FR2898528B1 - HIGH CADENCE LASER MARKING MACHINE - Google Patents

HIGH CADENCE LASER MARKING MACHINE

Info

Publication number
FR2898528B1
FR2898528B1 FR0602209A FR0602209A FR2898528B1 FR 2898528 B1 FR2898528 B1 FR 2898528B1 FR 0602209 A FR0602209 A FR 0602209A FR 0602209 A FR0602209 A FR 0602209A FR 2898528 B1 FR2898528 B1 FR 2898528B1
Authority
FR
France
Prior art keywords
laser marking
marking machine
high cadence
cadence
machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0602209A
Other languages
French (fr)
Other versions
FR2898528A1 (en
Inventor
Benoit Berthe
Dominique Perdoux
Frederic Beulet
Patrick Baudron
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Entrust Corp
Original Assignee
Datacard Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Datacard Corp filed Critical Datacard Corp
Priority to FR0602209A priority Critical patent/FR2898528B1/en
Priority to EP07731120A priority patent/EP1996366A2/en
Priority to PCT/FR2007/000423 priority patent/WO2007104854A2/en
Priority to TW096108550A priority patent/TW200800631A/en
Publication of FR2898528A1 publication Critical patent/FR2898528A1/en
Application granted granted Critical
Publication of FR2898528B1 publication Critical patent/FR2898528B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/0342—Observing magnetic fields related to the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/0344—Observing the speed of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B23K26/0673—Dividing the beam into multiple beams, e.g. multi-focusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure
    • B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure in an enclosure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/47—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using the combination of scanning and modulation of light
    • B41J2/471—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using the combination of scanning and modulation of light using dot sequential main scanning by means of a light deflector, e.g. a rotating polygonal mirror
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/405—Marking
    • B42D25/41—Marking using electromagnetic radiation

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Manufacturing & Machinery (AREA)
  • Laser Beam Processing (AREA)
FR0602209A 2006-03-14 2006-03-14 HIGH CADENCE LASER MARKING MACHINE Expired - Fee Related FR2898528B1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR0602209A FR2898528B1 (en) 2006-03-14 2006-03-14 HIGH CADENCE LASER MARKING MACHINE
EP07731120A EP1996366A2 (en) 2006-03-14 2007-03-09 High frequency laser marking machine
PCT/FR2007/000423 WO2007104854A2 (en) 2006-03-14 2007-03-09 High frequency laser marking machine
TW096108550A TW200800631A (en) 2006-03-14 2007-03-13 Machine de marquage laser a haute cadence

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0602209A FR2898528B1 (en) 2006-03-14 2006-03-14 HIGH CADENCE LASER MARKING MACHINE

Publications (2)

Publication Number Publication Date
FR2898528A1 FR2898528A1 (en) 2007-09-21
FR2898528B1 true FR2898528B1 (en) 2008-05-30

Family

ID=37428601

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0602209A Expired - Fee Related FR2898528B1 (en) 2006-03-14 2006-03-14 HIGH CADENCE LASER MARKING MACHINE

Country Status (4)

Country Link
EP (1) EP1996366A2 (en)
FR (1) FR2898528B1 (en)
TW (1) TW200800631A (en)
WO (1) WO2007104854A2 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2595818A1 (en) * 2010-07-23 2013-05-29 Datacard Corporation Method of and apparatus for personalising a series of portable objects
US8786650B1 (en) * 2012-03-07 2014-07-22 Express Scripts, Inc. Systems and methods for pharmacy messaging
CN103121326B (en) * 2013-01-21 2014-12-10 深圳市大族激光科技股份有限公司 Motion marking device and method for positioning articles by using industrial camera
CN105447531A (en) * 2014-09-09 2016-03-30 北京爱创科技股份有限公司 Laser identifier positioning device, method and product
TWI607814B (en) * 2015-10-28 2017-12-11 新代科技股份有限公司 Flying Laser Marking System with Real-time 3D Modeling and Method Thereof
CN107570883A (en) * 2017-10-17 2018-01-12 深圳华创兆业科技股份有限公司 Laser Grinder
CN108890142A (en) * 2018-09-12 2018-11-27 苏州新火花机床有限公司 A kind of network control laser mark printing device
US12290878B2 (en) * 2019-03-20 2025-05-06 Bobst Mex Sa Characterization method and system for a laser processing machine with a moving sheet or web
DE102019205872A1 (en) * 2019-04-24 2020-10-29 Mühlbauer Gmbh & Co. Kg DEVICE AND METHOD FOR PERSONALIZING DOCUMENTS
CN112828444A (en) * 2019-11-22 2021-05-25 大族激光科技产业集团股份有限公司 On-line test tube laser marking device and method
FR3103404B1 (en) * 2019-11-26 2024-02-23 Antonio Alves Device for processing several object faces, and corresponding processing method
EP4279291A1 (en) * 2022-05-19 2023-11-22 MB Automation GmbH & Co. KG Document processing apparatus
DE102022128658A1 (en) * 2022-10-28 2024-05-08 Sommer Gmbh Laser-markable film, laser marking process and labels made therewith
CN116944691B (en) * 2023-09-20 2023-11-28 北京紫英轩文化传播有限公司 Laser marking device for electronic product
WO2026033347A1 (en) * 2024-08-06 2026-02-12 G.D S.P.A. System and method for processing an article in a predetermined zone of the article

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5937270A (en) * 1996-01-24 1999-08-10 Micron Electronics, Inc. Method of efficiently laser marking singulated semiconductor devices
US6262388B1 (en) * 1998-12-21 2001-07-17 Micron Electronics, Inc. Laser marking station with enclosure and method of operation
US6359253B1 (en) * 2000-07-12 2002-03-19 Advanced Micro Devices, Inc. Unit-in-tray pocket checker
FR2883503B1 (en) * 2005-03-23 2020-11-06 Datacard Corp HIGH RATE LASER MARKING MACHINE

Also Published As

Publication number Publication date
WO2007104854A2 (en) 2007-09-20
TW200800631A (en) 2008-01-01
FR2898528A1 (en) 2007-09-21
TWI346048B (en) 2011-08-01
EP1996366A2 (en) 2008-12-03
WO2007104854A3 (en) 2007-11-22

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20131129