FR2893182B1 - Procede de decoupe de puces de circuit-integre sur substrat aminci - Google Patents

Procede de decoupe de puces de circuit-integre sur substrat aminci

Info

Publication number
FR2893182B1
FR2893182B1 FR0511459A FR0511459A FR2893182B1 FR 2893182 B1 FR2893182 B1 FR 2893182B1 FR 0511459 A FR0511459 A FR 0511459A FR 0511459 A FR0511459 A FR 0511459A FR 2893182 B1 FR2893182 B1 FR 2893182B1
Authority
FR
France
Prior art keywords
aminci
substrate
integrated circuit
circuit chip
cutting method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR0511459A
Other languages
English (en)
Other versions
FR2893182A1 (fr
Inventor
Pierre Blanchard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teledyne e2v Semiconductors SAS
Original Assignee
Atmel Grenoble SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atmel Grenoble SA filed Critical Atmel Grenoble SA
Priority to FR0511459A priority Critical patent/FR2893182B1/fr
Priority to PCT/EP2006/067787 priority patent/WO2007054434A1/fr
Publication of FR2893182A1 publication Critical patent/FR2893182A1/fr
Application granted granted Critical
Publication of FR2893182B1 publication Critical patent/FR2893182B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/562Protection against mechanical damage
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/1464Back illuminated imager structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14683Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14687Wafer level processing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Solid State Image Pick-Up Elements (AREA)
FR0511459A 2005-11-10 2005-11-10 Procede de decoupe de puces de circuit-integre sur substrat aminci Active FR2893182B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR0511459A FR2893182B1 (fr) 2005-11-10 2005-11-10 Procede de decoupe de puces de circuit-integre sur substrat aminci
PCT/EP2006/067787 WO2007054434A1 (fr) 2005-11-10 2006-10-26 Procede de decoupe de puces de circuit-integre sur substrat aminci

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0511459A FR2893182B1 (fr) 2005-11-10 2005-11-10 Procede de decoupe de puces de circuit-integre sur substrat aminci

Publications (2)

Publication Number Publication Date
FR2893182A1 FR2893182A1 (fr) 2007-05-11
FR2893182B1 true FR2893182B1 (fr) 2007-12-28

Family

ID=36691416

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0511459A Active FR2893182B1 (fr) 2005-11-10 2005-11-10 Procede de decoupe de puces de circuit-integre sur substrat aminci

Country Status (2)

Country Link
FR (1) FR2893182B1 (fr)
WO (1) WO2007054434A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013172014A (ja) * 2012-02-21 2013-09-02 Sony Corp 固体撮像装置およびその製造方法、並びにカメラシステム

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56103447A (en) * 1980-01-22 1981-08-18 Toshiba Corp Dicing method of semiconductor wafer
JPS6226839A (ja) * 1985-07-29 1987-02-04 Oki Electric Ind Co Ltd 半導体基板
JPS63226940A (ja) * 1987-03-16 1988-09-21 Mitsubishi Electric Corp 半導体ウエハ
JP2890380B2 (ja) * 1991-11-27 1999-05-10 三菱電機株式会社 半導体装置およびその製造方法
DE4317721C1 (de) * 1993-05-27 1994-07-21 Siemens Ag Verfahren zur Vereinzelung von Chips aus einem Wafer
US5834829A (en) * 1996-09-05 1998-11-10 International Business Machines Corporation Energy relieving crack stop
US5789302A (en) * 1997-03-24 1998-08-04 Siemens Aktiengesellschaft Crack stops
US6838299B2 (en) * 2001-11-28 2005-01-04 Intel Corporation Forming defect prevention trenches in dicing streets

Also Published As

Publication number Publication date
WO2007054434A1 (fr) 2007-05-18
FR2893182A1 (fr) 2007-05-11

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Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 11

PLFP Fee payment

Year of fee payment: 12

PLFP Fee payment

Year of fee payment: 13

CD Change of name or company name

Owner name: TELEDYNE E2V SEMICONDUCTORS SAS, FR

Effective date: 20180907

CJ Change in legal form

Effective date: 20180907