FR3015781B1 - HYPERFREQUENCY INTERCONNECTION DEVICE - Google Patents

HYPERFREQUENCY INTERCONNECTION DEVICE

Info

Publication number
FR3015781B1
FR3015781B1 FR1303024A FR1303024A FR3015781B1 FR 3015781 B1 FR3015781 B1 FR 3015781B1 FR 1303024 A FR1303024 A FR 1303024A FR 1303024 A FR1303024 A FR 1303024A FR 3015781 B1 FR3015781 B1 FR 3015781B1
Authority
FR
France
Prior art keywords
hyperfrequency
interconnection device
interconnection
hyperfrequency interconnection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1303024A
Other languages
French (fr)
Other versions
FR3015781A1 (en
Inventor
Olivier Vendier
David Nevo
Antoine Renel
Beatrice Espana
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Centre National dEtudes Spatiales CNES
Thales SA
Original Assignee
Centre National dEtudes Spatiales CNES
Thales SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Centre National dEtudes Spatiales CNES, Thales SA filed Critical Centre National dEtudes Spatiales CNES
Priority to FR1303024A priority Critical patent/FR3015781B1/en
Priority to EP14198440.1A priority patent/EP2887448B1/en
Priority to US14/575,720 priority patent/US9232631B2/en
Priority to JP2014256940A priority patent/JP6407701B2/en
Priority to KR1020140184546A priority patent/KR102197980B1/en
Publication of FR3015781A1 publication Critical patent/FR3015781A1/en
Application granted granted Critical
Publication of FR3015781B1 publication Critical patent/FR3015781B1/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
    • B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/04—Fixed joints
    • H01P1/047—Strip line joints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
    • H01P5/028—Transitions between lines of the same kind and shape, but with different dimensions between strip lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Waveguide Connection Structure (AREA)
  • Waveguides (AREA)
  • Structure Of Printed Boards (AREA)
FR1303024A 2013-12-20 2013-12-20 HYPERFREQUENCY INTERCONNECTION DEVICE Expired - Fee Related FR3015781B1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR1303024A FR3015781B1 (en) 2013-12-20 2013-12-20 HYPERFREQUENCY INTERCONNECTION DEVICE
EP14198440.1A EP2887448B1 (en) 2013-12-20 2014-12-17 Microwave interconnection device
US14/575,720 US9232631B2 (en) 2013-12-20 2014-12-18 Hyperfrequency interconnection device
JP2014256940A JP6407701B2 (en) 2013-12-20 2014-12-19 High frequency interconnect elements
KR1020140184546A KR102197980B1 (en) 2013-12-20 2014-12-19 Hyperfrequency interconnection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1303024A FR3015781B1 (en) 2013-12-20 2013-12-20 HYPERFREQUENCY INTERCONNECTION DEVICE

Publications (2)

Publication Number Publication Date
FR3015781A1 FR3015781A1 (en) 2015-06-26
FR3015781B1 true FR3015781B1 (en) 2016-02-05

Family

ID=50828951

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1303024A Expired - Fee Related FR3015781B1 (en) 2013-12-20 2013-12-20 HYPERFREQUENCY INTERCONNECTION DEVICE

Country Status (5)

Country Link
US (1) US9232631B2 (en)
EP (1) EP2887448B1 (en)
JP (1) JP6407701B2 (en)
KR (1) KR102197980B1 (en)
FR (1) FR3015781B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114520212B (en) * 2022-04-20 2022-08-23 之江实验室 Wideband chip packaging structure supporting high-speed signal transmission

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2550011B1 (en) * 1983-07-29 1986-10-10 Thomson Csf INTERCONNECTION DEVICE BETWEEN THE CELLS OF A PRE-IMPLANTED INTEGRATED MICROWAVE CIRCUIT
JPH01256801A (en) * 1988-04-07 1989-10-13 Fujitsu Ltd Connection method for microstrip line
JP2763445B2 (en) * 1992-04-03 1998-06-11 三菱電機株式会社 High frequency signal wiring and bonding device therefor
US6728113B1 (en) * 1993-06-24 2004-04-27 Polychip, Inc. Method and apparatus for non-conductively interconnecting integrated circuits
JPH09289404A (en) * 1996-04-24 1997-11-04 Honda Motor Co Ltd Ribbon,bonding wire, and package for microwave circuit
JPH11195909A (en) * 1997-10-21 1999-07-21 Murata Mfg Co Ltd Thin film multi-layer electrode, high frequency transmission line, high frequency resonator and high frequency filter
JP2003332802A (en) * 2002-05-14 2003-11-21 Mitsubishi Electric Corp High frequency circuit device
JP2006128868A (en) * 2004-10-27 2006-05-18 Mitsubishi Electric Corp Connection circuit between high frequency transmission lines
JP4612550B2 (en) * 2006-01-17 2011-01-12 超音波工業株式会社 Bonding ribbon for power device and bonding method using the same
JP4717020B2 (en) * 2007-01-31 2011-07-06 富士通株式会社 Relay board and optical communication module
JP2009027068A (en) * 2007-07-23 2009-02-05 Alps Electric Co Ltd Semiconductor device
JP2010182958A (en) * 2009-02-06 2010-08-19 Seiko Instruments Inc Semiconductor device and method of manufacturing semiconductor device
JP2012209796A (en) * 2011-03-30 2012-10-25 Nec Corp High frequency module, printed wiring board, printed circuit board, and antenna device
FI126151B (en) * 2012-01-30 2016-07-15 Stora Enso Oyj A method and arrangement for producing an electrically conductive pattern on a surface

Also Published As

Publication number Publication date
EP2887448B1 (en) 2016-06-15
US20150181694A1 (en) 2015-06-25
JP6407701B2 (en) 2018-10-17
KR20150073116A (en) 2015-06-30
EP2887448A1 (en) 2015-06-24
JP2015122495A (en) 2015-07-02
KR102197980B1 (en) 2021-01-04
US9232631B2 (en) 2016-01-05
FR3015781A1 (en) 2015-06-26

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Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 3

PLFP Fee payment

Year of fee payment: 4

ST Notification of lapse

Effective date: 20180831