DE102014218967B4 - circuit board - Google Patents

circuit board

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Publication number
DE102014218967B4
DE102014218967B4 DE102014218967.5A DE102014218967A DE102014218967B4 DE 102014218967 B4 DE102014218967 B4 DE 102014218967B4 DE 102014218967 A DE102014218967 A DE 102014218967A DE 102014218967 B4 DE102014218967 B4 DE 102014218967B4
Authority
DE
Germany
Prior art keywords
conducting element
heat
surface
circuit board
heat conducting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE102014218967.5A
Other languages
German (de)
Other versions
DE102014218967A1 (en
Inventor
Peter Bartscherer
Stephanie Gollhofer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE102014218967.5A priority Critical patent/DE102014218967B4/en
Publication of DE102014218967A1 publication Critical patent/DE102014218967A1/en
Application granted granted Critical
Publication of DE102014218967B4 publication Critical patent/DE102014218967B4/en
Application status is Active legal-status Critical
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/0204Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10416Metallic blocks or heatsinks completely inserted in a PCB

Abstract

The present invention relates to a printed circuit board having a component surface and a cooling surface comprising at least one main body, and at least one insert, which is at least partially disposed in the base body, wherein the insert comprises: a first heat conducting element, a second heat conducting element, and an intermediate between the first heat conducting element and the second heat conducting element arranged insulating element, which electrically isolates the first heat conducting element of the second heat conducting element. The insert is pressed into the body. Furthermore, the component surface of the printed circuit board is formed by a first surface of the base body and / or by a surface of the first heat-conducting element and the cooling surface of the printed circuit board by a second surface of the base body and / or by a surface of the second heat-conducting element. The printed circuit board is designed to contact the cooling surface with a heat sink with the exclusion of a short circuit with the first heat conducting element.

