FR2901059B3 - HEAT DISSIPATING DEVICE HAVING FIBER-LIKE RADIANT FINS - Google Patents
HEAT DISSIPATING DEVICE HAVING FIBER-LIKE RADIANT FINSInfo
- Publication number
- FR2901059B3 FR2901059B3 FR0604078A FR0604078A FR2901059B3 FR 2901059 B3 FR2901059 B3 FR 2901059B3 FR 0604078 A FR0604078 A FR 0604078A FR 0604078 A FR0604078 A FR 0604078A FR 2901059 B3 FR2901059 B3 FR 2901059B3
- Authority
- FR
- France
- Prior art keywords
- fiber
- heat dissipating
- dissipating device
- radiant fins
- radiant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0604078A FR2901059B3 (en) | 2006-05-09 | 2006-05-09 | HEAT DISSIPATING DEVICE HAVING FIBER-LIKE RADIANT FINS |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0604078A FR2901059B3 (en) | 2006-05-09 | 2006-05-09 | HEAT DISSIPATING DEVICE HAVING FIBER-LIKE RADIANT FINS |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2901059A3 FR2901059A3 (en) | 2007-11-16 |
FR2901059B3 true FR2901059B3 (en) | 2008-04-18 |
Family
ID=38651017
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0604078A Expired - Fee Related FR2901059B3 (en) | 2006-05-09 | 2006-05-09 | HEAT DISSIPATING DEVICE HAVING FIBER-LIKE RADIANT FINS |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2901059B3 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2612755B1 (en) * | 2010-08-31 | 2019-03-20 | Sekisui Polymatech Co., Ltd. | Thermally conductive sheet |
-
2006
- 2006-05-09 FR FR0604078A patent/FR2901059B3/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2901059A3 (en) | 2007-11-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20100129 |