FR2932609B1 - SOI TRANSISTOR WITH SELF-ALIGNED MASS PLAN AND GRID AND VARIABLE THICKNESS OXIDE - Google Patents

SOI TRANSISTOR WITH SELF-ALIGNED MASS PLAN AND GRID AND VARIABLE THICKNESS OXIDE

Info

Publication number
FR2932609B1
FR2932609B1 FR0853868A FR0853868A FR2932609B1 FR 2932609 B1 FR2932609 B1 FR 2932609B1 FR 0853868 A FR0853868 A FR 0853868A FR 0853868 A FR0853868 A FR 0853868A FR 2932609 B1 FR2932609 B1 FR 2932609B1
Authority
FR
France
Prior art keywords
layer
grid
self
organometallic
variable thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0853868A
Other languages
French (fr)
Other versions
FR2932609A1 (en
Inventor
Beranger Claire Fenouillet
Philippe Coronel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Priority to FR0853868A priority Critical patent/FR2932609B1/en
Priority to DE602009000556T priority patent/DE602009000556D1/en
Priority to EP09162258A priority patent/EP2133919B1/en
Priority to AT09162258T priority patent/ATE495551T1/en
Priority to US12/483,037 priority patent/US7910419B2/en
Publication of FR2932609A1 publication Critical patent/FR2932609A1/en
Application granted granted Critical
Publication of FR2932609B1 publication Critical patent/FR2932609B1/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78645—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with multiple gate
    • H01L29/78648—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with multiple gate arranged on opposing sides of the channel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/74—Making of localized buried regions, e.g. buried collector layers, internal connections substrate contacts
    • H01L21/743—Making of internal connections, substrate contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66742—Thin film unipolar transistors
    • H01L29/66772—Monocristalline silicon transistors on insulating substrates, e.g. quartz substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Thin Film Transistor (AREA)
  • Formation Of Insulating Films (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)

Abstract

The method involves forming a stack having an organometallic layer and a silicon dioxide layer (106), on a face of a silicon substrate (102), and depositing a hydrogen silsesquioxane layer on a silicon layer of the stack. A part is isolated from the organometallic, and the isolated part is removed from the organometallic layer. Silicon dioxide portions (120) and nitride portions (124) are formed in empty spaces formed by removal of the isolated part from the organometallic layer between the face and the silicon dioxide layer around a portion (104a) of the organometallic layer.
FR0853868A 2008-06-11 2008-06-11 SOI TRANSISTOR WITH SELF-ALIGNED MASS PLAN AND GRID AND VARIABLE THICKNESS OXIDE Expired - Fee Related FR2932609B1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR0853868A FR2932609B1 (en) 2008-06-11 2008-06-11 SOI TRANSISTOR WITH SELF-ALIGNED MASS PLAN AND GRID AND VARIABLE THICKNESS OXIDE
DE602009000556T DE602009000556D1 (en) 2008-06-11 2009-06-09 A manufacturing method of a self-aligned baseplate and gate SOI transistor having a variable thickness buried oxide layer
EP09162258A EP2133919B1 (en) 2008-06-11 2009-06-09 Method for manufacturing an SOI transistor with ground plane and gate being self-aligned and with a buried oxide of varying thickness
AT09162258T ATE495551T1 (en) 2008-06-11 2009-06-09 PROCESS FOR PRODUCTION OF SOI TRANSISTOR HAVING SELF-ALIGINATED BASE PLATE AND GATE AND HAVING A BURNED OXIDE LAYER OF VARIABLE THICKNESS
US12/483,037 US7910419B2 (en) 2008-06-11 2009-06-11 SOI transistor with self-aligned ground plane and gate and buried oxide of variable thickness

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0853868A FR2932609B1 (en) 2008-06-11 2008-06-11 SOI TRANSISTOR WITH SELF-ALIGNED MASS PLAN AND GRID AND VARIABLE THICKNESS OXIDE

Publications (2)

Publication Number Publication Date
FR2932609A1 FR2932609A1 (en) 2009-12-18
FR2932609B1 true FR2932609B1 (en) 2010-12-24

Family

ID=40328960

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0853868A Expired - Fee Related FR2932609B1 (en) 2008-06-11 2008-06-11 SOI TRANSISTOR WITH SELF-ALIGNED MASS PLAN AND GRID AND VARIABLE THICKNESS OXIDE

Country Status (5)

Country Link
US (1) US7910419B2 (en)
EP (1) EP2133919B1 (en)
AT (1) ATE495551T1 (en)
DE (1) DE602009000556D1 (en)
FR (1) FR2932609B1 (en)