Description

  • State of the art
  • The present invention relates to a printed circuit board. The printed circuit board is particularly suitable for control units or electric drives in motor vehicles.
  • Particularly on printed circuit boards for electric drives or control units in motor vehicles ever higher demands are made for cooling. Higher powers, such as for purely electric vehicles, mean higher electrical voltages and currents and, associated with this, greater power losses and quantities of heat that have to be transported out of one component.
  • In the case of components on printed circuit boards is worked at high heat dissipation requirements with massive copper inlays, which are pressed into the circuit board. These copper inlays carry the waste heat from a component through the printed circuit board to a heat sink arranged on the back of the printed circuit board. The thermal connection of the heat sink to the Kupferinlay is realized with a Wärmeleitmaterial. As a rule, the copper inlay must be electrically insulated against the heat sink. This is ensured in the prior art by an appropriate selection of the heat conducting material. Printed circuit boards as described above, for example, from DE 10 2004 036 960 A1 or DE 103 29 267 A1 known.
  • The circuit boards of the prior art are only suitable for high performance. Thus, a maximum dissipated amount of heat is limited by the structure of conventional printed circuit boards. In addition, the field of possible Wärmeleitmaterialien is severely limited because the Wärmeleitmaterial must simultaneously have an electrical insulation effect. Thus, in particular, the available Wärmeleitmaterialien are very expensive. Finally, there is always the danger of a short circuit, since the copper inlay has an electrical potential. Thus, a short circuit or a leakage current may occur if the surface of the copper inlay is not completely covered with the heat conduction material.
  • Disclosure of the invention
  • The circuit board according to the invention has a main body and an insert. The main body is in particular a plastic substrate, particularly preferably a fiber-reinforced plastic substrate. The insert is at least partially disposed in the body. According to the invention, the insert part has a first heat-conducting element, a second heat-conducting element and an insulation element. The insulating element is arranged such that it electrically isolates the first heat-conducting element from the second heat-conducting element. Thus, the insulation element is preferably arranged between the first heat-conducting element and the second heat-conducting element. In this way it is prevented that a potential is applied to the second heat-conducting element. In addition to improved cooling of components that are arranged on the circuit board, the circuit board thus provides a very high short-circuit protection.
  • The dependent claims show preferred developments of the invention.
  • Preferably, the insert is an insulated metal substrate. Alternatively, it is provided that the insert is an uninsulated metal inlay which is laminated or glued to a metal plate. In this case, an electrical insulation layer between the metal plate and the uninsulated metal inlay is provided.
  • It is also contemplated that the circuit board has a component surface. On the component surface in particular electrical components can be arranged. The component surface is formed by a first surface of the base body and / or by a surface of the first heat-conducting element. It is particularly preferably provided that the first surface of the base body and the surface of the first heat conducting element form a continuous, continuous surface.
  • Likewise, it is further provided that the circuit board has a cooling surface. The cooling surface is used for cooling of components that are applied to the circuit board, wherein the cooling surface can be additionally provided with a heat sink. The cooling surface is formed by a second surface of the base body and / or by a surface of the second heat-conducting element. Particularly advantageously, the cooling surface is formed exclusively by the surface of the second heat conducting element. It is particularly advantageous if the surface of the second heat-conducting element lifts off from the second surface of the base body.
  • Particularly preferably, the cooling surface on a Wärmeleitmaterial. The heat-conducting material is applied in particular to the cooling surface. Thus, the cooling surface is ideally suited for mounting a heat sink, since an optimal thermal connection of the heat sink to the cooling surface is ensured by the Wärmeleitmaterial. Thus, components that are exposed to high voltages and / or currents can be cooled by the circuit board.
  • In an advantageous embodiment of the invention, a thickness of the base body is the same size as a thickness of the first heat-conducting element. Thus, in particular, only the first heat-conducting element is arranged within the base body. The second heat-conducting element and the insulating element are advantageously mounted on the first heat-conducting element. Particularly preferably, it is provided that the second heat-conducting element and the insulating element are arranged on the first heat-conducting element and the main body. Thus, the second heat-conducting element and the insulating element rest on a surface that is jointly formed by the main body and the first heat-conducting element.
  • Overall, the insert is pressed into the body. Alternatively, the insert is inserted into a recess of the base body. The recess is in particular a cutout or a bore, wherein the recess extends particularly advantageously through the entire thickness of the base body.
  • In an advantageous embodiment, the second heat-conducting element is arranged within the base body, wherein a dimension, particularly preferably a length and / or width of the second heat-conducting element is smaller than the same dimension of the first heat-conducting element. In particular, the dimension of the second heat-conducting element is also smaller than the corresponding dimension of the insulating element.
  • The first heat-conducting element preferably has a greater thickness than the second heat-conducting element. This leads to improved heat spreading and heat buffering, which ensures better thermal performance, ie greater heat dissipation.
  • In an advantageous embodiment, the first heat-conducting element and / or the second heat-conducting element are made of copper or aluminum. Both materials have optimal thermal conductivity and therefore are particularly advantageous for heat dissipation of components.
  • Brief description of the drawings
  • Hereinafter, embodiments of the invention will be described in detail with reference to the accompanying drawings. In the drawing is:
  • 1 a schematic representation of a printed circuit board according to a first embodiment of the invention,
  • 2 a schematic representation of a printed circuit board according to a second embodiment of the invention,
  • 3 a schematic view of a circuit board according to a third embodiment of the invention, and
  • 4 a schematic representation of a circuit board according to a fourth embodiment of the invention.
  • Embodiments of the invention
  • 1 shows a schematic illustration of a circuit board 1 according to a first embodiment of the invention. The circuit board 1 includes a main body 2 and an insert 3 , The insert 3 is completely within the body 2 arranged.
