FR2881251A1 - Radiofrequency identification device, e.g. for passport, has thermoplastic and paper layers laminated onto antenna support, such that antenna and chip are enclosed in thermoplastic material, where support is made of paper material - Google Patents

Abstract

Radiofrequency identification device has an antenna (12) which is screen printed on a fibrous support, and a chip (10) which is connected to connection terminals of the antenna. A thermoplastic layer (22) and a paper layer (24) are laminated onto an antenna support (20), such that the antenna and the chip are enclosed in the thermoplastic material. The support is made of paper material. The layer (22) has a cavity where the chip is placed. Independent claims are also included for: (A) A radiofrequency identification device support including a radiofrequency identification device; (B) An identity booklet including a radiofrequency identification device (C) A method for manufacturing an identity booklet with radiofrequency identification device; and (D) A chip card in which one or both sides are personalized.

Description

2881251 1

  The present invention relates to identity books such as passports and relates in particular to an identity booklet comprising a radiofrequency identification device resistant to wetlands.

  Non-contact radio frequency identification (RFID) devices are increasingly used for the identification of people traveling in areas with controlled access or transit from one area to another. A contactless RFID device is a device consisting of an antenna and a chip connected to the terminals of the antenna. The chip is generally not powered and receives its energy by electromagnetic coupling between the antenna of the reader and the antenna of the RFID device, information is exchanged between the RFID device and the reader and in particular the information stored in the chip which relate to the identification of the owner of the object on which the RFID device is located and its authorization to enter a controlled access zone.

  Thus, passports may incorporate RFID devices for identification of the passport holder. The memory of the chip contains information such as the identity of the passport holder, his country of origin, his nationality, the visas of the various countries visited, the dates of entry, the restrictions of circulation, the biometric elements, etc. . The RFID device is typically incorporated into the lower cover plate of the passport. An antenna is then made by silkscreening ink loaded with silver particles on the lower plate reinforced with the passport cover. The chip is then connected by bonding to the connection terminals of the antenna. Then, the cover page of the pages of the passport is laminated to the back of the reinforced top plate. This embodiment has the disadvantage of not withstanding the water test and in particular the passage of the passport machine washing machine. In fact, if the paper on which the antenna is screen-printed is not water-resistant, the antenna absorbs the water and swells, which causes fractures at the antenna and therefore a rupture. the electrical connection between the antenna and the chip.

  This problem can be overcome by the use of an RFID device consisting of a plastic inlay. In this case, the inlay comprises the RFID device composed of the antenna and the chip, all of which is embedded in plastic layers. The inlay is then postponed by gluing between the cover page and the passport cover. The disadvantage of this type of RFID device is based on the difference in material between the inlay and the passport. The latter being made of plastic, the bonding between the two is not optimum.

  This is why the object of the invention is to provide an identity booklet such as a passport using a radio frequency identification device and in which the mounting of the antenna is made to withstand the humidity and in particular to an accidental passage in washing machine while preserving the advantages of the use of the paper in the realization of the booklet.

  The object of the invention is therefore an identity booklet equipped with a radio frequency identification device (RFID) comprising a screen-printed antenna on a support and a chip connected to the connection terminals of the antenna, the RFID device being integrated in the booklet between a flat cover of the booklet and the front page of the booklet located next to the dish. According to the main characteristic of the invention, a thermoplastic layer and a paper layer are laminated on the antenna support so that the antenna and the chip are trapped in the thermoplastic and in order to make the device resistant to water and wetlands.

