発振器
DE102011002424B4 (de) * 2011-01-04 2013-03-14 Robert Bosch Gmbh Verfahren zur Startdiagnose eines Wärmespeichermaterials
DE102013008407B3 (de) * 2013-05-16 2014-07-17 Mbda Deutschland Gmbh Vorratsmodul zum Versorgen eines Wirksystems sowie Wirksystem mit Vorratsmodul
CN103811976B (zh) * 2014-02-28 2017-02-22 苏州微木智能系统有限公司 一种脉冲式大功率激光器的散热装置及散热方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106969668A (zh) * 2017-05-15 2017-07-21 清华大学 一种柔性可变的防护结构

Also Published As

Publication number Publication date
FR3027244A1 (fr) 2016-04-22

Similar Documents

Publication Publication Date Title
ZA201902115B (en) Rock cutting device
BR112017001392A2 (pt) ferramenta de corte rotativa de fundo de poço.
DK2923913T3 (da) Automatisk togdriftssystem
DK3282839T3 (da) Lokkemadsstation
FR3026499B1 (fr) Systeme de commandes a molette manipulable
NO20161407A1 (en) Transmitting collision alarms to a remote device
DK3241201T3 (da) Fleralarmfjernmonitoreringssystem
FR3028748B1 (fr) Instrument de circoncision a double systeme de securite
DK3212879T3 (da) Skæreværktøj
CL2014003631S1 (es) Cortadora de ceramica.
GB2540289B (en) Pipe cutter
FR3027244B1 (fr) Systeme de decoupe ou de perforation a distance
FR3021374B1 (fr) Systeme de roulement a palier de secours integre
FR3021762B1 (fr) Systeme de detection
FR3016866B1 (fr) Systeme de palettisation ameliore
GB2544451B (en) A cutting device
GB201503738D0 (en) A cutting device
PT3206821T (pt) Sistema de realização de furos
FR3023199B1 (fr) Dispositif de cisaillement
ZA201501294B (en) A vehicle alarm system
FR3030055B1 (fr) Systeme electronique autonome
FR3056302B1 (fr) Systeme pendulaire
FR3057194B3 (fr) Coupe-tuyau
GB201610506D0 (en) A cutting device
GB201600734D0 (en) Cutting systems

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 2

PLSC Publication of the preliminary search report

Effective date: 20160422

PLFP Fee payment

Year of fee payment: 3

PLFP Fee payment

Year of fee payment: 4

PLFP Fee payment

Year of fee payment: 5

PLFP Fee payment

Year of fee payment: 6

PLFP Fee payment

Year of fee payment: 7

PLFP Fee payment

Year of fee payment: 8

PLFP Fee payment

Year of fee payment: 9

PLFP Fee payment

Year of fee payment: 10