FR2971366B1 - Micro plaquette de semi-conducteur comprenant des moyens de protection contre une attaque physique - Google Patents

Micro plaquette de semi-conducteur comprenant des moyens de protection contre une attaque physique

Info

Publication number
FR2971366B1
FR2971366B1 FR1100401A FR1100401A FR2971366B1 FR 2971366 B1 FR2971366 B1 FR 2971366B1 FR 1100401 A FR1100401 A FR 1100401A FR 1100401 A FR1100401 A FR 1100401A FR 2971366 B1 FR2971366 B1 FR 2971366B1
Authority
FR
France
Prior art keywords
semiconductor wafer
protection against
against physical
physical attack
micro semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1100401A
Other languages
English (en)
Other versions
FR2971366A1 (fr
Inventor
Marc Saisse
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Exworks Capital Fund I LP
Original Assignee
Inside Secure SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inside Secure SA filed Critical Inside Secure SA
Priority to FR1100401A priority Critical patent/FR2971366B1/fr
Priority to US13/368,753 priority patent/US20120199948A1/en
Publication of FR2971366A1 publication Critical patent/FR2971366A1/fr
Application granted granted Critical
Publication of FR2971366B1 publication Critical patent/FR2971366B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F21/00Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F21/70Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
    • G06F21/86Secure or tamper-resistant housings
    • G06F21/87Secure or tamper-resistant housings by means of encapsulation, e.g. for integrated circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5222Capacitive arrangements or effects of, or between wiring layers
    • H01L23/5223Capacitor integral with wiring layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/57Protection from inspection, reverse engineering or tampering
    • H01L23/576Protection from inspection, reverse engineering or tampering using active circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Security & Cryptography (AREA)
  • Software Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Semiconductor Integrated Circuits (AREA)
FR1100401A 2011-02-09 2011-02-09 Micro plaquette de semi-conducteur comprenant des moyens de protection contre une attaque physique Active FR2971366B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR1100401A FR2971366B1 (fr) 2011-02-09 2011-02-09 Micro plaquette de semi-conducteur comprenant des moyens de protection contre une attaque physique
US13/368,753 US20120199948A1 (en) 2011-02-09 2012-02-08 Semiconductor chip comprising protection means against a physical attack

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1100401A FR2971366B1 (fr) 2011-02-09 2011-02-09 Micro plaquette de semi-conducteur comprenant des moyens de protection contre une attaque physique

Publications (2)

Publication Number Publication Date
FR2971366A1 FR2971366A1 (fr) 2012-08-10
FR2971366B1 true FR2971366B1 (fr) 2013-02-22

Family

ID=44532891

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1100401A Active FR2971366B1 (fr) 2011-02-09 2011-02-09 Micro plaquette de semi-conducteur comprenant des moyens de protection contre une attaque physique

Country Status (2)

Country Link
US (1) US20120199948A1 (fr)
FR (1) FR2971366B1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2766929A1 (fr) * 2012-10-29 2014-08-20 Qatar Foundation Système de détection d'altération
FR3021438B1 (fr) * 2014-05-21 2016-06-24 Inside Secure Etiquette anti-contrefacon double mode
FR3053503B1 (fr) 2016-06-30 2019-03-29 Stmicroelectronics (Rousset) Sas Procede de protection d'un circuit integre, et circuit integre correspondant
DE102017105839A1 (de) * 2017-03-17 2018-09-20 Schaffner Emv Ag Aktives Filter
DE102017207046B4 (de) * 2017-04-26 2019-09-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Herstellen und Auslesen einer kryptografischen Schaltung
CN110010597B (zh) * 2019-03-29 2021-06-18 上海中航光电子有限公司 芯片封装结构及其封装方法
FR3099259B1 (fr) * 2019-07-24 2021-08-13 St Microelectronics Rousset Procédé de protection de données stockées dans une mémoire, et circuit intégré correspondant
CN111738391B (zh) * 2020-08-07 2020-11-17 深圳市汇顶科技股份有限公司 安全芯片和电子设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2786152B2 (ja) * 1996-04-25 1998-08-13 日本電気アイシーマイコンシステム株式会社 半導体集積回路装置
DE10065339B4 (de) * 2000-12-27 2004-04-15 Infineon Technologies Ag Kapazitiver Sensor als Schutzvorrichtung gegen Angriffe auf einen Sicherheitschip
US7851302B2 (en) * 2005-02-04 2010-12-14 Infineon Technologies Ag Capacitors and methods of manufacture thereof
US8138768B2 (en) * 2007-01-30 2012-03-20 Nxp B.V. Sensing circuit for devices with protective coating
US7884625B2 (en) * 2008-07-29 2011-02-08 International Business Machines Corporation Capacitance structures for defeating microchip tampering
US8455990B2 (en) * 2009-02-25 2013-06-04 Conexant Systems, Inc. Systems and methods of tamper proof packaging of a semiconductor device
US8188786B2 (en) * 2009-09-24 2012-05-29 International Business Machines Corporation Modularized three-dimensional capacitor array