  Another object of the invention relates to a method for manufacturing an identity booklet with radio frequency identification device (RFID), the device comprising an antenna and a chip connected to the antenna 2881251 3 integrated between the dish of the cover of the booklet and the cover page, the method comprising the following steps: - screen printing an antenna comprising connection pads on a paper support, deposit adhesive dielectric material between the connection pads of the antenna, - position the chip on the support so that the pads of the chip are facing the connection pads of the antenna, connect the chip on the connection pads of the antenna by exerting pressure on the chip, - deposit on the supporting a layer of thermoplastic and a layer of paper, the thermoplastic layer being provided with a cavity at the location of the chip, - laminating together the support, the layer of thermoplastic and the layer of p apier so as to obtain an RFID device support, - stick on the lower plate of the cover of the identity booklet the support of the RFID device on the side of the antenna support, - set up the notebook of the inner pages, - stick the front of the cover page against the RFID device holder on the paper layer side.

  Finally, a third subject of the invention relates to a method for manufacturing an identity booklet with radio frequency identification device (RFID), the device comprising an antenna and a chip connected to the antenna integrated between the dish of the cover of the booklet and the cover page, the method comprising the following steps: screen printing an antenna comprising connection pads on the plate of the identity booklet, - deposit adhesive dielectric material between the connection pads of the antenna, positioning the chip on the plate so that the pads of the chip are facing the connection pads of the antenna; connecting the chip to the connection pads of the antenna by exerting a pressure on the antenna; chip, - deposit on each of the dishes a layer of thermoplastic, the layer coming above the dish including the antenna and the chip being provided with a cavity at the place of the chip, - deposit on each of the layers of t hermoplastic a layer of paper, - laminate together the cover, the layers of 10 thermoplastic and the layers of paper, - set up the notebook of the inner pages.

  The objects, objects and features of the invention will appear more clearly on reading the following description with reference to the drawings in which: FIG. 1 represents the RFID device, FIG. 2 represents a section of the antenna support on which FIG. 3 represents the various layers constituting the RFID device. FIG. 4 represents a section of the RFID device. FIGS. 5 and 6 represent the implementation of the RFID device in the passport.

  According to a preferred embodiment of the invention illustrated in FIGS. 1 to 6, the manufacture of the identity booklet consists firstly of carrying out the support of the RFID device which will then be integrated in the booklet. With reference to FIG. 1, an antenna support 20 of fibrous material such as paper with a thickness of about 80 m and whose size corresponds to that of a closed passport is used. The antenna 12 constituting an essential element of the support of the RFID device consists of one or more turns of conductive ink screen-printed polymer, loaded with conductive elements such as silver, copper or carbon. Each of the ends of the antenna is connected to one of the two connection pads 17 and 19 of the antenna also screen printed. The turns are connected to each other by an electrical bridge 21, called more commonly cross-over. An insulating strip 23 of dielectric ink is silkscreened between the cross-over and some of the turns of the antenna 12 to allow the crossing of the turns without electrical contact. According to a preferred embodiment, the antenna is screen printed on this material in several steps. The first step is to screen the turns of the antenna 12 and the two connection pads 17 and 19 of the antenna. The second step consists in silk-screening an insulating strip 23 to enable the turns of the antenna 12 to be crossed. The third step consists in silk-screening the electrical bridge 21 making it possible to connect the turn of the antenna 12 located furthest outside the group of turns.

  The next step is to connect the chip to the connection pads of the antenna 12. An adhesive dielectric material is deposited on the antenna support 20, between the two connection pads 17 and 19 of the antenna 12. This adhesive material is deposited before placing the chip on the support, unlike the conventional "Flip Chip" method in which the adhesive is deposited once the chip is connected. This step is therefore much easier to achieve and the yields obtained are much better. The adhesive used is preferably an epoxy resin which crosslinks at 150 ° C. It is also possible to use a cyanoacrylate type glue which polymerizes at room temperature.

