FR2893182B1 - Procede de decoupe de puces de circuit-integre sur substrat aminci - Google Patents
Procede de decoupe de puces de circuit-integre sur substrat aminciInfo
- Publication number
- FR2893182B1 FR2893182B1 FR0511459A FR0511459A FR2893182B1 FR 2893182 B1 FR2893182 B1 FR 2893182B1 FR 0511459 A FR0511459 A FR 0511459A FR 0511459 A FR0511459 A FR 0511459A FR 2893182 B1 FR2893182 B1 FR 2893182B1
- Authority
- FR
- France
- Prior art keywords
- aminci
- substrate
- integrated circuit
- circuit chip
- cutting method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1464—Back illuminated imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14687—Wafer level processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Solid State Image Pick-Up Elements (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0511459A FR2893182B1 (fr) | 2005-11-10 | 2005-11-10 | Procede de decoupe de puces de circuit-integre sur substrat aminci |
PCT/EP2006/067787 WO2007054434A1 (fr) | 2005-11-10 | 2006-10-26 | Procede de decoupe de puces de circuit-integre sur substrat aminci |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0511459A FR2893182B1 (fr) | 2005-11-10 | 2005-11-10 | Procede de decoupe de puces de circuit-integre sur substrat aminci |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2893182A1 FR2893182A1 (fr) | 2007-05-11 |
FR2893182B1 true FR2893182B1 (fr) | 2007-12-28 |
Family
ID=36691416
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0511459A Active FR2893182B1 (fr) | 2005-11-10 | 2005-11-10 | Procede de decoupe de puces de circuit-integre sur substrat aminci |
Country Status (2)
Country | Link |
---|---|
FR (1) | FR2893182B1 (fr) |
WO (1) | WO2007054434A1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013172014A (ja) * | 2012-02-21 | 2013-09-02 | Sony Corp | 固体撮像装置およびその製造方法、並びにカメラシステム |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56103447A (en) * | 1980-01-22 | 1981-08-18 | Toshiba Corp | Dicing method of semiconductor wafer |
JPS6226839A (ja) * | 1985-07-29 | 1987-02-04 | Oki Electric Ind Co Ltd | 半導体基板 |
JPS63226940A (ja) * | 1987-03-16 | 1988-09-21 | Mitsubishi Electric Corp | 半導体ウエハ |
JP2890380B2 (ja) * | 1991-11-27 | 1999-05-10 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
DE4317721C1 (de) * | 1993-05-27 | 1994-07-21 | Siemens Ag | Verfahren zur Vereinzelung von Chips aus einem Wafer |
US5834829A (en) * | 1996-09-05 | 1998-11-10 | International Business Machines Corporation | Energy relieving crack stop |
US5789302A (en) * | 1997-03-24 | 1998-08-04 | Siemens Aktiengesellschaft | Crack stops |
US6838299B2 (en) * | 2001-11-28 | 2005-01-04 | Intel Corporation | Forming defect prevention trenches in dicing streets |
-
2005
- 2005-11-10 FR FR0511459A patent/FR2893182B1/fr active Active
-
2006
- 2006-10-26 WO PCT/EP2006/067787 patent/WO2007054434A1/fr active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2007054434A1 (fr) | 2007-05-18 |
FR2893182A1 (fr) | 2007-05-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 11 |
|
PLFP | Fee payment |
Year of fee payment: 12 |
|
PLFP | Fee payment |
Year of fee payment: 13 |
|
CD | Change of name or company name |
Owner name: TELEDYNE E2V SEMICONDUCTORS SAS, FR Effective date: 20180907 |
|
CJ | Change in legal form |
Effective date: 20180907 |