  • The insert 3 comprises a first heat conducting element 4 and a second heat conducting element 5 , Between the first heat-conducting element 4 and the second heat conducting element 5 is an isolation element 6 appropriate. The isolation element 6 serves for electrical insulation of the first heat conducting element 4 from the second heat conducting element 5 , In particular, the first heat-conducting element 4 and second heat-conducting element 5 made of copper or aluminum.
  • The first heat-conducting element 4 has a greater thickness than the second heat conducting element 5 , This serves for better heat spreading and heat buffering, whereby optimum heat dissipation of a component on the circuit board 1 can be arranged, is ensured. Alternatively, however, also the first heat-conducting element 4 have a smaller thickness or a same thickness as the second heat conducting element 5 , The insert 3 is in the body 2 pressed.
  • The circuit board 1 has a component surface 7 and a cooling surface 10 on. The component surface 7 serves to accommodate components, in particular of electrical components. Thus, it is possible to have a controller based on the circuit board 1 build. The component surface 7 is through a first surface 8th of the basic body 2 and through a surface 9 of the first heat conducting element 4 educated. Here is the component surface 7 prefers a flat, continuous surface from the first surface 8th of the basic body 2 and surface 9 of the first heat conducting element 4 , Electrical components are in particular on the first heat conducting element 4 arranged.
  • The cooling surface 10 is used to heat dissipation of components on the component surface 7 the circuit board 1 are arranged. The cooling surface 10 is formed in the first embodiment by a second surface 11 of the basic body 2 and through a surface 12 of the second heat conducting element 5 , Analogous to the component surface 7 in the first embodiment is the cooling surface 10 a continuous, level surface. On the surface 12 of the second heat conducting element 5 is preferably a heat sink attachable. The heat sink is in particular via a Wärmeleitmaterial on the surface 12 of the second heat conducting element 5 arranged. Such a heat-conducting material may be, for example, a thermal paste, a heat-conducting foil or a heat-conducting adhesive. In a particularly preferred alternative, the circuit board allows 1 the direct soldering of a heat sink on the surface 12 of the second heat conducting element 5 , Because of the insulation element 6 an electrical insulation between the first heat conducting element 4 and second heat-conducting element 5 is already ensured, is a direct soldering of the heat sink to the surface 12 of the second heat conducting element 5 possible. The danger of a short circuit is due to the insulation element 6 locked out. At the same time, direct soldering enables optimum heat transfer from the second heat-conducting element 6 on the heat sink.
  • 2 schematically shows a printed circuit board 1 according to a second embodiment of the invention. The same reference numerals as in FIG 1 that are the same or functionally identical components as in the first embodiment. The only difference between the first embodiment and the second embodiment lies in the dimension of the second heat conducting element 5 , In the second embodiment, the second heat-conducting element 5 a dimension that is smaller than the dimension of the first heat conducting element 4 , In particular, a width of the second heat-conducting element 5 less than a width of the first heat conducting element 4 , Because the insert part 3 into the main body 2 is pressed in, the cooling surface remains 10 as a flat, continuous surface, the second surface 11 of the basic body 2 and from the surface 12 of the second cooling element 5 is formed. Should the insert part 3 alternatively in a prefabricated recess of the body 2 be used, so must the second heat conducting element 5 the main body 2 do not touch.
  • 3 shows a third embodiment of the circuit board according to the invention 1 , Again, like reference numerals indicate that they are the same or similar components as in the first and second embodiments.
  • In contrast to the first and second embodiments, the first heat-conducting element 4 a thickness equal to or nearly equal to the thickness of the body 2 is. Thus, the insert is partially within the body 2 arranged. Only the first heat-conducting element 4 is inside the body 2 arranged. The second heat-conducting element 5 and the isolation element 6 are on the first heat conducting element 4 applied. In the third embodiment, the second heat-conducting element 5 and the isolation element 6 in addition to the second surface 11 of the basic body 2 applied.
  • The cooling surface 10 the circuit board 1 according to the third embodiment is thus exclusively through the surface 12 of the second heat conducting element 5 educated. On the surface 12 the second heat conducting element 5 is a heat sink applicable, or the surface 12 the Wärmeleitelements 5 serves as a cooling element for an electrical component on the component surface 7 the circuit board 1 is arranged. As a width of the second heat conducting element 5 larger than a width of the first heat conducting element 4 is, offers the circuit board 1 according to the third embodiment, a very large cooling surface 10 for the cooling of components on the component surface 7 the circuit board 1 can be attached.
  • 4 shows a fourth embodiment of the circuit board 1 , Again, the same reference numbers indicate that they are the same or similar components as in the first, second or third embodiment. In the fourth embodiment, the circuit board 1 two first heat-conducting elements 4 on that in the main body 2 are pressed. Otherwise, the structure of the circuit board 1 according to the fourth embodiment identical to the third embodiment. Only the insulation element 6 and the second heat conducting element 5 are arranged in contrast to the third embodiment such that they are in contact with both first heat conducting elements 4 stand. Thus, in particular two different electrical components are on the surfaces 9 the first heat-conducting elements 4 applicable, wherein both electrical components via a common cooling surface 10 can be cooled. The common cooling surface 10 is in turn through the surface 12 of the second heat conducting element 5 educated.
  • In the third embodiment and in the fourth embodiment is also possible that initially uninsulated metal inlays in the base body 2 be pressed, thus the first heat conducting element 4 to build. Subsequently, the second heat-conducting element 5 using an electrically insulating film or using an electrically insulating adhesive as insulation element 6 on the first heat conducting element 4 be applied.
  • In addition, all embodiments allow the cooling surface 10 with the component surface 7 is exchanged.
  • From the figures and the embodiments of the invention is thus apparent that the circuit board according to the invention 1 may advantageously serve for the cooling of components, in particular of electrical components, which are exposed to large electrical voltages and / or large electrical currents. Thus, the circuit board according to the invention is suitable 1 in an optimal way for use in control units or electric drives of motor vehicles.