  Once the adhesive material has been deposited, the chip 10 is positioned on the antenna support so that the connection pads 17 and 19 of the chip are facing the connection pads of the antenna as shown in section on FIG. FIG. 2. A pressure is then exerted on the chip 10 so that the non-deformable connection pads are inserted into the connection pads 17 and 19 of the antenna 12. Under the pressure exerted, the connection pads of the antenna are then deformed. The antenna support 20 is compressed under the pressure exerted on the chip and can also be deformed. It is then found that the contact surface between the connection pads of the chip and the connection pads of the antenna 12 is maximum, even when the pressure has ceased to be exerted. The connection pads of the chip are preferably of conical shape. Under the effect of the pressure exerted, the adhesive dielectric material spreads and covers the entire surface of the chip between the connection pads and penetrates deep into the antenna support. It then makes it possible to reinforce the mechanical assembly between the chip 10 and the antenna support 20, and by the same token, the electrical contact between the chip and the antenna. The adhesive dielectric material used is preferably fluid and has a high penetrating power. The support then undergoes a passage in an oven in order to crosslink the glue.

  Once the chip 10 is fixed to the support, the following step consists of rolling together the various constituent layers of the RFID device support shown in FIG. 3 and consisting of the antenna support 20, a thermoplastic layer 22 and a layer of paper 24. The first layer 22 of thermoplastic material is disposed on the support. The layer 22 is perforated with a through cavity 26. The thickness of the thermoplastic layer is such that it is greater than the thickness of the chip 10. Preferably, the thermoplastic layer 22 is made of PVC or PETG and has a thickness of 200 m. The cavity 26 is located so that the chip 10 is inside when the sheet 22 is placed on the support 20 and it does not come into contact with the sheet 24 before lamination. The cavity 26 is preferably circular. In practice, for a chip having a thickness of 150 μm and a surface area of 10 mm 2, the thickness of the thermoplastic layer 22 is equal to 200 μm and the diameter of the cavity 26 is equal to 6 mm.

  The lamination step consists in heat-welding the layers 20, 22 and 24 constituting the support of the RFID device. The temperature and the pressure reached are respectively of the order of 160 C and 200 bars. The chip 10 suffers little mechanical stress due to the pressure thanks to the cavity 26 formed in the layer 22. At these temperature and pressure values, the thermoplastic component of the layer 22 softens and becomes fluid while being trapped between the two layers of paper formed by the antenna support 20 and the paper layer 24. During the lamination, the paper antenna support gives the device composed of the antenna 10 and the chip 12 a rigidity and a cohesion which prevents electrical breakage since the paper resists without deforming at the temperatures and pressures of the lamination step. The support of the RFID device 2 thus produced and shown in section in FIG. 4 has a thickness approximately equal to 330 m. The stiffened thermoplastic layer 22 has trapped the reliefs of the antenna support so that the RFID device composed of the antenna 10 and the chip 12 is embedded in the thermoplastic. Indeed, a voluntary decohesion of the various layers 20, 22 and 24 makes it possible to highlight the fact that the antenna and the chip are molded in the thermoplastic. Thus, in a humid medium, it is the thermoplastic layer that gives the RFID device composed of the chip 10 and the antenna 12 a rigidity and a cohesion that prevents electrical breakage.

  It is advantageous to use for the layers 20 and 24 of the paper loaded with synthetic fibers so as to reinforce its internal cohesion. The synthetic fibers used are, for example, nylon fibers in proportions of the order of 10 to 25%. The use of a paper loaded with synthetic fibers prevents it from delaminating in its thickness in a humid atmosphere or after a stay in the water.

  As shown in FIG. 5, the support of the RFID device 2 thus produced is then glued on the side of the antenna support, on the lower plate 14 of the cover of the identity booklet. Bonding is accomplished by pressing with an adhesive which, once dried, becomes insoluble in water.

  The identity booklet 1 schematically represented in FIG. 6 is then completely formed by the setting up of the notebook of the inner pages. the confection method consists of elaborating the notebook of the inner pages by using a secure thread to connect them together. In the manufacture of a traditional passport, the cover sheets are laminated on the cover plates, the cover page 36 being laminated to the upper plate 16 while the lower cover page 34 is laminated to the lower plate 14. The back of the lower cover page 34 of the notebook of the pages of the identity booklet is pasted then pressed against the RFID device 2 stuck on the lower plate of the cover of the booklet, so on the side of the layer of paper 24. The glue used is preferably an adhesive which, once dry becomes insoluble in water.

