FR3022697B1 - ELECTRICAL CONNECTION DEVICE WITH CONNECTING ELEMENTS COMPRISING DEFORMABLE MEMBRANES - Google Patents
ELECTRICAL CONNECTION DEVICE WITH CONNECTING ELEMENTS COMPRISING DEFORMABLE MEMBRANESInfo
- Publication number
- FR3022697B1 FR3022697B1 FR1455855A FR1455855A FR3022697B1 FR 3022697 B1 FR3022697 B1 FR 3022697B1 FR 1455855 A FR1455855 A FR 1455855A FR 1455855 A FR1455855 A FR 1455855A FR 3022697 B1 FR3022697 B1 FR 3022697B1
- Authority
- FR
- France
- Prior art keywords
- electrical connection
- connection device
- connecting elements
- deformable membranes
- deformable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
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- G—PHYSICS
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- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
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- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
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- Engineering & Computer Science (AREA)
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Measuring Leads Or Probes (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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FR1455855A FR3022697B1 (en) | 2014-06-24 | 2014-06-24 | ELECTRICAL CONNECTION DEVICE WITH CONNECTING ELEMENTS COMPRISING DEFORMABLE MEMBRANES |
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FR1455855A FR3022697B1 (en) | 2014-06-24 | 2014-06-24 | ELECTRICAL CONNECTION DEVICE WITH CONNECTING ELEMENTS COMPRISING DEFORMABLE MEMBRANES |
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FR3022697A1 FR3022697A1 (en) | 2015-12-25 |
FR3022697B1 true FR3022697B1 (en) | 2017-12-22 |
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FR1455855A Expired - Fee Related FR3022697B1 (en) | 2014-06-24 | 2014-06-24 | ELECTRICAL CONNECTION DEVICE WITH CONNECTING ELEMENTS COMPRISING DEFORMABLE MEMBRANES |
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Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
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KR0154994B1 (en) * | 1993-11-22 | 1998-12-01 | 세끼자와 다다시 | Semiconductor device and its manufacture |
JP3825290B2 (en) * | 1994-06-03 | 2006-09-27 | 株式会社ルネサステクノロジ | Manufacturing method of semiconductor device |
US6893901B2 (en) * | 2001-05-14 | 2005-05-17 | Fairchild Semiconductor Corporation | Carrier with metal bumps for semiconductor die packages |
US7042080B2 (en) * | 2003-07-14 | 2006-05-09 | Micron Technology, Inc. | Semiconductor interconnect having compliant conductive contacts |
US7453139B2 (en) * | 2005-12-27 | 2008-11-18 | Tessera, Inc. | Compliant terminal mountings with vented spaces and methods |
US7629804B2 (en) * | 2006-08-04 | 2009-12-08 | Vertical Test Inc. | Probe head assembly for use in testing multiple wafer die |
JP2012021773A (en) * | 2008-11-12 | 2012-02-02 | Alps Electric Co Ltd | Spherical shell type contact and method for manufacturing the same |
TWI484610B (en) * | 2012-07-09 | 2015-05-11 | 矽品精密工業股份有限公司 | Method of forming semiconductor structure and conductive bump |
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