Claims (7)

  1. Printed circuit board ( 1 ) with a component surface ( 7 ) and a cooling surface ( 10 ) comprising at least one main body ( 2 ), and at least one insert ( 3 ), which at least partially in the body ( 2 ) is arranged, wherein the insert part ( 3 ): - a first heat conducting element ( 4 ), - a second heat conducting element ( 5 ), and - a between the first heat conducting element ( 4 ) and the second heat conducting element ( 5 ) arranged isolation element ( 6 ), which the first heat conducting element ( 4 ) of the second heat conducting element ( 5 ) electrically isolated, wherein the insert part ( 3 ) in the basic body ( 2 ) is pressed and the component surface ( 7 ) of the printed circuit board ( 1 ) through a first surface ( 8th ) of the basic body ( 2 ) and / or through a surface ( 9 ) of the first heat conducting element ( 4 ) and the cooling surface ( 10 ) of the printed circuit board ( 1 ) through a second surface ( 11 ) of the basic body ( 2 ) and / or through a surface ( 12 ) of the second heat conducting element ( 5 ) is formed, and wherein the circuit board is formed, the cooling surface ( 10 ) with a heat sink with the exclusion of a short circuit with the first heat conducting element ( 4 ) to contact.
  2. Printed circuit board ( 1 ) according to claim 1, characterized in that the insert part ( 3 ) is an isolated metal substrate.
  3. Printed circuit board ( 1 ) according to claim 1 or 2, characterized in that on the cooling surface ( 10 ) a Wärmeleitmaterial is attached.
  4. Printed circuit board ( 1 ) according to one of the preceding claims, characterized in that a thickness of the basic body ( 2 ) is equal to a thickness of the first heat conducting element ( 4 ), wherein the second heat-conducting element ( 5 ) and / or the isolation element ( 6 ) on the first heat conducting element ( 4 ) are applied.
  5. Printed circuit board ( 1 ) according to one of the preceding claims, characterized in that the second heat-conducting element ( 5 ) within the body ( 2 ) is arranged and a smaller length and / or a smaller width than the first heat conducting element ( 6 ) having.
  6. Printed circuit board ( 1 ) according to one of the preceding claims, characterized in that the first heat-conducting element ( 4 ) has a greater thickness than the second heat conducting element ( 5 ).
  7. Printed circuit board ( 1 ), characterized in that the first heat conducting element ( 4 ) and / or the second heat conducting element ( 5 ) are made of copper or aluminum.
DE102014218967.5A 2014-09-22 2014-09-22 circuit board Active DE102014218967B4 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE102014218967.5A DE102014218967B4 (en) 2014-09-22 2014-09-22 circuit board