  In general, the support of the RFID device 2 is glued inside the booklet 1 with the aid of an adhesive which, once dry is insoluble in water and then is integrated between a plate 14 or 16 of the booklet identity 1 and the cover page 34 and 36 located opposite. Preferably, the support of the RFID device and therefore the RFID device is located between the lower plate 14 of the cover of the booklet and the back of the cover page 34. In order to keep the same thickness on the entire cover of the cover booklet, it is also possible to laminate a support without RFID device consisting of a layer of paper, a layer of thermoplastic and a layer of paper of the same thickness as the layers 20, 22 and 24 and to integrate it by gluing between the front of the cover page 36 and the flat 16 of the cover of the booklet while leaving a free band of the cover at the location of the booklet hinge.

  The use of paper in producing the support of the RFID device is an undeniable advantage of the invention. Indeed, the support of the RFID device (commonly called inlay) has paper on both sides, which facilitates its bonding and optimizes its integration on the identity booklet since the collages are made paper against paper. In addition, the use of paper facilitates the lamination operation performed at temperatures of the order of 160 C, since it is stable at these temperatures unlike thermoplastic materials such as PVC or PETG.

  According to a second embodiment not shown in the figures, the lower plate of the cover of the identity booklet can serve as an antenna support. In this case, the antenna is silkscreened directly on the lower plate of the cover of the booklet, the chip is then connected to the connection pads of the antenna and fixed to the support in the same manner as described above on the antenna support 20. The two flats of the cover of the booklet are then covered with a layer of thermoplastic and a layer of paper so as to leave free the location of the hinge of the booklet. At the location of the chip, the thermoplastic layer is pierced with a cavity so that the chip is inside during lamination for the same reasons as those described in the first embodiment.

  The next step is to roll the whole cover, thermoplastic layer, paper layer at a temperature of 160 C and a pressure of about 200 bar. During lamination or later, the outside of the cover of the booklet may be subject to a plate having particular reliefs so as to produce a particular grain on the cover and so as to make the identity booklet unfalsifiable. This embodiment gives the RFID device the same effects as those obtained for the first embodiment.

  The identity booklet obtained has the same advantages as that obtained by the first embodiment, namely it makes it possible to obtain an identity booklet with a RFID device 2881251 which is resistant to damp environments and in particular to a passage through a machine. wash. In addition, it is particularly advantageous to apply this embodiment to passports whose cover is made of reinforced paper. However, this embodiment is also applicable to passports whose cover is fabric.

  The identity booklet according to the two embodiments of the invention has the advantage of being difficult to falsify. Indeed, when the antenna support is paper, acting voluntarily so as to separate the cover page of the cover between which is glued the RFID device, it turns out that it is the antenna support that delaminates in the middle. The antenna molded in the thermoplastic layer remains on the side of the delaminated support portion in contact with the thermoplastic layer while the chip remains on the other side of the delaminated support portion. In this way, the connection between the chip and the antenna is broken and the RFID device is no longer usable. The fact that the chip does not remain connected to the connection pads of the antenna during a deliberate delamination of the passport cover in which the RFID device is inserted is due to the fact that the glue used to stick the chip on the support of The antenna has penetrated deep into the thickness of the support sufficiently deep to exceed the medial surface along which the support delaminates. In this way, the chip is driven on the opposite side of the antenna since the material used in the screen printing of the antenna does not penetrate the support deeply.

  Advantageously, the identity booklet according to the embodiments of the invention may be passed through a washing machine without the electrical connection between the chip and the antenna is altered so keeping the possibility of being read by electromagnetic coupling with a reader provided for this purpose.

