FR2951020B1 - MULTILAYER COMPOSITE MATERIAL FOR THE PRODUCTION OF SUBSTRATES OF ELECTRONIC MODULES AND METHOD FOR MANUFACTURING SAME - Google Patents

MULTILAYER COMPOSITE MATERIAL FOR THE PRODUCTION OF SUBSTRATES OF ELECTRONIC MODULES AND METHOD FOR MANUFACTURING SAME

Info

Publication number
FR2951020B1
FR2951020B1 FR0956865A FR0956865A FR2951020B1 FR 2951020 B1 FR2951020 B1 FR 2951020B1 FR 0956865 A FR0956865 A FR 0956865A FR 0956865 A FR0956865 A FR 0956865A FR 2951020 B1 FR2951020 B1 FR 2951020B1
Authority
FR
France
Prior art keywords
substrates
production
composite material
multilayer composite
electronic modules
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR0956865A
Other languages
French (fr)
Other versions
FR2951020A1 (en
Inventor
Yves Bienvenu
Abderrahmen Kaabi
David Ryckelynck
Bertrand Pierre
Christian-Eric Bruzek
Jonathan Idrac
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GRISET, FR
LABORATOIRE NATIONAL DE METROLOGIE ET D'ESSAIS, FR
Association pour la Recherche et le Developpement des Methodes et Processus Industriels
Original Assignee
GRISET Sas
Association pour la Recherche et le Developpement des Methodes et Processus Industriels
LABORATOIRE NATIONAL DE METROLOGIE ET D'ESSAIS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GRISET Sas, Association pour la Recherche et le Developpement des Methodes et Processus Industriels, LABORATOIRE NATIONAL DE METROLOGIE ET D'ESSAIS filed Critical GRISET Sas
Priority to FR0956865A priority Critical patent/FR2951020B1/en
Publication of FR2951020A1 publication Critical patent/FR2951020A1/en
Application granted granted Critical
Publication of FR2951020B1 publication Critical patent/FR2951020B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR0956865A 2009-10-01 2009-10-01 MULTILAYER COMPOSITE MATERIAL FOR THE PRODUCTION OF SUBSTRATES OF ELECTRONIC MODULES AND METHOD FOR MANUFACTURING SAME Active FR2951020B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR0956865A FR2951020B1 (en) 2009-10-01 2009-10-01 MULTILAYER COMPOSITE MATERIAL FOR THE PRODUCTION OF SUBSTRATES OF ELECTRONIC MODULES AND METHOD FOR MANUFACTURING SAME

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0956865A FR2951020B1 (en) 2009-10-01 2009-10-01 MULTILAYER COMPOSITE MATERIAL FOR THE PRODUCTION OF SUBSTRATES OF ELECTRONIC MODULES AND METHOD FOR MANUFACTURING SAME

Publications (2)

Publication Number Publication Date
FR2951020A1 FR2951020A1 (en) 2011-04-08
FR2951020B1 true FR2951020B1 (en) 2012-03-09

Family

ID=42126365

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0956865A Active FR2951020B1 (en) 2009-10-01 2009-10-01 MULTILAYER COMPOSITE MATERIAL FOR THE PRODUCTION OF SUBSTRATES OF ELECTRONIC MODULES AND METHOD FOR MANUFACTURING SAME

Country Status (1)

Country Link
FR (1) FR2951020B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109661145A (en) * 2017-10-12 2019-04-19 古德系统有限公司 Heat sink

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160083856A (en) * 2013-10-18 2016-07-12 그리셋 Support for electronic power components, power module provided with such a support, and corresponding production method
JP6304670B1 (en) * 2017-04-14 2018-04-04 株式会社半導体熱研究所 Heat dissipation substrate, heat dissipation substrate electrode, semiconductor package, and semiconductor module
JP6544727B2 (en) * 2017-11-20 2019-07-17 株式会社半導体熱研究所 Heat dissipation substrate, heat dissipation substrate electrode, semiconductor package, semiconductor module, and method of producing heat dissipation substrate

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3175893A (en) * 1959-02-02 1965-03-30 Clevite Corp Laminate composite material and method of fabrication
CA1316303C (en) * 1988-12-23 1993-04-20 Thijs Eerkes Composite structure
JPH0738428B2 (en) * 1990-01-29 1995-04-26 インコ、リミテッド Composite structure
JPH04215462A (en) * 1990-12-13 1992-08-06 Kawai Musical Instr Mfg Co Ltd Heat sink and manufacture thereof
US6129993A (en) * 1998-02-13 2000-10-10 Hitachi Metals, Ltd. Heat spreader and method of making the same
US6921971B2 (en) * 2003-01-15 2005-07-26 Kyocera Corporation Heat releasing member, package for accommodating semiconductor element and semiconductor device
US7416789B2 (en) * 2004-11-01 2008-08-26 H.C. Starck Inc. Refractory metal substrate with improved thermal conductivity

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109661145A (en) * 2017-10-12 2019-04-19 古德系统有限公司 Heat sink

Also Published As

Publication number Publication date
FR2951020A1 (en) 2011-04-08

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Legal Events

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CD Change of name or company name

Owner name: GRISET, FR

Effective date: 20121026

Owner name: ARMINES, FR

Effective date: 20121026

Owner name: LABORATOIRE NATIONAL DE METROLOGIE ET D'ESSAIS, FR

Effective date: 20121026

TQ Partial transmission of property

Owner name: ARMINES, FR

Effective date: 20121026

Owner name: GRISET, FR

Effective date: 20121026

Owner name: LABORATOIRE NATIONAL DE METROLOGIE ET D'ESSAIS, FR

Effective date: 20121026

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