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102014218967.5A DE102014218967B4 (en) 2014-09-22 2014-09-22 circuit board
EP15756674.6A EP3199001A1 (en) 2014-09-22 2015-09-03 Circuit board
PCT/EP2015/070141 WO2016045930A1 (en) 2014-09-22 2015-09-03 Circuit board
FR1558870A FR3026226A1 (en) 2014-09-22 2015-09-21 Circuit plate

Publications (2)

Publication Number Publication Date
DE102014218967A1 DE102014218967A1 (en) 2016-03-24
DE102014218967B4 true DE102014218967B4 (en) 2016-07-07

Family

ID=54012236

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102014218967.5A Active DE102014218967B4 (en) 2014-09-22 2014-09-22 circuit board

Country Status (4)

Country Link
EP (1) EP3199001A1 (en)
DE (1) DE102014218967B4 (en)
FR (1) FR3026226A1 (en)
WO (1) WO2016045930A1 (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1276357A2 (en) * 2001-07-13 2003-01-15 Behr-Hella Thermocontrol GmbH Wiring board for electrical circuits
DE10329267A1 (en) * 2003-06-30 2005-01-27 Robert Bosch Gmbh Circuit carrier arrangement for carrying an electronic circuit, has heat conducting body extending between upper and lower surfaces of circuit carrier and flush with upper and lower surfaces
DE102004036960A1 (en) * 2004-07-30 2006-03-23 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Printed circuit board and method of manufacturing such a printed circuit board
US20120199955A1 (en) * 2011-02-08 2012-08-09 Subtron Technology Co. Ltd. Package carrier and manufacturing method thereof
WO2013088047A1 (en) * 2011-12-15 2013-06-20 Valeo Systemes De Controle Moteur Thermally conductive and electrically insulating link between at least one electronic component and a completely or partially metal radiator
FR2984680A1 (en) * 2011-12-15 2013-06-21 Valeo Sys Controle Moteur Sas Structure for bearing e.g. field effect metal-oxide-semiconductor transistor used to form inverter of inverter/charger circuit of hybrid vehicle, has support interposed between radiator and face of printed circuit board
US20140144677A1 (en) * 2012-11-23 2014-05-29 Subtron Technology Co., Ltd. Package carrier

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5075759A (en) * 1989-07-21 1991-12-24 Motorola, Inc. Surface mounting semiconductor device and method
EP2043412B1 (en) * 2007-09-28 2010-05-19 Eberspächer Controls GmbH & Co. KG Conductor rail with heat conduction

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1276357A2 (en) * 2001-07-13 2003-01-15 Behr-Hella Thermocontrol GmbH Wiring board for electrical circuits
DE10329267A1 (en) * 2003-06-30 2005-01-27 Robert Bosch Gmbh Circuit carrier arrangement for carrying an electronic circuit, has heat conducting body extending between upper and lower surfaces of circuit carrier and flush with upper and lower surfaces
DE102004036960A1 (en) * 2004-07-30 2006-03-23 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Printed circuit board and method of manufacturing such a printed circuit board
US20120199955A1 (en) * 2011-02-08 2012-08-09 Subtron Technology Co. Ltd. Package carrier and manufacturing method thereof
WO2013088047A1 (en) * 2011-12-15 2013-06-20 Valeo Systemes De Controle Moteur Thermally conductive and electrically insulating link between at least one electronic component and a completely or partially metal radiator
FR2984680A1 (en) * 2011-12-15 2013-06-21 Valeo Sys Controle Moteur Sas Structure for bearing e.g. field effect metal-oxide-semiconductor transistor used to form inverter of inverter/charger circuit of hybrid vehicle, has support interposed between radiator and face of printed circuit board
US20140144677A1 (en) * 2012-11-23 2014-05-29 Subtron Technology Co., Ltd. Package carrier

Also Published As

Publication number Publication date
DE102014218967A1 (en) 2016-03-24
EP3199001A1 (en) 2017-08-02
WO2016045930A1 (en) 2016-03-31
FR3026226A1 (en) 2016-03-25

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