Claims (2)

11 CLAIMS   An identity booklet equipped with a radio frequency identification device (RFID) comprising an antenna (12) screen-printed on a support and a chip (10) connected to the connection terminals (17 and 19) of said antenna, said device RFID being integrated in said booklet between a plate (14 or 16) of the cover of the booklet (1) and the cover page (20 or 22) of said booklet located opposite said dish; characterized in that a thermoplastic layer (22) and a paper layer (24) are laminated on the antenna support (20) so that said antenna and said chip are trapped in the thermoplastic and to render the device resistant to water and wet environments.   An identity booklet according to claim 1, wherein said screen-printed antenna (12) is obtained by depositing conductive material such as ink.   Identity booklet according to one of the preceding claims, wherein said chip (10) is glued to said antenna support (20) with the aid of an adhesive dielectric material so that the pads of connection of the chip are facing the connection pads (17 and 19) of the antenna (12).   4. Identity booklet according to one of the preceding claims, wherein said chip (10) is fixed to said antenna support (20) by an adhesive material preferably fluid.   5. Identity booklet according to one of the preceding claims, wherein said adhesive material is an epoxy resin which crosslinks at 150 C.   6. Identity booklet according to one of the preceding claims, wherein the lamination is carried out at temperature and pressure values of the order of 160 C and 200 Bars.   7. Identity booklet according to one of the preceding claims wherein said thermoplastic layer (22) comprises a cavity (26) in which said chip (10) is located.   An identity booklet according to one of claims 1 to 7, wherein said antenna support (20) is the bottom plate of the cover of said booklet.   An identity booklet according to one of claims 1 to 7, wherein said antenna support is a paper layer (20).   Identity booklet according to one of the preceding claims, wherein the paper used for the layers (20 and 24) is filled with synthetic fibers.   11. Identity booklet according to one of the preceding claims, wherein the layers (20), (22) and (24) laminated and thus welded together, constitute a support of the RFID device (2), said device support RFID (2) being stuck inside said identity booklet (1) thanks to an adhesive which, once dry is insoluble in water.   12. A method of manufacturing an identity booklet radio frequency identification device (RFID), said device comprising an antenna and a chip connected to the antenna integrated between the flat cover of the booklet and the cover page, said method comprising the following steps.   - screen printing an antenna (12) having connection pads (17 and 19) on a support (20) made of paper, - depositing adhesive dielectric material between said connection pads of the antenna, - positioning the chip ( 10) on said support so that the pads of said chip are opposite said connection pads of said antenna, - connect the chip to said connection pads of said antenna by exerting a pressure on the chip, - deposit on said supporting a thermoplastic layer (22) and a paper layer (24), the thermoplastic layer (22) being provided with a cavity (26) at the location of the chip (10), - laminating said support together ( 20), the thermoplastic layer (22) and the paper layer (24) so as to obtain an RFID device holder (2), - glue on the lower plate (14) of the cover of the identity booklet on support of the RFID device (2) on the side of the antenna support, - set up the notebook inside pages, - stick the front of the cover page (34) against the RFID device holder (2) on the paper layer side (24).   13. A method of manufacturing an identity booklet radio frequency identification device (RFID), said device comprising an antenna and a chip connected to the antenna integrated between the flat cover of the booklet and the cover page, said method comprising the following steps: - screen printing an antenna (12) having connection pads (17 and 19) on the plate of the identity booklet, - depositing adhesive dielectric material between the connection pads of the antenna, positioning the chip (10) on said plate so that the pads of the chip are opposite said connection pads of the antenna, 2881251 14 - connect the chip on the connection pads of the antenna by exerting pressure on the chip, - depositing on each of said dishes a layer of thermoplastic, the layer coming above said dish 5 comprising the antenna and the chip being provided with a cavity at the location of the chip (10), - deposit on each of said layers of thermoplastic one layer of paper, - laminating together the cover, the layers of 10 thermoplastic and the layers of paper, - set up the notebook of the inner pages.