FR2883448B1 - ASSEMBLY COMPRISING A PRINTED CIRCUIT, A POWER COMPONENT AND A RADIATOR - Google Patents

ASSEMBLY COMPRISING A PRINTED CIRCUIT, A POWER COMPONENT AND A RADIATOR

Info

Publication number
FR2883448B1
FR2883448B1 FR0502636A FR0502636A FR2883448B1 FR 2883448 B1 FR2883448 B1 FR 2883448B1 FR 0502636 A FR0502636 A FR 0502636A FR 0502636 A FR0502636 A FR 0502636A FR 2883448 B1 FR2883448 B1 FR 2883448B1
Authority
FR
France
Prior art keywords
radiator
assembly
printed circuit
power component
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR0502636A
Other languages
French (fr)
Other versions
FR2883448A1 (en
Inventor
Gautier Louchart
Stephane Nelias
Arnaud Dieudonne
Francois Warnan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Continental Automotive France SAS
Original Assignee
Siemens VDO Automotive SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens VDO Automotive SAS filed Critical Siemens VDO Automotive SAS
Priority to FR0502636A priority Critical patent/FR2883448B1/en
Publication of FR2883448A1 publication Critical patent/FR2883448A1/en
Application granted granted Critical
Publication of FR2883448B1 publication Critical patent/FR2883448B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
FR0502636A 2005-03-17 2005-03-17 ASSEMBLY COMPRISING A PRINTED CIRCUIT, A POWER COMPONENT AND A RADIATOR Active FR2883448B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR0502636A FR2883448B1 (en) 2005-03-17 2005-03-17 ASSEMBLY COMPRISING A PRINTED CIRCUIT, A POWER COMPONENT AND A RADIATOR

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0502636A FR2883448B1 (en) 2005-03-17 2005-03-17 ASSEMBLY COMPRISING A PRINTED CIRCUIT, A POWER COMPONENT AND A RADIATOR

Publications (2)

Publication Number Publication Date
FR2883448A1 FR2883448A1 (en) 2006-09-22
FR2883448B1 true FR2883448B1 (en) 2009-04-17

Family

ID=35045255

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0502636A Active FR2883448B1 (en) 2005-03-17 2005-03-17 ASSEMBLY COMPRISING A PRINTED CIRCUIT, A POWER COMPONENT AND A RADIATOR

Country Status (1)

Country Link
FR (1) FR2883448B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107484394A (en) * 2017-09-12 2017-12-15 广州市天歌音响设备有限公司 A kind of power amplifier

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3627372C3 (en) * 1986-08-12 1994-04-14 Loewe Opta Gmbh Arrangement consisting of a printed circuit board, a heat sink and electronic components to be cooled
DE58902852D1 (en) * 1988-05-05 1993-01-14 Siemens Nixdorf Inf Syst ARRANGEMENT FOR THE CONVECTIVE COOLING OF ELECTRONIC COMPONENTS, IN PARTICULAR OF INTEGRATED SEMICONDUCTOR CIRCUITS.
WO1991019415A1 (en) * 1990-05-31 1991-12-12 Lee Lawrence Y Heat sink for heat generating components
FR2817445B1 (en) * 2000-11-28 2006-09-01 Sagem DEVICE WITH INTEGRATED POWER CIRCUIT AND ITS USE THEREOF

Also Published As

Publication number Publication date
FR2883448A1 (en) 2006-09-22

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