FR2923978A1 - Dispositif de commande d'un appareil electromenager - Google Patents
Dispositif de commande d'un appareil electromenager Download PDFInfo
- Publication number
- FR2923978A1 FR2923978A1 FR0708033A FR0708033A FR2923978A1 FR 2923978 A1 FR2923978 A1 FR 2923978A1 FR 0708033 A FR0708033 A FR 0708033A FR 0708033 A FR0708033 A FR 0708033A FR 2923978 A1 FR2923978 A1 FR 2923978A1
- Authority
- FR
- France
- Prior art keywords
- circuit board
- printed circuit
- rivets
- radiator
- control device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 4
- 230000006698 induction Effects 0.000 title description 9
- 238000009835 boiling Methods 0.000 title 1
- 229910001369 Brass Inorganic materials 0.000 claims abstract description 3
- 239000010951 brass Substances 0.000 claims abstract description 3
- 238000010438 heat treatment Methods 0.000 claims abstract description 3
- 238000010411 cooking Methods 0.000 claims description 7
- 238000003466 welding Methods 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10401—Eyelets, i.e. rings inserted into a hole through a circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10962—Component not directly connected to the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cookers (AREA)
Abstract
Description
Claims (11)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0708033A FR2923978B1 (fr) | 2007-11-15 | 2007-11-15 | Dispositif de commande d'un appareil electromenager |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0708033A FR2923978B1 (fr) | 2007-11-15 | 2007-11-15 | Dispositif de commande d'un appareil electromenager |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2923978A1 true FR2923978A1 (fr) | 2009-05-22 |
FR2923978B1 FR2923978B1 (fr) | 2010-03-26 |
Family
ID=39511059
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0708033A Active FR2923978B1 (fr) | 2007-11-15 | 2007-11-15 | Dispositif de commande d'un appareil electromenager |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2923978B1 (fr) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4724514A (en) * | 1986-07-18 | 1988-02-09 | Kaufman Lance R | Low cost compressively clamped circuit and heat sink assembly |
EP0561208A2 (fr) * | 1992-03-14 | 1993-09-22 | E.G.O. Elektro-Geräte Blanc und Fischer GmbH & Co. KG | Plaque de cuisson à induction |
US20030067754A1 (en) * | 2000-04-11 | 2003-04-10 | Monika Bauer | Device for fixing a heat distribution covering on a printed circuit board and circuit board with heat distribution covering |
US20060158859A1 (en) * | 2005-01-14 | 2006-07-20 | Funai Electric Co., Ltd. | Power supply and fixing structure of heatsink and circuit board applicable the same |
-
2007
- 2007-11-15 FR FR0708033A patent/FR2923978B1/fr active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4724514A (en) * | 1986-07-18 | 1988-02-09 | Kaufman Lance R | Low cost compressively clamped circuit and heat sink assembly |
EP0561208A2 (fr) * | 1992-03-14 | 1993-09-22 | E.G.O. Elektro-Geräte Blanc und Fischer GmbH & Co. KG | Plaque de cuisson à induction |
US20030067754A1 (en) * | 2000-04-11 | 2003-04-10 | Monika Bauer | Device for fixing a heat distribution covering on a printed circuit board and circuit board with heat distribution covering |
US20060158859A1 (en) * | 2005-01-14 | 2006-07-20 | Funai Electric Co., Ltd. | Power supply and fixing structure of heatsink and circuit board applicable the same |
Also Published As
Publication number | Publication date |
---|---|
FR2923978B1 (fr) | 2010-03-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
CA | Change of address |
Effective date: 20130624 |
|
TP | Transmission of property |
Owner name: GROUPE BRANDT, FR Effective date: 20150818 |
|
GC | Lien (pledge) constituted |
Effective date: 20151013 |
|
PLFP | Fee payment |
Year of fee payment: 9 |
|
PLFP | Fee payment |
Year of fee payment: 10 |
|
PLFP | Fee payment |
Year of fee payment: 11 |
|
PLFP | Fee payment |
Year of fee payment: 13 |
|
PLFP | Fee payment |
Year of fee payment: 14 |
|
PLFP | Fee payment |
Year of fee payment: 15 |
|
PLFP | Fee payment |
Year of fee payment: 16 |
|
PLFP | Fee payment |
Year of fee payment: 17 |