FR2931523B1 - DEVICE FOR FIXING COMPONENTS AND ASSOCIATED ELECTRICAL APPLIANCE - Google Patents

DEVICE FOR FIXING COMPONENTS AND ASSOCIATED ELECTRICAL APPLIANCE

Info

Publication number
FR2931523B1
FR2931523B1 FR0802844A FR0802844A FR2931523B1 FR 2931523 B1 FR2931523 B1 FR 2931523B1 FR 0802844 A FR0802844 A FR 0802844A FR 0802844 A FR0802844 A FR 0802844A FR 2931523 B1 FR2931523 B1 FR 2931523B1
Authority
FR
France
Prior art keywords
electrical appliance
associated electrical
fixing components
fixing
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR0802844A
Other languages
French (fr)
Other versions
FR2931523A1 (en
Inventor
Eric Marliot
Didier Gouardo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Groupe Brandt SAS
Original Assignee
FagorBrandt SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FagorBrandt SAS filed Critical FagorBrandt SAS
Priority to FR0802844A priority Critical patent/FR2931523B1/en
Publication of FR2931523A1 publication Critical patent/FR2931523A1/en
Application granted granted Critical
Publication of FR2931523B1 publication Critical patent/FR2931523B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FR0802844A 2008-05-21 2008-05-21 DEVICE FOR FIXING COMPONENTS AND ASSOCIATED ELECTRICAL APPLIANCE Active FR2931523B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR0802844A FR2931523B1 (en) 2008-05-21 2008-05-21 DEVICE FOR FIXING COMPONENTS AND ASSOCIATED ELECTRICAL APPLIANCE

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0802844A FR2931523B1 (en) 2008-05-21 2008-05-21 DEVICE FOR FIXING COMPONENTS AND ASSOCIATED ELECTRICAL APPLIANCE

Publications (2)

Publication Number Publication Date
FR2931523A1 FR2931523A1 (en) 2009-11-27
FR2931523B1 true FR2931523B1 (en) 2013-01-04

Family

ID=40157703

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0802844A Active FR2931523B1 (en) 2008-05-21 2008-05-21 DEVICE FOR FIXING COMPONENTS AND ASSOCIATED ELECTRICAL APPLIANCE

Country Status (1)

Country Link
FR (1) FR2931523B1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013216049B4 (en) * 2013-08-13 2021-08-26 Kaco New Energy Gmbh Device for mounting and securing a number of power semiconductor components on a heat sink and arrangement with such a device
EP2927954B1 (en) * 2014-04-02 2021-06-09 Brusa Elektronik AG Fastening system for a power module

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8627860U1 (en) * 1986-10-18 1986-12-18 Philips Patentverwaltung Gmbh, 2000 Hamburg Screwing a power semiconductor to a heat sink
US5648889A (en) * 1993-06-07 1997-07-15 Melcher, Ag Attachment device for semiconductor circuit elements
DE19538642A1 (en) * 1995-10-17 1997-04-24 Kd Ingenieurtechnik Gmbh Cooling and assembly device for series of semiconductor components
JPH10189843A (en) * 1996-12-25 1998-07-21 Ricoh Co Ltd Electronic component presser metal fitting
US5903434A (en) * 1997-06-10 1999-05-11 Chiou; Ming Chin CPU heat sink clamping device
US6043981A (en) * 1997-11-13 2000-03-28 Chrysler Corporation Heat sink assembly for electrical components
US6049459A (en) * 1997-11-17 2000-04-11 Lucent Technologies, Inc. Nesting clamps for electrical components
JP4387777B2 (en) * 2003-11-28 2009-12-24 株式会社東芝 Electronics
KR100686029B1 (en) * 2005-02-25 2007-02-22 엘지전자 주식회사 Fixing structure of chip in heatsink in electric-range

Also Published As

Publication number Publication date
FR2931523A1 (en) 2009-11-27

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Legal Events

Date Code Title Description
CA Change of address

Effective date: 20130624

PLFP Fee payment

Year of fee payment: 8

TP Transmission of property

Owner name: GROUPE BRANDT, FR

Effective date: 20150818

GC Lien (pledge) constituted

Effective date: 20151013

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Year of fee payment: 9

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