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US8273617B2 (en) 2009-09-30 2012-09-25 Suvolta, Inc. Electronic devices and systems, and methods for making and using the same
US20110079861A1 (en) * 2009-09-30 2011-04-07 Lucian Shifren Advanced Transistors with Threshold Voltage Set Dopant Structures
US8530286B2 (en) 2010-04-12 2013-09-10 Suvolta, Inc. Low power semiconductor transistor structure and method of fabrication thereof
US8569128B2 (en) 2010-06-21 2013-10-29 Suvolta, Inc. Semiconductor structure and method of fabrication thereof with mixed metal types
US8759872B2 (en) 2010-06-22 2014-06-24 Suvolta, Inc. Transistor with threshold voltage set notch and method of fabrication thereof
US8929054B2 (en) * 2010-07-21 2015-01-06 Cleanvolt Energy, Inc. Use of organic and organometallic high dielectric constant material for improved energy storage devices and associated methods
US8618554B2 (en) 2010-11-08 2013-12-31 International Business Machines Corporation Method to reduce ground-plane poisoning of extremely-thin SOI (ETSOI) layer with thin buried oxide
US8404551B2 (en) 2010-12-03 2013-03-26 Suvolta, Inc. Source/drain extension control for advanced transistors
US8461875B1 (en) 2011-02-18 2013-06-11 Suvolta, Inc. Digital circuits having improved transistors, and methods therefor
US8525271B2 (en) 2011-03-03 2013-09-03 Suvolta, Inc. Semiconductor structure with improved channel stack and method for fabrication thereof
US8400219B2 (en) 2011-03-24 2013-03-19 Suvolta, Inc. Analog circuits having improved transistors, and methods therefor
US8748270B1 (en) 2011-03-30 2014-06-10 Suvolta, Inc. Process for manufacturing an improved analog transistor
US8999861B1 (en) 2011-05-11 2015-04-07 Suvolta, Inc. Semiconductor structure with substitutional boron and method for fabrication thereof
US8796048B1 (en) 2011-05-11 2014-08-05 Suvolta, Inc. Monitoring and measurement of thin film layers
US8811068B1 (en) 2011-05-13 2014-08-19 Suvolta, Inc. Integrated circuit devices and methods
US8569156B1 (en) 2011-05-16 2013-10-29 Suvolta, Inc. Reducing or eliminating pre-amorphization in transistor manufacture
US8735987B1 (en) 2011-06-06 2014-05-27 Suvolta, Inc. CMOS gate stack structures and processes
US8995204B2 (en) 2011-06-23 2015-03-31 Suvolta, Inc. Circuit devices and methods having adjustable transistor body bias
US8629016B1 (en) 2011-07-26 2014-01-14 Suvolta, Inc. Multiple transistor types formed in a common epitaxial layer by differential out-diffusion from a doped underlayer
US8748986B1 (en) * 2011-08-05 2014-06-10 Suvolta, Inc. Electronic device with controlled threshold voltage
WO2013022753A2 (en) 2011-08-05 2013-02-14 Suvolta, Inc. Semiconductor devices having fin structures and fabrication methods thereof
US8614128B1 (en) 2011-08-23 2013-12-24 Suvolta, Inc. CMOS structures and processes based on selective thinning
US8645878B1 (en) 2011-08-23 2014-02-04 Suvolta, Inc. Porting a circuit design from a first semiconductor process to a second semiconductor process
US8713511B1 (en) 2011-09-16 2014-04-29 Suvolta, Inc. Tools and methods for yield-aware semiconductor manufacturing process target generation
US9236466B1 (en) 2011-10-07 2016-01-12 Mie Fujitsu Semiconductor Limited Analog circuits having improved insulated gate transistors, and methods therefor
US8895327B1 (en) 2011-12-09 2014-11-25 Suvolta, Inc. Tipless transistors, short-tip transistors, and methods and circuits therefor
US8819603B1 (en) 2011-12-15 2014-08-26 Suvolta, Inc. Memory circuits and methods of making and designing the same
US8883600B1 (en) 2011-12-22 2014-11-11 Suvolta, Inc. Transistor having reduced junction leakage and methods of forming thereof
US8599623B1 (en) 2011-12-23 2013-12-03 Suvolta, Inc. Circuits and methods for measuring circuit elements in an integrated circuit device
US8877619B1 (en) 2012-01-23 2014-11-04 Suvolta, Inc. Process for manufacture of integrated circuits with different channel doping transistor architectures and devices therefrom
US8970289B1 (en) 2012-01-23 2015-03-03 Suvolta, Inc. Circuits and devices for generating bi-directional body bias voltages, and methods therefor
US9093550B1 (en) 2012-01-31 2015-07-28 Mie Fujitsu Semiconductor Limited Integrated circuits having a plurality of high-K metal gate FETs with various combinations of channel foundation structure and gate stack structure and methods of making same
US9406567B1 (en) 2012-02-28 2016-08-02 Mie Fujitsu Semiconductor Limited Method for fabricating multiple transistor devices on a substrate with varying threshold voltages
US8863064B1 (en) 2012-03-23 2014-10-14 Suvolta, Inc. SRAM cell layout structure and devices therefrom
US9299698B2 (en) 2012-06-27 2016-03-29 Mie Fujitsu Semiconductor Limited Semiconductor structure with multiple transistors having various threshold voltages
US8836037B2 (en) 2012-08-13 2014-09-16 International Business Machines Corporation Structure and method to form input/output devices
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FR2829294B1 (en) * 2001-09-03 2004-10-15 Commissariat Energie Atomique HORIZONTAL SELF-ALIGNED GRID FIELD EFFECT TRANSISTOR AND METHOD OF MANUFACTURING SUCH A TRANSISTOR
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Also Published As

Publication number Publication date
EP2133919B1 (en) 2011-01-12
EP2133919A1 (en) 2009-12-16
US20090311834A1 (en) 2009-12-17
US7910419B2 (en) 2011-03-22
FR2932609A1 (en) 2009-12-18
ATE495551T1 (en) 2011-01-15
DE602009000556D1 (en) 2011-02-24

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Effective date: 20130228