FR2895548B1 - METHOD FOR MANUFACTURING A MICROCIRCUIT CARD, AND ASSOCIATED MICROCIRCUIT CARD - Google Patents

METHOD FOR MANUFACTURING A MICROCIRCUIT CARD, AND ASSOCIATED MICROCIRCUIT CARD

Info

Publication number
FR2895548B1
FR2895548B1 FR0513320A FR0513320A FR2895548B1 FR 2895548 B1 FR2895548 B1 FR 2895548B1 FR 0513320 A FR0513320 A FR 0513320A FR 0513320 A FR0513320 A FR 0513320A FR 2895548 B1 FR2895548 B1 FR 2895548B1
Authority
FR
France
Prior art keywords
microcircuit card
microcircuit
mould
card
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0513320A
Other languages
French (fr)
Other versions
FR2895548A1 (en
Inventor
Francois Launay
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Idemia France SAS
Original Assignee
Oberthur Card Systems SA France
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oberthur Card Systems SA France filed Critical Oberthur Card Systems SA France
Priority to FR0513320A priority Critical patent/FR2895548B1/en
Priority to PCT/FR2006/002855 priority patent/WO2007077356A2/en
Publication of FR2895548A1 publication Critical patent/FR2895548A1/en
Application granted granted Critical
Publication of FR2895548B1 publication Critical patent/FR2895548B1/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/70—Completely encapsulating inserts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/183—Connection portion, e.g. seal
    • H01L2924/18301—Connection portion, e.g. seal being an anchoring portion, i.e. mechanical interlocking between the encapsulation resin and another package part

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Mechanical Engineering (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

The invention relates to a method for producing a microcircuit card. According to said method, a carrier film comprising a microcircuit is prepared; the film is provided with fixing means; the carrier film prepared in this way is positioned in a mould comprising the impression of the microcircuit card to be produced, the film being dimensioned in such a way as to hang out of the mould in order to facilitate the positioning of the microcircuit; and a plastic material is introduced into the mould such that it fills the impression of the mould and interacts with the fixing means in such a way as to fix the carrier film to the moulded card.
FR0513320A 2005-12-26 2005-12-26 METHOD FOR MANUFACTURING A MICROCIRCUIT CARD, AND ASSOCIATED MICROCIRCUIT CARD Expired - Fee Related FR2895548B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR0513320A FR2895548B1 (en) 2005-12-26 2005-12-26 METHOD FOR MANUFACTURING A MICROCIRCUIT CARD, AND ASSOCIATED MICROCIRCUIT CARD
PCT/FR2006/002855 WO2007077356A2 (en) 2005-12-26 2006-12-22 Method for producing a microcircuit card, and associated microcircuit card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0513320A FR2895548B1 (en) 2005-12-26 2005-12-26 METHOD FOR MANUFACTURING A MICROCIRCUIT CARD, AND ASSOCIATED MICROCIRCUIT CARD

Publications (2)

Publication Number Publication Date
FR2895548A1 FR2895548A1 (en) 2007-06-29
FR2895548B1 true FR2895548B1 (en) 2008-03-21

Family

ID=36917263

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0513320A Expired - Fee Related FR2895548B1 (en) 2005-12-26 2005-12-26 METHOD FOR MANUFACTURING A MICROCIRCUIT CARD, AND ASSOCIATED MICROCIRCUIT CARD

Country Status (2)

Country Link
FR (1) FR2895548B1 (en)
WO (1) WO2007077356A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6125332B2 (en) * 2013-05-31 2017-05-10 ルネサスエレクトロニクス株式会社 Semiconductor device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5244840A (en) * 1989-05-23 1993-09-14 Mitsubishi Denki Kabushiki Kaisha Method for manufacturing an encapsulated IC card having a molded frame and a circuit board
JP2560895B2 (en) * 1990-07-25 1996-12-04 三菱電機株式会社 IC card manufacturing method and IC card
DE4401588C2 (en) * 1994-01-20 2003-02-20 Gemplus Gmbh Method for capping a chip card module and chip card module
US5682673A (en) * 1995-04-17 1997-11-04 Ipac, Inc. Method for forming encapsulated IC packages
DE19625228C2 (en) * 1996-06-24 1998-05-14 Siemens Ag System carrier for mounting an integrated circuit in an injection molded housing
DE19800646C2 (en) * 1998-01-09 2000-05-04 Siemens Ag Carrier element for a semiconductor chip
DE19922473A1 (en) * 1999-05-19 2000-11-30 Giesecke & Devrient Gmbh Chip carrier module has cut-outs forming large-area setting material holders with boundary forming setting material flow barrier, bridges mechanically connecting adjacent contact areas
DE10235770A1 (en) * 2002-08-05 2004-02-19 Giesecke & Devrient Gmbh To produce a chip card, the chip module is fixed in place within the injection mold, to be encapsulated accurately within the molded card-shaped body in an efficient injection molding operation