Also Published As

Publication number Publication date
FR2971366A1 (fr) 2012-08-10
US20120199948A1 (en) 2012-08-09

Similar Documents

Publication Publication Date Title
FR2971366B1 (fr) Micro plaquette de semi-conducteur comprenant des moyens de protection contre une attaque physique
SG10201701879RA (en) Assembly of wafer stacks
IL226999B (en) Anhydrous silicon cream comprising nanoparticles
EP2696368A4 (fr) Dispositif à semi-conducteur au carbure de silicium
EP2879186A4 (fr) Dispositif semi-conducteur en carbure de silicium
BR112014001868A2 (pt) cápsulas supramoleculares
GB2484858B (en) Semiconductor temperature sensor
GB2508122B (en) Leakage measurement of through silicon vias
GB201118868D0 (en) Semiconductor compounds
FR2998419B1 (fr) Protection d'un circuit integre contre des attaques
EP2828895A4 (fr) Gravure antireflet de surfaces de silicium assistée par du cuivre
EP2763180A4 (fr) Dispositif semi-conducteur de carbure de silicium
GB201113736D0 (en) Chemical protective garment
EP2721381A4 (fr) Spectromètre au niveau de plaquette
SG11201505026YA (en) Printable diffusion barriers for silicon wafers
ZA201308982B (en) Cooling of semiconductor devices
SI2740139T1 (sl) Aparatura za zaščito pred toplotno preobremenitvijo
HK1212708A1 (zh) 流感的計算優化的寬反應性抗原
EP2722877A4 (fr) Structure de refroidissement pour élément semi-conducteur
EP2811529A4 (fr) Dispositif semi-conducteur de carbure de silicium
DE102012200326A8 (de) Siliziumkarbid-Halbleitereinrichtung
EP2866251A4 (fr) Dispositif semi-conducteur au carbure de silicium
IL213766A0 (en) Energetic unit based on semiconductor bridge
IL230702A0 (en) A test to detect the DNA of the jc virus
EP2866263A4 (fr) Dispositif à semi-conducteur de carbure de silicium

Legal Events

Date Code Title Description
CA Change of address

Effective date: 20131112

PLFP Fee payment

Year of fee payment: 6

PLFP Fee payment

Year of fee payment: 7

CD Change of name or company name

Owner name: WISEKEY SEMICONDUCTORS, FR

Effective date: 20170727

TP Transmission of property

Owner name: WISEKEY SEMICONDUCTORS, FR

Effective date: 20170727

GC Lien (pledge) constituted

Effective date: 20170926

TP Transmission of property

Owner name: EXWORKS CAPITAL FUND I, L.P., US

Effective date: 20171120

PLFP Fee payment

Year of fee payment: 8

PLFP Fee payment

Year of fee payment: 9

RG Lien (pledge) cancelled

Effective date: 20191010

PLFP Fee payment

Year of fee payment: 10

PLFP Fee payment

Year of fee payment: 11

PLFP Fee payment

Year of fee payment: 12

PLFP Fee payment

Year of fee payment: 13

PLFP Fee payment

Year of fee payment: 14