FR2984680B1 - STRUCTURE CARRYING ONE OR MORE ELECTRONIC COMPONENTS - Google Patents

STRUCTURE CARRYING ONE OR MORE ELECTRONIC COMPONENTS

Info

Publication number
FR2984680B1
FR2984680B1 FR1161695A FR1161695A FR2984680B1 FR 2984680 B1 FR2984680 B1 FR 2984680B1 FR 1161695 A FR1161695 A FR 1161695A FR 1161695 A FR1161695 A FR 1161695A FR 2984680 B1 FR2984680 B1 FR 2984680B1
Authority
FR
France
Prior art keywords
electronic components
structure carrying
carrying
electronic
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1161695A
Other languages
French (fr)
Other versions
FR2984680A1 (en
Inventor
Larbi Bendani
Mimoun Askeur
Francis Delaporte
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Systemes de Controle Moteur SAS
Original Assignee
Valeo Systemes de Controle Moteur SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Systemes de Controle Moteur SAS filed Critical Valeo Systemes de Controle Moteur SAS
Priority to FR1161695A priority Critical patent/FR2984680B1/en
Publication of FR2984680A1 publication Critical patent/FR2984680A1/en
Application granted granted Critical
Publication of FR2984680B1 publication Critical patent/FR2984680B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0256—Electrical insulation details, e.g. around high voltage areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10075—Non-printed oscillator
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1009—Electromotor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
FR1161695A 2011-12-15 2011-12-15 STRUCTURE CARRYING ONE OR MORE ELECTRONIC COMPONENTS Active FR2984680B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR1161695A FR2984680B1 (en) 2011-12-15 2011-12-15 STRUCTURE CARRYING ONE OR MORE ELECTRONIC COMPONENTS

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1161695A FR2984680B1 (en) 2011-12-15 2011-12-15 STRUCTURE CARRYING ONE OR MORE ELECTRONIC COMPONENTS

Publications (2)

Publication Number Publication Date
FR2984680A1 FR2984680A1 (en) 2013-06-21
FR2984680B1 true FR2984680B1 (en) 2014-10-31

Family

ID=45872984

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1161695A Active FR2984680B1 (en) 2011-12-15 2011-12-15 STRUCTURE CARRYING ONE OR MORE ELECTRONIC COMPONENTS

Country Status (1)

Country Link
FR (1) FR2984680B1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013019617B4 (en) * 2013-11-25 2015-07-02 Tesat-Spacecom Gmbh & Co.Kg High voltage electrical component for use in a satellite and satellite therewith
AT515440B1 (en) * 2014-03-10 2019-07-15 Egston Power Electronics Gmbh Electrical component arrangement
DE102014218967B4 (en) * 2014-09-22 2016-07-07 Robert Bosch Gmbh circuit board
FR3065112A1 (en) * 2017-04-11 2018-10-12 Valeo Systemes De Controle Moteur ELECTRONIC UNIT AND ELECTRICAL DEVICE COMPRISING SAID ELECTRONIC UNIT

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5075759A (en) * 1989-07-21 1991-12-24 Motorola, Inc. Surface mounting semiconductor device and method
US6449158B1 (en) * 2001-12-20 2002-09-10 Motorola, Inc. Method and apparatus for securing an electronic power device to a heat spreader
DE102007037297A1 (en) * 2007-08-07 2009-02-19 Continental Automotive Gmbh Circuit carrier structure with improved heat dissipation

Also Published As

Publication number Publication date
FR2984680A1 (en) 2013-06-21

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