Also Published As

Publication number Publication date
WO2007077356A3 (en) 2007-09-07
WO2007077356A2 (en) 2007-07-12
FR2895548A1 (en) 2007-06-29

Similar Documents

Publication Publication Date Title
DE112006001802A5 (en) Device for producing blow mold segments
ATE374379T1 (en) PROCESS FOR PRODUCING TRANSPARENT MOLDED PARTS
DE602006016700D1 (en) A process for producing high molecular weight organopolysiloxane, composition and sealed optical semiconductor therefor
DE102006004331A8 (en) Optical glass, spherical glass molded article, optical part, process for producing a glass molded material, and process for producing an optical part
ATE433916T1 (en) DEVICE FOR PRODUCING THERMOFORMED PACKAGING TRAYS WITH A COOLED BOTTOM OF THE MOLD
DE602004004398D1 (en) MOLDING DEVICE FOR PRODUCING CONTAINERS FROM THERMOPLASTIC MATERIAL
DE60001601D1 (en) Manufacturing process for manufacturing a CMOS integrated circuit with vertical transistors
EP1938968A4 (en) Resin film and method for producing same, printed matter, label and resin molded article
DE502006002510D1 (en) PROCESS FOR PREPARING SILICONE-CONTAINING POLYMERIZES
DE602006006074D1 (en) METHOD FOR PRODUCING A FILM FROM FIBER MATERIAL WITH LOCALIZED FIBER MATERIALS
FR2821785B1 (en) PROCESS FOR THE MANUFACTURE OF GLASSES IN PLASTIC MATERIAL
ATA10892004A (en) PROCESS FOR PRODUCING PROFILES FROM THERMOPLASTIC PLASTIC
ATE524289T1 (en) DEFORMING STATION
FR2888852B1 (en) MOLDING MATERIAL AND METHOD FOR PRODUCING THE SAME
ATE407786T1 (en) ARTICLE HAVING AN INTEGRATED STRUCTURE MADE OF COMPOSITE MATERIAL AND THERMOPLASTIC OR ELASTOMER MATERIAL AND METHOD FOR MANUFACTURING THE ARTICLE
DE502005001656D1 (en) Process for producing plastic containers for liquids
FR2894772B1 (en) DHA ENRICHMENT PROCESS
FR2889481B1 (en) METHOD AND DEVICE FOR MANUFACTURING CYLINDRICAL MOLDED PARTS ACCORDING TO THE MOLD LABELING METHOD
FR2895548B1 (en) METHOD FOR MANUFACTURING A MICROCIRCUIT CARD, AND ASSOCIATED MICROCIRCUIT CARD
ITRM20030429A0 (en) HEATED BLOWING MOLD FOR THERMO-STABILIZATION PROCESS.
DE602005026841D1 (en) PROCESS FOR PREPARING 1,2,2,2-TETRAFLUOR-ETHYL-DIFLUOR-METHYL ETHER
ATE501049T1 (en) LABEL WITH MOLDABLE CUP
ATA5492004A (en) DEVICE FOR PREPARING THERMOPLASTIC PLASTIC MATERIAL
ATE482812T1 (en) DEVICE FOR PRODUCING PLASTIC FILMS
FR2895547B1 (en) METHOD FOR MANUFACTURING A MICROCIRCUIT BOARD

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 11

PLFP Fee payment

Year of fee payment: 12

PLFP Fee payment

Year of fee payment: 13

PLFP Fee payment

Year of fee payment: 15

CA Change of address

Effective date: 20201228

CD Change of name or company name

Owner name: IDEMIA FRANCE, FR

Effective date: 20201228

ST Notification of lapse

Effective date: 20210806