FR2928490B1 - Circuit integre comprenant des miroirs enterres a des profondeurs differentes - Google Patents
Circuit integre comprenant des miroirs enterres a des profondeurs differentesInfo
- Publication number
- FR2928490B1 FR2928490B1 FR0851494A FR0851494A FR2928490B1 FR 2928490 B1 FR2928490 B1 FR 2928490B1 FR 0851494 A FR0851494 A FR 0851494A FR 0851494 A FR0851494 A FR 0851494A FR 2928490 B1 FR2928490 B1 FR 2928490B1
- Authority
- FR
- France
- Prior art keywords
- burial
- mirrors
- integrated circuit
- different depths
- depths
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000009933 burial Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14645—Colour imagers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Light Receiving Elements (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0851494A FR2928490B1 (fr) | 2008-03-07 | 2008-03-07 | Circuit integre comprenant des miroirs enterres a des profondeurs differentes |
US12/398,872 US7902621B2 (en) | 2008-03-07 | 2009-03-05 | Integrated circuit comprising mirrors buried at different depths |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0851494A FR2928490B1 (fr) | 2008-03-07 | 2008-03-07 | Circuit integre comprenant des miroirs enterres a des profondeurs differentes |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2928490A1 FR2928490A1 (fr) | 2009-09-11 |
FR2928490B1 true FR2928490B1 (fr) | 2011-04-15 |
Family
ID=39773127
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0851494A Expired - Fee Related FR2928490B1 (fr) | 2008-03-07 | 2008-03-07 | Circuit integre comprenant des miroirs enterres a des profondeurs differentes |
Country Status (2)
Country | Link |
---|---|
US (1) | US7902621B2 (fr) |
FR (1) | FR2928490B1 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9097845B2 (en) * | 2011-11-02 | 2015-08-04 | Samsung Electronics Co., Ltd. | Optoelectronic chips including coupler region and methods of manufacturing the same |
US8995799B2 (en) * | 2011-11-02 | 2015-03-31 | Samsung Electronics Co., Ltd. | Optoelectronic chips including coupler region and methods of manufacturing the same |
FR3083644B1 (fr) * | 2018-07-09 | 2021-05-14 | St Microelectronics Crolles 2 Sas | Capteur d'images |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3630999B2 (ja) * | 1998-08-19 | 2005-03-23 | 富士通株式会社 | 半導体装置及びその製造方法 |
JP4350337B2 (ja) * | 2001-04-27 | 2009-10-21 | 富士通マイクロエレクトロニクス株式会社 | 半導体装置 |
WO2004054001A2 (fr) * | 2002-12-09 | 2004-06-24 | Quantum Semiconductor Llc | Capteur d'images cmos |
US6927432B2 (en) * | 2003-08-13 | 2005-08-09 | Motorola, Inc. | Vertically integrated photosensor for CMOS imagers |
US7755122B2 (en) * | 2005-08-29 | 2010-07-13 | United Microelectronics Corp. | Complementary metal oxide semiconductor image sensor |
KR100710207B1 (ko) * | 2005-09-22 | 2007-04-20 | 동부일렉트로닉스 주식회사 | 씨모스 이미지 센서의 제조방법 |
US7964928B2 (en) * | 2005-11-22 | 2011-06-21 | Stmicroelectronics S.A. | Photodetector with an improved resolution |
KR100660714B1 (ko) * | 2005-12-29 | 2006-12-21 | 매그나칩 반도체 유한회사 | 백사이드 조명 구조의 씨모스 이미지 센서 및 그의 제조방법 |
US7638852B2 (en) * | 2006-05-09 | 2009-12-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of making wafer structure for backside illuminated color image sensor |
WO2008017490A2 (fr) * | 2006-08-09 | 2008-02-14 | Opsolution Nanophotonics Gmbh | Filtre optique et procédé de fabrication de celui-ci, ainsi que dispositif d'étude de rayonnement électromagnétique |
KR100745991B1 (ko) * | 2006-08-11 | 2007-08-06 | 삼성전자주식회사 | 이미지 센서 및 그 제조 방법 |
-
2008
- 2008-03-07 FR FR0851494A patent/FR2928490B1/fr not_active Expired - Fee Related
-
2009
- 2009-03-05 US US12/398,872 patent/US7902621B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7902621B2 (en) | 2011-03-08 |
FR2928490A1 (fr) | 2009-09-11 |
US20090256224A1 (en) | 2009-10-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE602006021235D1 (de) | Kristallglasgegenstand | |
DE602007000065D1 (de) | Positionsberechnungsgerät | |
ATE404465T1 (de) | Kapsel mit reduziertem nachtropfen | |
DE502007004319D1 (de) | Fühler | |
BRPI0922002A2 (pt) | esfigmomanômetro eletrônico | |
DE602006019321D1 (de) | Matratze | |
FR2946182B1 (fr) | Circuit integre tridimensionnel. | |
DE112008000345A5 (de) | Sensoranordnung | |
FI20060012A0 (fi) | Laakerikilpi | |
DE112008003719A5 (de) | Füllstandssensor | |
DE502006005208D1 (de) | Kochgefäss | |
FR2928490B1 (fr) | Circuit integre comprenant des miroirs enterres a des profondeurs differentes | |
DE502008002354D1 (de) | Wasserwaage | |
ITMI20060730A1 (it) | Friggitrice | |
DE602007004450D1 (de) | Integrierte schaltung | |
DE602006005046D1 (de) | Integrierte Schaltung | |
DE112007000996A5 (de) | Sensor | |
ES1063432Y (es) | Disuasor postural durante el sueño | |
IT1391281B1 (it) | Sensore elettronico. | |
ES1072954Y (es) | Termostato electronico | |
FIU20070160U0 (fi) | Elektroniikkalaite | |
FI20070216A0 (fi) | Elektronisen anturin diagnosointi | |
AT8326U3 (de) | Matratze | |
ITCH20060007A1 (it) | Sepolcro cimiteriale | |
FR2922099B1 (fr) | Cercueil |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20141128 |